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| Number | Title | Issue Date |
| 6957511 | Single-step electromechanical mechanical polishing on Ni-P plated discs Beginning with a smooth ground aluminum blank with a relatively thin layer of leveled Ni—P, circumferential electropolishing/texturing is carried out to achieve a smooth oriented surface. A conductive slurry is provided between the disc and a porous texturing tape... | 10/25/2005 |
| 6957900 | Glass reflector for projector and manufacturing method for the same For example, the reflector according to the present invention is a reflector made of glass for a projector which is composed of amorphous glass whose thermal expansion coefficient is 30 to 45×10−7/° C. and includes a reflective surface for reflecting ... | 10/25/2005 |
| 6955586 | CMP composition and process The present invention provides a chemical metal polishing (CMP) method with improved flexibility and improved processing window, especially as it relates to the chemical aspect of CMP technology. Broadly speaking, the invention has two aspects: according to one aspe... | 10/18/2005 |
| 6955589 | Delivery system for magnetorheological fluid A magnetorheological fluid delivery system includes a mixing and tempering vessel. Fluid is admitted to the vessel via a plurality of tangential ports, creating a mixing of the fluid in the vessel and promoting homogeneity. Fluid may be reconstituted in the vessel b... | 10/18/2005 |
| 6953387 | Method and apparatus for measuring flow rate through and polishing a workpiece orifice A method and apparatus for comparing the flow rate through an orifice within a master part with the orifice within a workpiece by subjecting each orifice to an identical fluid at an identical temperature, under an identical pressure, and comparing the downstream pre... | 10/11/2005 |
| 6953489 | Capsulated abrasive composition and polishing pad using the same Capsulated abrasive compositions and a polishing pad using the same. More specifically, a polishing pad coated with compositions, which contain a capsulated abrasive, thereby used for planarizing interlayer insulating film formed on a semiconductor substrate by chem... | 10/11/2005 |
| 6953391 | Methods for reducing slurry usage in a linear chemical mechanical planarization system Methods for dispensing slurry in a linear chemical mechanical planarization (CMP) system are provided. One method involves the use of a pulsing flow of slurry instead of a continuous flow of slurry. Another method involves spraying a mist of slurry onto the polishin... | 10/11/2005 |
| 6953389 | Metal CMP slurry compositions that favor mechanical removal of oxides with reduced susceptibility to micro-scratching Metal CMP slurry compositions having relatively low chemical etch rate and relatively high mechanical polishing rate characteristics are provided. The relatively high mechanical polishing rate characteristics are achieved using relatively high concentrations of mech... | 10/11/2005 |
| 6951597 | Dynamic polishing fluid delivery system for a rotational polishing apparatus Methods and apparatus are provided for performing a chemical-mechanical process on a workpiece surface. The apparatus includes a platen having a top surface and at least one inlet configured to receive a polishing fluid, a plurality of holes formed in the top surfac... | 10/04/2005 |
| 6951695 | High surface quality GaN wafer and method of fabricating same AlxGayInzN, wherein 0≦x≦1, 0≦y≦1, 0≦z≦1, and x+y+z=1, characterized by a root mean square surface roughness of less than 1 nm in a 10×10 μm2 area. The AlxGayInzN may be in the... | 10/04/2005 |
| 6945851 | CMP formulations CMP formulations for use on nickel/phosphorus alloys comprising abrasive particles and an oxidant, a modifier for the action of the oxidant and first and second accelerants to sequester removed materials containing phosphonate and ammonium or amine groups respective... | 09/20/2005 |
| 6947862 | Method for simulating slurry flow for a grooved polishing pad A method for determining the flow of a fluid (60) in a gap (64) between a pad (48) and a substrate (12) includes the step of utilizing a hybrid Navier-Stokes/lubrication formulation to calculate the flow of the fluid (60) in the ga... | 09/20/2005 |
| 6945855 | Method and apparatus for cleaning a web-based chemical mechanical planarization system A method and apparatus for cleaning a web-based chemical-mechanical planarization (CMP) system. Specifically, a fluid spray bar is coupled to a frame assembly which may be mounted on a CMP system. The fluid spray bar will move along the frame assembly. As the fluid ... | 09/20/2005 |
