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| Number | Title | Issue Date |
| 6328636 | Device and method for machining in which cool air cooling is used A cold-gas-blow-cooling type machining apparatus in which a cold gas blow is provided to cool a machining tool and a workpiece while the workpiece is machined by the machining tool. The machining apparatus includes: a rectifying device which rectifies the... | 12/11/2001 |
| 6325709 | Rounded surface for the pad conditioner using high temperature brazing A polishing pad conditioner used in the removal of slurry and semiconductor thin film build-up in the polishing pad in a chemical and mechanical polishing (CMP) process used to planarize a semiconductor wafer surface. The conditioner is pressed against th... | 12/04/2001 |
| 6322434 | Polishing apparatus including attitude controller for dressing apparatus A dressing apparatus dresses the polishing surface of a turntable while controlling the orientation of a dresser body with electromagnetic forces, thereby allowing an increase in the degree of flatness of the polishing surface of the turntable. A polishin... | 11/27/2001 |
| 6322427 | Conditioning fixed abrasive articles The useful lifetime of a fixed abrasive article is extended and wafer-to-wafer uniformity enhanced by preconditioning a fixed abrasive element and/or periodic conditioning after initial wafer polishing. Embodiments include preconditioning by forced remova... | 11/27/2001 |
| 6315651 | Easy on/off cover for a pad conditioning assembly A cover for a pad conditioning assembly for use in a chemical mechanical polishing apparatus and a pad conditioning assembly incorporating such cover are disclosed. The cover may be formed of a body portion with at least two boss sections and at least two... | 11/13/2001 |
| 6312319 | Polishing media magazine for improved polishing A polishing media magazine for improved polishing. The polishing media magazine may include a conditioning element for rapid, uniform conditioning and cleaning of the polishing media. The polishing media magazine may include polishing media having section... | 11/06/2001 |
| 6306022 | Chemical-mechanical polishing device A device for chemical-mechanical polishing. The device can be applied to a chemical polishing table spinning in a fixed direction and a polishing pad above of it. A chemical-mechanical polishing device according to the present invention is at least compri... | 10/23/2001 |
| 6306008 | Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface... | 10/23/2001 |
| 6306019 | Method and apparatus for conditioning a polishing pad A method and apparatus for conditioning a polishing pad is described. The method includes steps of moving a cylindrical roller having an abrasive substance affixed to it against a moving polishing pad. The roller may be actively rotated or reciprocated at... | 10/23/2001 |
| 6306025 | Dressing tool for the surface of an abrasive cloth and its production process Onto the surface of a dressing tool for removing the clogging of an abrasive cloth, diamond grains of plural groups each having a different average particle diameter are subjected to be mixed and then fixed. In this state, the upper end of small diamond g... | 10/23/2001 |
| 6302764 | Process and device for dressing high-speed grinding worms In a first step, the grinding worm profile is dressed according to the requirements of the workpiece that is to be machined. In a second step, the thereby shaped grinding worm, which has been slightly deformed by the effects of the centrifugal force, is m... | 10/16/2001 |
| 6302771 | CMP pad conditioner arrangement and method therefor According to an example embodiment, the present invention comprises a CMP pad conditioner arrangement. An inlet is configured and arranged for receiving treatment elements. A distribution surface is coupled to the inlet and is configured and arranged to d... | 10/16/2001 |
| 6302772 | Apparatus and method for dressing a wafer polishing pad An apparatus for dressing a wafer polishing pad, including a disk-shaped dresser, an arm, and a control unit. The disk-shaped dresser is configured to be pressed against the polishing pad which rotates in a circumferential direction. The dresser is config... | 10/16/2001 |
| 6299511 | Chemical mechanical polishing conditioner A conditioner head uses a fluid purge system to prevent debris from entering openings in the conditioner head and causing deterioration of bearings and other moving components in the conditioner head. The fluid may be a gas, such as nitrogen, or a liquid,... | 10/09/2001 |
