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...Daniel Webster invented a "bull plow" to pull out tree stumps. It didn't catch on because it was huge and required four oxen to pull it!
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| Number | Title | Issue Date |
| 4934112 | Multiple head abrasive cutting of glass The invention pertains to cutting irregularly shaped glass parts from glass blanks, and providing interior openings or cutouts in the parts, at a relatively high volume. Glass blanks are conveyed one-by-one to a transfer position beneath a shuttle carrier... | 06/19/1990 |
| 4899719 | Apparatus for collecting wafers An apparatus for collecting wafers sliced from a semiconductor crystal rod, and the apparatus includes a primary mobile member, a secondary mobile member and a wafer collection assembly. The primary mobile member is movable toward and away from the crysta... | 02/13/1990 |
| 4890423 | Supporting head particularly for machining plates of glass, marble or the like of any size A supporting head for an apparatus for machining plates of glass, marble and the like, including a main head supporting an auxiliary head; the main head is adapted to support large plates, the auxiliary head is adapted to support small plates. The main he... | 01/02/1990 |
| 4878407 | Vacuum die mount A method and apparatus for mounting a die, particularly a rigid cutting die, on a die cylinder includes having a bubble along a seal on the die to bridge any gaps between the die and the die cylinder when the die is initially positioned on the die cylinde... | 11/07/1989 |
| 4841677 | Device for disengaging a suction mechanism from a lens A device for disengaging a suction mechanism from a lens. A housing is provided that has an upper supporting rim for a lens. The device also has a gripping member that is adapted to grasp the base of the suction mechanism in a forceps-like manner. The gri... | 06/27/1989 |
| 4808046 | Cutting method A method of cutting out components from aluminum sheets utilizes a routing tool. The sheet is held firmly in position by vacuum on a vacuum table during the cutting operation with the aid of a film of for example plastics material adhered to the back of t... | 02/28/1989 |
| 4738056 | Method and blasting apparatus for preparation of silicon wafer A process and apparatus for improving the finishing of silicon wafers intended for use as a base plate of an I.C. device. After the wafer has been cut from a silicon crystal and initially ground, then a slurry of water and silicon carbide particles is bla... | 04/19/1988 |
| 4724222 | Wafer chuck comprising a curved reference surface A chuck for holding a workpiece (e.g., a semiconductor wafer) in a vacuum comprises a curved reference surface. By clamping the edges of the workpiece and maintaining its backside against the curved surface (or against pins mounted on the surface), the fr... | 02/09/1988 |
| 4719721 | Conveyor bed assembly and vacuum platen A wide belt orbiting sander having an improved workpiece conveyor system, wherein a plurality of resiliently biased platen segments are utilized to apply a force against the underside of the upper conveyor flight in oppositely disposed relationship to the... | 01/19/1988 |
| 4711610 | Balancing chuck A balancing chuck is disclosed for semiconductor wafers having a flat region which typically causes wafer imbalance on spinning equipment. The wafer's flat region is determined by a proximity sensor mounted on a centering arm overlying the wafer. The chuc... | 12/08/1987 |
| 4705438 | Machining center having an inclinable vacuum-holding worktable A material machining center for the machining of workpieces of varying size and of various materials has a worktable supported by a base assembly. The worktable has a vacuum table for immovably holding the workpiece during the machining thereof. The machi... | 11/10/1987 |
| 4680893 | Apparatus for polishing semiconductor wafers An apparatus for polishing semiconductor material is described in which a movable polishing arm is mounted to a cabinet. Connected to the polishing arm is a workpiece holder or sometimes referred to as a wafer chuck. Adjacent to the polishing arm is a loa... | 07/21/1987 |
| 4671145 | Method and apparatus for the surface machining of substrate plates for magnetic memory plates Before being coated with the magnetizable material, the substrate plates are machined on a precision turning lathe in such a way that the annular surface provided for the storage area is convexly arched on both sides of the plate. For this purpose, the su... | 06/09/1987 |