| 6939204 | Abrasive machine and method of abrading work piece The abrasive machine is capable of feeding a proper amount of slurry and preventing a work piece from sticking on an upper abrasive plate. The abrasive machine comprises: the upper abrasive plate abrading an upper face of the work piece and having a plurality of slu... | 09/06/2005 |
| 6939210 | Slurry delivery arm A polishing fluid delivery apparatus has been provided that in one embodiment includes a support member, a dispense arm, a polishing fluid delivery tube and a variable restricting device. The dispense arm extends from an upper portion of the support member and has a... | 09/06/2005 |
| 6935928 | Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method A chemical mechanical polishing aqueous dispersion comprises a component (A) composed of abrasive grains, a component (B) composed of at least one of quinolinecarboxylic acid and pyridinecarboxylic acid, a component (C) composed of an organic acid other than quinoli... | 08/30/2005 |
| 6935932 | Polishing apparatus and method A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove ... | 08/30/2005 |
| 6935927 | Blasting method for deburring junction part between main bore and branch bore A method of a blast process for a junction part between a large-diameter main bore tubularly drilled through an article and a small-diameter branch bore branching off at an angle from the main bore inside the article. A pillar-shaped rod is inserted from a first ope... | 08/30/2005 |
| 6935013 | Apparatus and method for precise lapping of recessed and protruding elements in a workpiece A lapping method utilizing textured and conditioned lapping plates most suitable for finishing magnetic heads resulting in improved surface quality, less sensitivity to electrical shorts due to smears, and reduced surface height difference between the head elements ... | 08/30/2005 |
| 6935926 | System and method for reducing surface defects in integrated circuits The fabrication of integrated circuits entails the repeated application of many basic processing steps, for instance, planarization—the process of making a surface flat, or planar. One specific technique for making surfaces flat is chemical-mechanical planarizatio... | 08/30/2005 |
| 6936133 | Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool A method of creating and using a polishing substrate having a coating layer is described. The method that includes providing a substrate having one or more predetermined patterns disposed on a surface of the substrate and coating the surface of the substrate with an... | 08/30/2005 |
| 6932679 | Apparatus and method for loading a wafer in polishing system The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt... | 08/23/2005 |
| 6929532 | Method and apparatus for filtering a chemical polishing slurry of a wafer fabrication process A polishing slurry supply circuit for a semiconductor wafer fabrication process includes a tangential flow filter. The tangential flow filter is positioned upstream of a wafer polishing apparatus. The tangential flow filter may take the form of a hollow fiber filter... | 08/16/2005 |
| 6929533 | Methods for enhancing within-wafer CMP uniformity A method for enhancing uniformity in the polishing profile of a substrate during chemical mechanical polishing. According to a first embodiment, the method is adapted for a rotary-type chemical mechanical polisher and includes dispensing the polishing slurry onto th... | 08/16/2005 |
| 6926584 | Dual mode hybrid control and method for CMP slurry A DMHC (dual mode hybrid control) system and method which facilitates enhanced control in the delivery of polishing slurry to a CMP (chemical mechanical polishing) apparatus. The DMHC comprises a linear table and a PID (proportional integrated differential) controll... | 08/09/2005 |
| 6926587 | CMP apparatus, CMP polishing method, semiconductor device and its manufacturing method A CMP apparatus is provided for polishing wafers that are substrates to be polished by CMP. The CMP apparatus comprises a stage that is structured to be rotatable and holds a wafer to be polished, a polishing head holding section that holds a polishing head equipped... | 08/09/2005 |
| 6926597 | Intermediate lens pad An intermediate lens pad having a side secured to curved surface of a lens tool when the pad is in use. The pad has a surface on its other side which is substantially smooth, but which is formed with a multiplicity of substantially uniformly distributed holes or rec... | 08/09/2005 |
