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Class 451/397 - Work rotating


Subclass of Class 451 - Abrading
Definition: Work holder in which the work is guided in rotation during
No. of patents: 169
Last issue date: 09/02/2008


1          
NumberTitleIssue Date
7419420Substrate holding mechanism, substrate polishing apparatus and substrate polishing method
A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the...
09/02/2008
7347767Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces
Retaining rings and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces are disclosed herein. A carrier head configured in accordance with one embodiment of the invention can be used to retain a micro-device workpiece duri...
03/25/2008
7303466Carrier head of chemical mechanical polishing apparatus having barriers dividing pressure chamber into a plurality of pressure zones
A carrier head of a chemical mechanical polishing apparatus has a support, an elastic membrane secured to the support and spaced from the bottom surface of the support so that a pressure chamber is defined between the membrane and the bottom surface of the support; ...
12/04/2007
7273436Planetary-roller-type continuously variable transmission
Fine adjustment of the rotation speed ratio or intentional control of the rotation speed ratio is carried out, centered on a desired speed ratio, including 1:1, for the rotation speed ratio between an input shaft and an output shaft. A planetary-roller speed-increas...
09/25/2007
7258594Method and device for centerless cylindrical grinding
During centerless cylindrical grinding, attention must be paid to the fact that the workpiece (3) is placed in a very specific position between the grinding wheel (1), the regulating wheel (2) and the support guide (4). The optimal positi...
08/21/2007
7220173Wafer holder and wafer conveyor system equipped with the same
The present invention is directed to a wafer holder and a related wafer conveyor system. The wafer holder holds a wafer and moves horizontally within a chamber. A contact area between the wafer and the wafer holder is reduced, and potential contaminants generated by...
05/22/2007
7220167Gentle chemical mechanical polishing (CMP) liftoff process
A method for chemical mechanical polishing (CMP) wafers having high aspect ratio surface topography. A wafer is positioned on a plate. A polishing pad is coupled to a platen. A polishing solution (e.g., slurry) is added between the polishing pad and the wafer. CMP i...
05/22/2007
7217175Polishing apparatus and polishing method
A polishing apparatus comprises a first polishing table having a first polishing surface, a substrate carrier for holding a substrate and positioning the substrate so as to bring a surface of the substrate into contact with the first polishing surface, a pressing me...
05/15/2007
7189153Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces
Retaining rings, planarizing apparatuses including retaining rings, and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, a carrier head for retaining a micro-device workpiece during m...
03/13/2007
7182676Machining apparatus and machining method of work end face, roller and roller bearing
A machining apparatus 10 of an end face of a roller includes a rotatable inner disk 11, a cage 14 having a pocket portion 13 for holding a plurality of rollers 12 at predetermined intervals in a peripheral direction at an outer dia...
02/27/2007
7175511Method of manufacturing substrate for magnetic disk, apparatus for manufacturing substrate for magnetic disk, and method of manufacturing magnetic disk
A magnetic polishing method capable of easily and satisfactorily polishing the inner peripheral end face of a circular hole (1) at the center part of a disk substrate (2) even if the diameter of the circular hole is reduced. By this method, a large qua...
02/13/2007
7175514Polishing fixture assembly for a fiber optic cable connector polishing apparatus
An apparatus that mass polishes a variety of fiber optic cable connectors simultaneously. The apparatus includes a plurality of polishing plates, each capable of holding its own polishing film and pad, and having a varying height. The apparatus further includes a pl...
02/13/2007
7169022Method and apparatus for creating a groove in a collector ring of an electrical device
A method and apparatus for creating a groove in the surface of a collector ring for use in an electrical device. The method and apparatus can be used to create a new groove in the surface of a collector ring having none, or can be used to enhance or re-form an exist...
01/30/2007
7160493Retaining ring for use on a carrier of a polishing apparatus
The invention provides a unitary retaining ring for use in a CMP apparatus. The retaining ring features a pad engaging surface which is designed to be flat and planar when the retaining ring is mounted to a carrier of the CMP apparatus. The pad engaging surface incl...
01/09/2007
7150674Both-side grinding method and both-side grinding machine for thin disc work
Detecting the deviation of the grinding wheel position from the amount of work deformation after grinding, and correctly adjusting the grinding wheel position, it provides both-side grinding techniques for making the work excellent in flatness and parallelism. When ...
12/19/2006
7147543Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces
Carrier assemblies, planarizing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, the carrier assembly includes a head having a chamber, a magneti...
12/12/2006
7144308Apparatus for chemical mechanical polishing
Apparatus for chemical mechanical polishing are disclosed. A disclosed apparatus includes a polishing station having a polishing pad, a gas supplier to generate pressurized gas to press a wafer toward the polishing pad, and a polishing head assembly including a plan...
12/05/2006
7140409Portable pipe cutting apparatus
A complete and portable tool for retaining round, square or other non-flat stock, especially pipes, in a secure fashion while cutting and related operations are performed thereon. The portable pipe cutting tool includes an adjustable work support, V-shaped trough, c...
11/28/2006
7140949Tool and process for chrome plating a vehicle wheel surface
A cutting tool having a crystalline tip is pressed with a uniform pressure against the outboard surface of a vehicle wheel as the wheel is rotated. The smoothed wheel surface is then chrome plated to provide a cosmetic finish to the wheel face. ...