| 6293853 | Conditioner apparatus for chemical mechanical polishing In one aspect, an apparatus and a method for use in substrate polishing are described wherein a conditioner head is provided for receiving an end effector for conditioning a polishing pad surface; the conditioner head is supported above the polishing pad ... | 09/25/2001 |
| 6293854 | Dresser for polishing cloth and manufacturing method therefor The present invention provides a dresser for a chemical and mechanical polishing cloth wherein a bonding material for retaining diamond grit is not dissolved and contamination of chemical slurry caused by dissolving of metal or peeling-off of diamond grit... | 09/25/2001 |
| 6290574 | Method and device for centering a dressing tool in the thread of a grinding worm In a first step for the purpose of precentering, the dressing too; (27), without axial movement, is brought into contact with the circumference of the rotating grinding worm (11), and those rotary-angle positions of the grinding worm (11) at which the ove... | 09/18/2001 |
| 6273797 | In-situ automated CMP wedge conditioner An apparatus and method of conditioning a CMP polishing pad to ensure consistent polishing throughout the polishing process. In particular, the apparatus consists of a translatable wedge-shaped conditioning plate, having a three point adjustable contact t... | 08/14/2001 |
| 6273798 | Pre-conditioning polishing pads for chemical-mechanical polishing A preconditioning mechanism for preconditioning a polishing pad is described. The preconditioning mechanism includes an arm capable of being disposed over the polishing pad and a head section located on a distal end of the arm and rotatable about a centra... | 08/14/2001 |
| 6270396 | Conditioning apparatus and conditioning method An apparatus and a method are provided for uniformly conditioning a polishing pad over the entire surface. The conditioning is achieved by contacting the entire polishing surface of the polishing pad with a polishing pad conditioner having a surface area ... | 08/07/2001 |
| 6267647 | Grinding machines and polishing machines A method of grinding the edge of a disc uses a grinding machine having mounted thereon a grooved grinding wheel, in which the groove is formed in situ using a forming wheel also mounted on the grinding machine. After a workpiece has been ground or after a... | 07/31/2001 |
| 6263605 | Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therefor A pad conditioner coupling (58) holds an end effector (57) for abrading a polishing media surface. Pad conditioning planarizes the polishing media surface, removes particulates, and roughens the polishing media surface to promote the transport of polishin... | 07/24/2001 |
| 6257963 | Grinding worm for the continuous generating grinding of gear wheels The grinding tool comprises a grinding worm flange (2) and a grinding worm (9) for the generative grinding of gears, the flange (2) being provided with location surfaces (5, 6) for the non-clearance fixture to a grinding spindle (1). The flange (2) has an... | 07/10/2001 |
| 6254461 | Process of dressing glass disk polishing pads using diamond-coated dressing disks A dressing disk for dressing and reconditioning the polishing pad of a planetary disk polishing machine is fabricated by plating a nickel/diamond matrix layer onto a stainless steel disk wherein the matrix layer thickness is developed or plated to a thick... | 07/03/2001 |
| 6250994 | Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads Apparatuses and methods for planarizing a microelectronic-device substrate assembly on a planarizing pad. In one aspect of the invention, material is removed from the substrate assembly by pressing the substrate assembly against a planarizing surface of a... | 06/26/2001 |
| 6248009 | Apparatus for cleaning substrate The present invention relates to a substrate cleaning apparatus, and more particularly to a substrate cleaning apparatus suitable for cleaning a substrate which requires a high level of cleanliness, such as a semiconductor wafer, a glass substrate, a liqu... | 06/19/2001 |
| 6248003 | Method of truing grinding wheel and device used in performing such method A method of truing a grinding wheel includes the steps of providing a material containing a metallic material selected from the group consisting of metals in groups IVA, VA and VIA of the periodic table and alloys thereof, rotating a grinding wheel having... | 06/19/2001 |
