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| Number | Title | Issue Date |
| 8177603 | Polishing pad composition Polishing pads for use in chemical mechanical planarization (CMP) or polishing elements/surfaces of such pads are made from a combination of immiscible polymers, for example polyurethane and polyolefin. The polymers are selected on the basis of interfacial interacti... | 05/15/2012 |
| 8172646 | Magnetically actuated chuck for edge bevel removal Provided are magnetically actuated wafer chucks that permit a wafer to be clamped or unclamped at any time during a process and at any rotational speed, as desired. Such wafer chucks may include constraining members that are movable between open and closed positions... | 05/08/2012 |
| 8167686 | Portable optical fiber polisher A polisher has an offset axis and a friction cam useful in a method of polishing that comprises a more random, elongated polishing pattern than known orbital polishers and is capable of portable use using a 9 volt battery. The method is capable of using lower contac... | 05/01/2012 |
| 8162725 | Abrasive, method of polishing target member and process for producing semiconductor device To polish polishing target surfaces of SiO2 insulating films or the like at a high rate without scratching the surface, the present invention provides an abrasive comprising a slurry comprising a medium and dispersed therein at least one of i) cerium oxid... | 04/24/2012 |
| 8152599 | Method and tool for maintenance of hard surfaces, and a method for manufacturing such a tool A method is disclosed for maintaining a hard surface, the method comprising treating the surface with a flexible pad (1), in the presence of abrasive particles, bonded to the pad, on a contact surface between the pad (1) and the hard surface. The abras... | 04/10/2012 |
| 8147295 | Method of polishing silicon wafer A silicon wafer is polished by applying a polishing solution substantially containing no abrasive grain onto a surface of a polishing pad having a given fixed grain bonded abrasive and then relatively sliding the polishing pad to a silicon wafer to polish the surfac... | 04/03/2012 |
| 8147294 | Capillary, capillary polishing method, and capillary polishing apparatus A tip of a capillary used for microinjection is polished on a plurality of sides by using a polishing plate having a surface roughened by dry etching. A first side of the tip is placed on the polishing plate at a predetermined angle and with a predetermined amount o... | 04/03/2012 |
| 8137157 | Lapping carrier and method Provided is a double-sided lapping carrier comprising a base carrier having a first major surface, a second major surface and at least one aperture for holding a workpiece, said aperture extending from the first major surface through the base carrier to the second m... | 03/20/2012 |
| 8137159 | Abrasive, method of polishing target member and process for producing semiconductor device To polish polishing target surfaces of SiO2 insulating films or the like at a high rate without scratching the surface, the present invention provides an abrasive comprising a slurry comprising a medium and dispersed therein at least one of i) cerium oxid... | 03/20/2012 |
| 8137158 | Electrical contact method An electrical contact method. An axle having an axis of rotation is provided. Cantilever arms are provided. Each cantilever arm has a first end and a second opposing end. The first end is connected to the axle. Each cantilever arm extends radially outward from the a... | 03/20/2012 |
| 8128461 | Chemical mechanical polishing with multi-zone slurry delivery Chemical-mechanical polishing or planarization (CMP) is enhanced with multi-zone slurry delivery. A polishing pad is provided that contacts with the work piece, and a multi-zone platen is displaced proximate to the polishing pad to facilitate slurry delivery. The pl... | 03/06/2012 |
| 8118644 | Chemical mechanical polishing pad having integral identification feature Chemical mechanical polishing pads having a polishing layer with a polishing surface adapted for polishing a substrate are provided, wherein the polishing layer has a unique integral identification feature; wherein the unique integral identification feature is non-p... | 02/21/2012 |
| 8118646 | Carrier for double-side polishing apparatus, double-side polishing apparatus using the same, and double-side polishing method A carrier for a double-side polishing apparatus, including at least: a carrier base placed between upper and lower turn tables, the carrier base having a holding hole therein, the holding hole holds the wafer sandwiched between the upper and lower turn tables. A rin... | 02/21/2012 |
