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| Number | Title | Issue Date |
| 7708623 | Cylindrical grinding method for producing hard metal tools and cylindrical grinding machine for grinding cylindrical starting bodies during the production of hard metal tools A grinding method and to a cylindrical grinding machine grinds metal rod that is pushed through a chuck of a workpiece spindle head. Two backrest seats are ground on and two backrests are then seated. The support of an end area enables a front cone to be ground. A g... | 05/04/2010 |
| 7303466 | Carrier head of chemical mechanical polishing apparatus having barriers dividing pressure chamber into a plurality of pressure zones A carrier head of a chemical mechanical polishing apparatus has a support, an elastic membrane secured to the support and spaced from the bottom surface of the support so that a pressure chamber is defined between the membrane and the bottom surface of the support; ... | 12/04/2007 |
| 7220173 | Wafer holder and wafer conveyor system equipped with the same The present invention is directed to a wafer holder and a related wafer conveyor system. The wafer holder holds a wafer and moves horizontally within a chamber. A contact area between the wafer and the wafer holder is reduced, and potential contaminants generated by... | 05/22/2007 |
| 7210990 | Treatment apparatus for treating workpieces or groups of workpieces In order to provide a treatment apparatus for treating workpieces or groups of workpieces that are conveyed from an inlet to an outlet of the treatment apparatus, wherein the treatment apparatus comprises a plurality of treatment levels and with said treatment appar... | 05/01/2007 |
| 7196009 | Lapping carrier, apparatus for lapping a wafer and method of fabricating a lapping carrier A method of fabricating a lapping carrier is provided that includes the steps of defining at least one opening extending through a workpiece that is sized to receive a wafer, and cryogenically tempering the workpiece to produce a lapping carrier. By cryogenically te... | 03/27/2007 |
| 7175514 | Polishing fixture assembly for a fiber optic cable connector polishing apparatus An apparatus that mass polishes a variety of fiber optic cable connectors simultaneously. The apparatus includes a plurality of polishing plates, each capable of holding its own polishing film and pad, and having a varying height. The apparatus further includes a pl... | 02/13/2007 |
| 7101271 | Polishing head and chemical mechanical polishing apparatus An apparatus for polishing chemically and mechanically a wafer includes a membrane supporter and a membrane. The membrane has a pressure portion that is divided into a plurality of regions, and a partition portion extending from the border between the plurality regi... | 09/05/2006 |
| 7074118 | Polishing carrier head with a modified pressure profile A polishing carrier head including a retaining ring for defining an area of a polishing pocket region used to polish a predetermined object, is provided. The polishing carrier head may further include a perforated plate positioned lateral to the retaining ring, the ... | 07/11/2006 |
| 7063604 | Independent edge control for CMP carriers A wafer carrier for controlling the edge effect during chemical mechanical planarization. A first bladder is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. A second bladder is dispo... | 06/20/2006 |
| 7048621 | Retaining ring deflection control A carrier bead for chemical mechanical polishing of a substrate. The carrier head includes a carrier base, a retaining ring, and a junction connecting the carrier base to the retaining ring. The junction is configured such that vertical movement of the retaining rin... | 05/23/2006 |
| 7040971 | Carrier head with a flexible membrane A carrier head for a chemical mechanical polishing apparatus is described. The carrier head has a base, a rigid body, a membrane and a pressurizing structure. The rigid body is movable relative to the base and includes a downwardly-extending projection. The membrane... | 05/09/2006 |
| 7008310 | Wafer carrier wear indicator A wafer carrier for use in polishing disks. The wafer carrier includes a main body and an integral visual inspection wear indicator. The main body has at least one opening formed therein adapted to receive a disk. The visual inspection wear indicator provides a visu... | 03/07/2006 |
| 7008309 | Back pressure control system for CMP and wafer polishing A wafer carrier with a back pressure applicator system adapted to provide high resolution back pressure control. A plurality of millimeter scale distensible elements are disposed between the wafer carrier pressure plate and a process wafer, and selectively distended... | 03/07/2006 |