| 6921455 | Device for polishing outer peripheral edge of semiconductor wafer A polishing machine for a peripheral edge of a semiconductor wafer comprises a rotary mechanism 2 which rotates a stack 1 of semiconductor wafers 4 mounted thereon, and a polishing mechanism 3 which is arranged to be movable in the radial... | 07/26/2005 |
| 6918824 | Uniform fluid distribution and exhaust system for a chemical-mechanical planarization device An assembly for a chemical-mechanical polishing process includes a platen having an outer edge, a top surface, and at least one inlet for introducing fluid to the top surface; a manifold system, entrenched in the top surface and in communication with the at least on... | 07/19/2005 |
| 6918937 | Abrasive polishing composition The present invention is based on the practice of abrasive machining with no sealed working chamber by the employment of a visco-elastic abrasive medium, behaving predominantly as an elastic solid at the applied strain of the orbital working motion, and applying orb... | 07/19/2005 |
| 6919276 | Method to reduce dishing and erosion in a CMP process A CMP process for selectively polishing an overlying material layer with an underlying layer comprising at least one material in a semiconductor device fabrication process including providing a semiconductor wafer process surface including a first material layer ove... | 07/19/2005 |
| 6918301 | Methods and systems to detect defects in an end effector for conditioning polishing pads used in polishing micro-device workpieces Methods and systems to detect defects in an end effector for conditioning polishing pads used in polishing micro-device workpieces are disclosed herein. In one embodiment, a method of detecting defects in an end effector includes applying energy to a contact element... | 07/19/2005 |
| 6918818 | Polishing method In a method for the machine polishing of workpieces, the workpiece is immersed into a container filled with abrasive and is moved relative to the abrasive container. The workpiece is here moved up and down in the vertical direction, rotated about its own central axi... | 07/19/2005 |
| 6918819 | Method for defect reduction A method of removing at least one particle from a substrate is disclosed comprising polishing a metallized layer over the substrate using a slurry to remove a portion of the metallized layer and polishing the substrate using the slurry to remove a portion of a barri... | 07/19/2005 |
| 6916227 | Method and apparatus for processing sliders for use in disk drives and the like A system and method are described for processing a slider (e.g., one to be used in a disk drive apparatus). Corners of the sliders are abraded while still a part of a row of sliders in a part-off operation. By abrading the corners of the sliders, head slap events be... | 07/12/2005 |
| 6916742 | Modular barrier removal polishing slurry An aqueous slurry is useful for chemical mechanical planarizing a semiconductor substrate. The slurry includes by weight percent, 0.1 to 25 oxidizing agent, 0.1 to 20 silica particles having an average particle size of less than 200 nm, 0.005 to 0.8 polyvinyl pyrrol... | 07/12/2005 |
| 6916226 | Chemical mechanical polishing apparatus having a stepped retaining ring and method for use thereof A chemical mechanical processing apparatus includes a polishing pad capable of polishing a substrate; a stepped retaining having an inner side, a bottom side, and an open region, the open region extending radially outward from the inner side and upward from the bott... | 07/12/2005 |
| 6913528 | Low amplitude, high speed polisher and method A method and apparatus for improving uniformity of the rate of removal of material from the surface of a workpiece, such as semiconductor substrate, by polishing. In accordance with the invention, the workpiece is subjected to a vibratory polishing method, and optio... | 07/05/2005 |
| 6913523 | Method for controlling pH during planarization and cleaning of microelectronic substrates A method and apparatus for processing a microelectronic substrate. In one embodiment, the method can include planarizing the microelectronic substrate with a planarizing liquid and rinsing the substrate with a rinsing liquid having a pH approximately the same as a p... | 07/05/2005 |
| 6910951 | Materials and methods for chemical-mechanical planarization Provided are materials and methods for the chemical mechanical planarization of material layers such as oxide or metal formed on semiconductor substrates during the manufacture of semiconductor devices using a fixed abrasive planarization pad having an open cell foa... | 06/28/2005 |