11/28/2006
7121927Retaining ring structure for edge control during chemical-mechanical polishing
An improved design for a retaining ring for a chemical mechanical poling machine is described which provides superior flexibility and instantaneous in-situ control of the polishing rate in the edge region of a wafer. The design has a plurality of straight slurry del...
10/17/2006
7108591Compliant wafer chuck
A semiconductor substrate support is provided. The semiconductor substrate support includes a chuck configured to change between a compliant state and a rigid state. An electromagnetic field source configured to apply an electromagnetic field to the chuck is include...
09/19/2006
7103950Pipe beveling tool and method
A tool assembly which is adapted to perform a cutting operation and also a beveling operation on a pipe. There is a rotary power saw which has rotary drive member to which a saw blade can be mounted. There is a bevel section having a mounting member that connects to...
09/12/2006
7101261Fluid-pressure regulated wafer polishing head
A wafer polishing head utilizes a wafer backing member having a wafer facing pocket which is sealed against the wafer and is pressurized with air or other fluid to provide a uniform force distribution pattern across the width of the wafer inside an edge seal feature...
09/05/2006
7101271Polishing head and chemical mechanical polishing apparatus
An apparatus for polishing chemically and mechanically a wafer includes a membrane supporter and a membrane. The membrane has a pressure portion that is divided into a plurality of regions, and a partition portion extending from the border between the plurality regi...
09/05/2006
7094133Retainer and wafer polishing apparatus
When a wafer is pressed on a rotating polishing pad and its surface is polished, a retainer retains the periphery of the wafer to prevent the wafer from being detached from the polishing pad. The retainer includes a first ring which surrounds the wafer and contacts ...
08/22/2006
7086939Chemical mechanical polishing retaining ring with integral polymer backing
In one embodiment, the disclosure is directed to a chemical mechanical polishing retaining ring. The chemical mechanical polishing retaining ring includes a support formed of a first material comprising a first polymer and a wear portion formed of a second material ...
08/08/2006
7074114Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces
Carrier assemblies, polishing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical polishing of micro-device workpieces are disclosed herein. In one embodiment, a carrier assembly includes a head having a chamber, a magnetic field ...
07/11/2006
7066785Polishing apparatus and related polishing methods
Polishing apparatus and related methods employ aligned first and second magnetic field sources to adjust the compressive force and/or pressure applied by a carrier head against a target workpiece (such as a wafer) by selectively and controllably generating a repella...
06/27/2006
7063607Bowling ball resurfacing apparatus
A bowling ball resurfacing apparatus comprises a housing, first and second vertical support rollers mounted to the housing for rotation about parallel vertical axes, each of the vertical support rollers adapted to make contact with the surface of the bowling ball at...
06/20/2006
7056196Wafer polisher
A wafer polisher, wherein a retainer ring (28) is installed in a wafer holding head (14), a protective sheet material (52) is disposed inside the retainer ring (28), and a wafer (W) is pressed against a polishing pad (20) through t...
06/06/2006
7056198Dust containment device for surfacing machines
A floor machine comprising a motor, a body, and a dust collection system. The dust collection system comprises a skirt, which is coupled to the floor machine and forms a cavity over the body and a floor treatment pad. The skirt includes an air channel device secured...
06/06/2006
7048621Retaining ring deflection control
A carrier bead for chemical mechanical polishing of a substrate. The carrier head includes a carrier base, a retaining ring, and a junction connecting the carrier base to the retaining ring. The junction is configured such that vertical movement of the retaining rin...
05/23/2006
7040971Carrier head with a flexible membrane
A carrier head for a chemical mechanical polishing apparatus is described. The carrier head has a base, a rigid body, a membrane and a pressurizing structure. The rigid body is movable relative to the base and includes a downwardly-extending projection. The membrane...
05/09/2006
7033251Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces
Carrier assemblies, polishing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical polishing of micro-device workpieces are disclosed herein. In one embodiment, a carrier assembly includes a head having a chamber, a magnetic field ...
04/25/2006
7029375Retaining ring structure for edge control during chemical-mechanical polishing
The retaining ring has a plurality of slurry channels wherein each alternate channel is recessed away from the inner circumference of the pad contacting surface forming a recess which extends upward from the bottom surface sufficient to prevent contact of the retain...
04/18/2006
7029386Retaining ring assembly for use in chemical mechanical polishing
A retaining ring assembly for use in chemical mechanical polishing that includes an annular plastic retaining ring portion defining an annular projection thereon, an annular metal backing defining an annular channel therein for receiving the projection and a pair of...
04/18/2006
7004817Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces
Carrier assemblies, planarizing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, the carrier assembly includes a head having a chamber, a magneti...
02/28/2006
6979256Retaining ring with wear pad for use in chemical mechanical planarization
A novel retaining ring having a wear pad of such construction, design and material such that it provides improved resistance to wear and/or degradation as compared to currently available products for use in the chemical mechanical planarization (CMP) of semiconducto...
12/27/2005
6974371Two part retaining ring
A retaining ring is made of two generally annual portions. One portion has depressions and the other portion has projections that extend into the depressions when the two portions are brought together. The projections can have a cross section with two outwardly slop...
12/13/2005
6962520Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces
Retaining rings, planarizing apparatuses including retaining rings, and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, a carrier head for retaining a micro-device workpiece during m...
11/08/2005
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