| 6910949 | Spherical cap-shaped polishing head in a chemical mechanical polishing apparatus for semiconductor wafers A polishing head for use in an apparatus for chemically-mechanically polishing semiconductor wafers is provided. The polishing head includes a first side having at least a portion thereof operably connectable with a spindle on the apparatus; and a second side opposi... | 06/28/2005 |
| 6884154 | Method for apparatus for polishing outer peripheral chamfered part of wafer In a process for polishing the chamfered peripheral part of a wafer using a polishing cloth while supplying a polishing slurry in order to improve productivity of the process by reducing a polishing time, at least two steps of polishing processes are performed in se... | 04/26/2005 |
| 6827638 | Polishing device and method There are provided a polishing apparatus and a polishing method capable of performing polishing a work (such as a wafer) with high efficiency and high precision, a novel work holding plate effectively holding a work and an adhering method for a work capable of adher... | 12/07/2004 |
| 6824456 | Configuration for polishing disk-shaped objects A polish head for Chemical Mechanical Polishing includes a backing film of silicone on a rigid support element, preferably, of amorphous ceramic. The silicone backing film is fabricated by molding, thereby enabling an appropriate cross-sectional shape for specific p... | 11/30/2004 |
| 6746318 | Workpiece carrier with adjustable pressure zones and barriers A carrier with adjustable pressure zones and adjustable barriers between zones for distributing the pressure on the backside of a wafer. The pressure zones may be created using an elastic web diaphragm. One or more grooves are formed in the surface of the diaphragm ... | 06/08/2004 |
| 6645049 | Polishing holder for silicon wafers and method of use thereof An method and apparatus for forming wafers of varying thickness'. The apparatus includes a template. The template is formed of a main disk including a plurality of cavities extending into a first side thereof. Each cavity has notches cut in the walls ther... | 11/11/2003 |
| 6612905 | Silicon wafer polishing holder and method of use thereof A method and apparatus for forming wafers of varying thickness'. The apparatus includes a template. The template is formed of a main disk including a plurality of cavities extending into a first side thereof and a backing plate positioned on a side of the... | 09/02/2003 |
| 6524174 | Clamp for connecting/disconnecting a rotary head to/from a spindle in apparatus for manufacturing a semiconductor device An apparatus for manufacturing a semiconductor device includes a rotatable spindle, a head detachably connected to the spindle, and a clamp for clamping outer circumferential surfaces of the spindle and the head to one another so that the head may be driv... | 02/25/2003 |
| 6517421 | Polishing head of a chemical and mechanical polishing apparatus for polishing a wafer A polishing head of a chemical and mechanical polishing apparatus can uniformly polishing a wafer by sticking the wafer firmly and with uniform pressure to a polishing pad. The polishing head includes a housing through which air is supplied and discharged... | 02/11/2003 |
| 6375542 | Hydrostatic spindle unit with automatic self centering of the workpiece The present invention relates to an improved spindle unit. The spindle unit includes a body, an external shaft placed into the body and rotating on bearings relative to the body, and an internal shaft placed into the external shaft and coupled thereto. Th... | 04/23/2002 |
| 6287183 | Vacuum-hydrostatic shoe for centerless grinding A vacuum-hydrostatic shoe especially suited for supporting a workpiece in metalworking operations is disclosed. The vacuum-hydrostatic shoe is comprised of a body with a support surface confronting the workpiece. Preferably the support surface is shaped t... | 09/11/2001 |
| 6257972 | Steady rest having linear sliding clamping bars This invention is related to a steady rest, which employs a pair of parallel, sliding, linear moving clamping bars for moving wear pads or rollers toward a workpiece.... | 07/10/2001 |
| 6120360 | Apparatus for processing a planar structure A method and apparatus are provided for handling planar structures, such as semiconductor wafers, with reduced breakage and cracking. The method includes the step of segmenting a wafer prior to grinding. The apparatus includes a segmented vacuum table for... | 09/19/2000 |