| 8118645 | Polishing method, polishing pad, and polishing system A polishing method, a polishing pad, and a polishing system are described. The polishing pad with a plurality of grooves is provided. The width of each groove is W and the pitch between two adjacent grooves is P. An oscillatory movement distance of a workpiece on th... | 02/21/2012 |
| 8113914 | Treating method for brittle member An object of the present invention is to provide a treating method for brittle member capable of stably holding the brittle member when applying predetermined treatments such as transportation and grinding back surface of a brittle member such as a semi-conductor wa... | 02/14/2012 |
| 8092277 | Method of grinding semiconductor wafers, grinding surface plate, and grinding device A method of grinding semiconductor wafers including simultaneously grinding both surfaces of multiple semiconductor wafers by rotating the wafers between a pair of upper and lower rotating surface plates in a state where the wafers are held on a carrier so that cent... | 01/10/2012 |
| 8079893 | Method of remedying glass substrate defect A technology for remedying a defect in a glass substrate which constitutes a display panel. There is provided a method of remedying a defect in a glass substrate which constitutes a display panel, which method includes performing grinding of glass material, until re... | 12/20/2011 |
| 8062096 | Use of CMP for aluminum mirror and solar cell fabrication The invention is directed to a method of polishing a surface of a substrate comprising aluminum, comprising contacting a surface of the substrate with a polishing pad and a polishing composition comprising an abrasive, an agent that oxidizes aluminum, and a liquid c... | 11/22/2011 |
| 8057282 | High-rate polishing method The invention provides a method for polishing at least one of a magnetic, optical and semiconductor substrate in the presence of a polishing medium with a polishing pad. The substrate is fixed within a carrier fixture having a channel-free surface. The method compri... | 11/15/2011 |
| 8047899 | Pad and method for chemical mechanical polishing A method for chemical-mechanical polishing two adjacent structures of a semiconductor device is provided. The method for mechanical polishing comprising: (a) providing a semiconductor device comprising a recess formed in a surface thereof, a first layer formed over ... | 11/01/2011 |
| 8047898 | Grinder wheel for liquid crystal display device and method of fabricating liquid crystal display device using the same A grinder wheel for a liquid crystal display device and a method of fabricating a liquid crystal display device using the same are provided. Two grinding surfaces are formed in the grinder wheel used for grinding a substrate so that it is possible to improve grindin... | 11/01/2011 |
| 8043140 | Wafer polishing apparatus and wafer polishing method A wafer polishing in which a polishing liquid is supplied to a polishing pad for polishing a wafer carried on a carrier head; and the polishing liquid is supplied from one or more polishing liquid supplying devices onto the polishing pad, by a polishing liquid suppl... | 10/25/2011 |
| 8029337 | Methods and systems for marring fiber optic substrates Methods and systems for marring fiber optic substrates may include rollers with abrasive surfaces that press lengths of the substrates against elongated supports, which may be tapered, during relative lengthwise movement between the rollers and supports; abrasive sh... | 10/04/2011 |
| 8029336 | Glass grinding system and method A glass grinding method starts with an assessment of the scratch or surface defect to be removed. A series of abrasive pads with different diameters and different grits from 60, 120, 180, 220, and 400 grit are selected according to the depth of the scratches or defe... | 10/04/2011 |
| 8021211 | Substrate holder with liquid supporting surface Embodiments of the present invention generally relate to a substrate transferring system. One embodiment of the present invention provides a substrate holder comprising a pedestal plate, a basin wall extending from a top surface of the pedestal plate, wherein the ba... | 09/20/2011 |
| 8016643 | Wafer grinding method A method of grinding the rear surface of a wafer having a plurality of dividing lines which are formed in a lattice pattern on the front surface and devices which are formed in a plurality of areas sectioned by the plurality of dividing lines, comprising a protectiv... | 09/13/2011 |