| 4669226 | Device for holding delicate workpieces, in particular optical lenses and other optical structural elements A device for holding delicate workpieces, particularly optical lenses, includes a membrane having a clamping surface. To receive a workpiece, the membrane is pressurized and bulges in such a manner that the clamping surface is enlarged and becomes funnel-... | 06/02/1987 |
| 4657068 | Device for facilitating the circulation of fluid coolant Device (1) for facilitating the circulation of fluid coolant having, in compact form, a circulating pump (7), a settling cascade (17) and a negative-pressure pump (20) for suctioning a workpiece (54) onto a worktable (21). The transfer pump (7) and a nega... | 04/14/1987 |
| 4656791 | Abrasive fluid jet cutting support A support apparatus for supporting a workpiece in a high velocity fluid jet cutting operation. The apparatus has particular utility in the Abrasive cutting of frangible sheet material, such as glass, and especially in the cutting of a predetermined patter... | 04/14/1987 |
| 4653231 | Polishing system with underwater Bernoulli pickup An automatic polishing system for polishing semiconductor material is described. A robot and Bernoulli pickup are used to retrieve polished wafers from an underwater unload station which is located on a wafer polisher. The polished wafer is then deposited... | 03/31/1987 |
| 4625463 | Wafer attracting and fixing device A work head for attracting and fixing an IC silicon wafer is comprised of an attracting disc and a base seat surrounding the periphery of the attracting disk. The attracting disc is of an inorganic substance shaped and sintered so that the upper layer of ... | 12/02/1986 |
| 4603466 | Wafer chuck The wafer chuck disclosed herein is adapted to hold a semiconductor wafer during high energy treatment in a vacuum environment. The wafer is clamped by its rim to a circular domed plate so as to distort the wafer into close proximity with the domed face o... | 08/05/1986 |
| 4603867 | Spinner chuck A vacuum spinner chuck having improved holding power for thin wafers is obtained by providing a retention means for moveably holding an O-ring on the peripheral edge of the chuck. There is a first part-circular portion adjacent the upper surface of the ch... | 08/05/1986 |
| 4597228 | Vacuum suction device A vacuum suction device comprises a vacuum suction plate formed by baking a porous material and having a flat suction face for holding a workpiece by suction; a base abutting on a bottom of the vacuum suction plate for supporting the vacuum suction plate ... | 07/01/1986 |
| 4576326 | Method of bonding semiconductor devices to heatsinks A method for matching the bonding pad surfaces of a device and heatsinks to be bonded, which method maximizes the uniformity of pressure applied during thermocompression bonding, is disclosed. The method comprises using the collet of a die bonding machine... | 03/18/1986 |
| 4567938 | Method and apparatus for controlling thermal transfer in a cyclic vacuum processing system Apparatus for providing thermal transfer between a semiconductor wafer and a heat sink or source in a vacuum processing chamber includes a platen against which the wafer is sealed to define a thermal transfer region therebetween. The platen includes a pas... | 02/04/1986 |
| 4562671 | Lens holding spindle for a lens grinding machine A lens holding spindle for grinding machines is provided comprising two substantially cylindrical elements mounted concentrically one inside the other, one of the two elements forming the body of the spindle intended to be fixed to the grinding machine, t... | 01/07/1986 |
| 4546573 | Grinding machine A grinding machine including optical detectors for detecting an inclination and a difference of a reference position of the workpiece with respect to a reference position of the grinding machine; an inclinable jig capable of inclining the reference positi... | 10/15/1985 |
| 4535834 | Method and apparatus for controlling thermal transfer in a cyclic vacuum processing system Apparatus for providing thermal transfer between a semiconductor wafer and a heat sink or source in a vacuum processing chamber includes a platen against which the wafer is sealed to define a thermal transfer region therebetween. The platen includes a pas... | 08/20/1985 |
| 4521995 | Wafer attracting and fixing device A work head for attracting and fixing an IC silicon wafer is comprised of an attracting disc and a base seat surrounding the periphery of the attracting disk. The attracting disc is of an inorganic substance shaped and sintered so that the upper layer of ... | 06/11/1985 |