| 6083092 | Multi-piece lathe chuck for silicon ingots Improved chucks for supporting elongate objects having conical end portions, such as single crystal ingots of semiconductor material, while such objects are held and rotated, as in a lathe. A base portion of the chuck includes bores to accept fasteners to... | 07/04/2000 |
| 6030280 | Apparatus for holding workpieces during lapping, honing, and polishing The present invention relates generally to a device used to process workpieces. In particular, the invention relates to a carrier that is used to support a workpiece during workpiece honing, grinding, or polishing. The carrier includes a rigid core coated... | 02/29/2000 |
| 6010392 | Die thinning apparatus A fixture for holding a semiconductor die against an abrasive media for the purpose of thinning the die is described. The fixture provides means for aligning the back of the die to a reference plane that is coplanar with the plane of the abrasive and is i... | 01/04/2000 |
| 5797605 | Workholding apparatus Workholding apparatus for mounting a workpiece (6) on a machine tool, the apparatus comprising a diaphragm chuck portion (2) and a tailstock portion (4). The chuck (2) includes a backing ring (70) with face portion (74) attached to the diaphragm (44) with... | 08/25/1998 |
| 5664993 | Air bearing for a spin index fixture A spin index fixture has a housing which is provided with an air inlet shaft for permitting pressurized air to enter the housing and to propagate through grooves disposed along the outer surface of the sleeve. The air then enters into a clearance volume b... | 09/09/1997 |
| 5361548 | Multi-station abrading apparatus An apparatus for abrading articles. The abrading apparatus includes a number of abrading stations located adjacent to one another so that as an article is abraded at one station, a previously abraded article will be redundantly abraded at the adjacent sta... | 11/08/1994 |
| 5349787 | Disposable lap blank A lap blank and holder assembly includes a lap blank having two spaced apart flat surfaces separated by a given thickness and formed from a material capable of compressing about a member inserted into it. The holder has a projection extending outwardly fr... | 09/27/1994 |
| 5307595 | Method of sharpening tweezers Tweezers have two arms mounted on a spacer with a barbed tip at the other end of the arms. The tweezers are sharpened to the barbed tip with a belt sanding apparatus, which includes a holding device for positioning the tweezers on the belt sanding apparat... | 05/03/1994 |
| 5218788 | Valve stem polishing method and apparatus An apparatus and method for polishing combustion engine valves. The machine includes a rotating deburring wheel for on contact with the valve stem and a regulating surface which provides support and applies a rotational force to the valve stem. A pair of ... | 06/15/1993 |
| 5197271 | Method and apparatus for back side damage of silicon wafers A method of backside damaging a silicon semiconductor wafer by abrading the wafer in an abrasive powder is disclosed. The wafer is rotated or translated in the powder while the powder is being vibrated. A fixture holds one or more semiconductor wafers dur... | 03/30/1993 |
| 5083403 | Workpiece supporting fixture for use with an abrasion tool to form circular workpieces A workpiece supporting fixture pivotally mounted on the table of an abrasion tool enabling the manual shifting of the peripheral edge of the workpiece toward the powered abrasive element of the abrasion tool and the manual rotation of the workpiece with r... | 01/28/1992 |
| 4831782 | Apparatus for grinding a workpiece An improved grinding apparatus includes a base (100) upon which a headstock (20) is mounted. A carriage (500) is movable along ways (101, 102) disposed on the base. A wheel slide (63) on the carriage rotatably support a grinding wheel (71). A first mounti... | 05/23/1989 |
| 4662125 | Centrifugal blasting machine having a rotatable workpiece holder A holding device for workpieces, which is rotatably mounted in the side-walls of a centrifugal blasting machine, including a support member and holding member. Both members are pivotably mounted diametrically opposed with respect to the axis of rotation. ... | 05/05/1987 |
| 4581854 | Valve grinding apparatus Apparatus for grinding a valve seat of an internal combustion engine using a conventional handheld power drill. A tubular housing provides a shoulder for aligning the tool with the valve and seat during operation. An inner member is concentrically dispose... | 04/15/1986 |