| 6244939 | Micro-discharge truing device and fine machining method using the device There are provided an electrically conductive grindstone 12 for machining a workpiece 1, a disc-shaped discharge electrode 14 having an outer peripheral edge 14a which can be disposed in the vicinity of a machining surface 12a of the grindstone, an electr... | 06/12/2001 |
| 6244944 | Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates A method and apparatus for supporting, cleaning and/or drying a polishing pad used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a cleaning head positioned adjacent a post-operative portion of the polishing pad ... | 06/12/2001 |
| 6234868 | Apparatus and method for conditioning a polishing pad An apparatus and method for conditioning a polishing pad used in a chemical mechanical polishing (CMP) process. The polishing pad is conditioned by the application of a conditioning device to the surface of the rotating polishing pad. The amount of force ... | 05/22/2001 |
| 6234880 | Device and method for profiling grinding worms A radius-forming dressing roll (32) having a frustoconical working region (48) and an adjoining concave-toroidal working region (49) is mounted on the dressing spindle (30) coaxially to a dressing disc (31). In a first step, the flanks (42, 43) of the gri... | 05/22/2001 |
| 6234883 | Method and apparatus for concurrent pad conditioning and wafer buff in chemical mechanical polishing Provided are an apparatus and method for concurrently pad conditioning and wafer buffing on a single station of a CMP apparatus. In a preferred embodiment, the apparatus includes a two-sided conditioning/buffing device having a pad conditioner on one side... | 05/22/2001 |
| 6231425 | Polishing apparatus and method A polishing apparatus and method capable of polishing stably regardless of variation between polishing objects, change of a polishing means with lapse of time etc. The apparatus includes polishing pad 1, polishing table 3 with the polishing pad 1 adhered ... | 05/15/2001 |
| 6227954 | Polishing apparatus A polishing apparatus includes a top ring for holding a workpiece to be polished on a lower surface thereof, a turntable having a polishing surface for polishing a surface of the workpiece held by the top ring, and a dressing tool for dressing the polishi... | 05/08/2001 |
| 6227948 | Polishing pad reconditioning via polishing pad material as conditioner A method of reconditioning a polishing pad using a chemical-mechanical polishing apparatus is disclosed, wherein the polishing pad contacts a workpiece in the presence of a slurry to perform chemical-mechanical polishing on the workpiece. The method compr... | 05/08/2001 |
| 6227947 | Apparatus and method for chemical mechanical polishing metal on a semiconductor wafer An apparatus and a method for chemical mechanical polishing a metal on a semiconductor wafer capable of achieving improved pad life are disclosed. In the apparatus, in addition to a first spray nozzle used for spraying a slurry solution onto the top of a ... | 05/08/2001 |
| 6227956 | Pad quick release device for chemical mechanical polishing A chemical-mechanical polishing apparatus (100, 200) comprising a polishing pad assembly. The polishing pad assembly (300) comprises a removable cap (318) to be rotatably coupled to a drive device of a chemical mechanical polishing apparatus and a polishi... | 05/08/2001 |
| 6224470 | Pad cleaning brush for chemical mechanical polishing apparatus and method of making the same A pad cleaning brush and method for making the same is used in conjunction with spray rinse water to thoroughly clean a polishing pad of a chemical-mechanical polishing apparatus after a wafer has been polished. The bristles of the brush are securely reta... | 05/01/2001 |
| 6224469 | Combined cutting and grinding tool A tool is constructed by a plurality of diamond columns 22 arranged so as to protrude from a working surface and a conductive bond member 24 for integrally fixing the diamond columns. The conductive bond member is electrolytically dressed while a conducti... | 05/01/2001 |
| 6224462 | Grinding machine A grinding machine includes a main spindle on which a grinding wheel is mounted, a spindle head movable relative to a workpiece, a dressing device body provided to be movable relative to the spindle head and a dresser supporting member provided to be mova... | 05/01/2001 |