| 8002609 | Method of manufacturing ferrule assemblies A method of manufacturing a ferrule assembly. The method including first and second polishing operations. The first polishing operation including polishing only the end face of a ferrule of an assembly. The second polishing operation including polishing only the opt... | 08/23/2011 |
| 7997956 | Quartz glass tool for heat treatment of silicon wafer and process for producing the same To provide a quartz glass tool, for silicon wafer heat treatment, having a transparent grooving face, which is free from the deposition of particles of a transition metal element foreign material derived from glass dust or diamond blade produced by breakdown of acut... | 08/16/2011 |
| 7988535 | Platen exhaust for chemical mechanical polishing system The present invention generally relates to a substrate transferring system. Particularly, the present invention relates to apparatus and method to effectively remove the chemical fume, vapor and other byproducts generated during a polishing process. One embodiment o... | 08/02/2011 |
| 7988534 | Optical polishing pitch formulations Optical polishing pitch formulations include synthetic polymers or other synthetic resins. As alternatives to traditional optical pitches, these materials offer improved stability in use, storage, and processing. In addition, these pitch compositions may be masterba... | 08/02/2011 |
| 7967663 | Process of forming a deflection mirror in a light waveguide A process of forming a deflection mirror in a light waveguide with a use of a dicing blade having a cutting end with a flat top cutting face and at least one slanted side cutting face. The process includes a cutting step of cutting a surface of the light waveguide t... | 06/28/2011 |
| 7955160 | Glass mold polishing method and structure A glass mold polishing structure and method. The method includes providing a polishing tool comprising mounting plate, a chuck plate over and mechanically attached to the mounting plate, and a pad structure over and mechanically attached to the chuck plate. A retain... | 06/07/2011 |
| 7927187 | Method of polishing a target surface A circular polishing pad has grooves formed on the surface in a spiral pattern with its center point offset from the center of the pad. The spiral pattern is an Archimedean spiral pattern or a parabolic spiral pattern. A target object is polished by using such a pol... | 04/19/2011 |
| 7918714 | Methods for treating wafers on assembly carriers A method and a device for treating wafers on assembly carriers is disclosed. A wafer to be treated can be fixed on a liquid film that is located between the front side of the wafer and the assembly carrier by freezing of the film. ... | 04/05/2011 |
| 7909677 | Method of transferring a wafer A method of transferring a wafer is disclosed. The method comprises providing a pedestal and at least one spray orifice extending through the pedestal; disposing a wafer above the pedestal using a first robot, wherein the wafer has a first surface and a second surfa... | 03/22/2011 |
| 7909678 | Method for manufacturing silicone wafers A method of manufacturing silicon wafers that include a front surface and a block surface and lateral edges, includes forming a silicon wafer by separating a rectangular, in particular, silicon block with lateral surfaces and before separation, grounding and/or poli... | 03/22/2011 |
| 7892072 | Method for directional grinding on backside of a semiconductor wafer A backside grinding apparatus removes semiconductor material from a surface of a semiconductor wafer. The wafer is mounted to a backing plate. The backside surface undergoes a first grinding operation in a rotational motion to remove excess semiconductor material. T... | 02/22/2011 |
| 7883395 | Electrical contact structures and methods for use Methods and structures. A planarization method includes: providing a contact structure, where the contact structure includes an axle configured to rotate about an axis of rotation, a plurality of cantilever arms, each arm having a first end connected to the axle, wh... | 02/08/2011 |
| 7871309 | Polishing pad It is an object of the invention to provide a polishing pad capable of high precision optical detection of an endpoint during polishing in progress and prevention of slurry leakage from between a polishing region and a light-transmitting region during the use thereo... | 01/18/2011 |
| 7857680 | Method for producing glass substrate for magnetic disk, and magnetic disk A method for producing a glass substrate for a magnetic disk by polishing a circular glass plate, which comprises a step of polishing the principal plane of the circular glass plate by using a slurry containing a CeO2 crystal powder, the CeO2 c... | 12/28/2010 |