| 4508161 | Method for gas-assisted, solid-to-solid thermal transfer with a semiconductor wafer Apparatus and method are provided for effecting gas-assisted, solid-to-solid thermal transfer with a semiconductor wafer. A semiconductor wafer is loaded at its periphery onto a shaped platen. Sufficient contact pressure from the loading is produced betwe... | 04/02/1985 |
| 4420909 | Wafering system The wafering system employs a chuck assembly for moving a severed wafer from a crystal through the aperture in the cutting blade to a take-off conveyor. The chuck assembly includes a suction head which is pivotally mounted via a pivot arm assembly, a slid... | 12/20/1983 |
| 4356989 | Resilient suction cup with soft pliable sealing gasket A suction cup of resilient rubber-like material having affixed on the peripheral portion of its suction side a ring gasket of soft pliable putty-like material adapted to form a vacuum tight space therewithin when pressed against a non-porous supporting su... | 11/02/1982 |
| 4357006 | Distortion free 3 point vacuum fixture This is a vacuum clamp for holding workpieces which assures that the workpiece is held without distortion. This is accomplished by providing a fixed support, with a convex surface, and a flexible seal around the fixed support so that when a vacuum is draw... | 11/02/1982 |
| 4313284 | Apparatus for improving flatness of polished wafers Apparatus for improving polished wafer flatness such as slices of semiconductor materials through mounting of the wafers onto a deformable thin disc carrier which is mounted through a resilient device to a rotable pressure plate, the combined mounting bei... | 02/02/1982 |
| 4290179 | Cable harness assembly machine An improved machine is disclosed for forming cable harnesses by simultaneously terminating all conductors at one or both ends of a cable formed of a plurality of flat conductors embedded within a web of insulating material. The subject machine incorporate... | 09/22/1981 |
| 4288905 | Method of fabricating vacuum sizing apparatus A vacuum sizing apparatus is positioned downstream from an extruder along a path followed by a body of thermoplastics material as the body exudes in a heated, deformable state from the extruder. The apparatus includes structure defining an elongate sizing... | 09/15/1981 |
| 4254590 | Method for the production of a disk-shaped silicon semiconductor component with negative beveling A method for the production of a disk-shaped silicon semiconductor component with at least two adjoining zones of opposite type conductivity and different doping strengths using a lapping disk which includes the steps of positioning and semi-conductor com... | 03/10/1981 |
| 4241546 | Holding device for cup-shaped glassware articles in a glass processing machine The invention relates to a holding device for cup-shaped glassware articles in a glass processing machine, especially in a bursting and grinding machine, wherein the cup is placed into the holding device prior to commencement of the processing operation. ... | 12/30/1980 |
| 4227347 | Two motor drive for a wafer processing machine A drive mechanism for a wafer processing machine of the kind which holds a silicon wafer on a vacuum chuck and rotates the wafer for processing operations on the wafer periphery or upper surface incorporates a low-speed motor, a high-speed motor and an ov... | 10/14/1980 |
| 4213698 | Apparatus and method for holding and planarizing thin workpieces An apparatus and method for holding a thin workpiece such as a semiconductor wafer for operations which require the workpiece to have a high degree of planarity such as photolithographic printing includes positioning the workpiece onto a planar holding fa... | 07/22/1980 |
| 4205487 | Workpiece holding apparatus for spindle finishing machines and the like A workpiece holding apparatus for spindle finishing machines and the like, the apparatus including a plurality of radially arranged workpiece holders mounted for rotation about a first axis and including cooperating gear elements for rotating each of the ... | 06/03/1980 |
| 4193226 | Polishing apparatus The polishing apparatus utilizes a pressure head that imparts rotary motion to a wafer to be polished during the polishing operation and is of such a structure so as to eliminate the need for the use of any bonding agent for holding the wafer in intimate ... | 03/18/1980 |
