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| Number | Title | Issue Date |
| 7357694 | Jet singulation Techniques for singulating a substrate into a plurality of component parts is disclosed. The singulation techniques include generating a jet stream in order to cut through large components so as to produce smaller components. The techniques are particularly suitable... | 04/15/2008 |
| 7354526 | Processing method for glass substrate, processed glass product and stress applying apparatus A processing method for glass substrate of the present invention includes: applying heat and external force to a glass substrate and then cooling it down to thereby form a compression stressed part having a different etching rate from that of other parts with respec... | 04/08/2008 |
| 7351662 | Composition and associated method for catalyzing removal rates of dielectric films during chemical mechanical planarization A low solids-content slurry for polishing (e.g., chemical mechanical planarization) of substrates comprising a dielectric and an associated method using the slurry are described. The slurry and associated method afford high removal rates of dielectric during polishi... | 04/01/2008 |
| 7347767 | Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces Retaining rings and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces are disclosed herein. A carrier head configured in accordance with one embodiment of the invention can be used to retain a micro-device workpiece duri... | 03/25/2008 |
| 7344989 | CMP wafer contamination reduced by insitu clean Reducing CMP wafer contamination by in-situ clean is disclosed herein. The invention can be employed in a method in which a conductive layer is formed on a surface of a semiconductor wafer. After a portion of the conductive layer is removed, an acidic solution is di... | 03/18/2008 |
| 7332055 | Substrate processing apparatus A substrate processing apparatus is provided. The apparatus includes a plurality of fluid suppliers 61, 61, 63 for supplying different processing fluids. In processing a wafer W, the substrate processing apparatus moves the fluid suppliers 61, 62, 63 a... | 02/19/2008 |
| 7331844 | Polishing method A slurry feeding apparatus includes closed slurry bottle, piping, wet nitrogen generator, wet nitrogen supply pipe, suction and spray nozzles, temperature regulator, flow rate control valves, slurry delivery pump and controller for controlling the operation and flow... | 02/19/2008 |
| 7333218 | Systems and methods for determining the location and angular orientation of a hole with an obstructed opening residing on a surface of an article Provided are systems 10 and methods 100 for determining both the location and angular orientation of holes 12 with openings 14 on a surface 16 of an article 18 that are at least partially obstructed. In a method of the prese... | 02/19/2008 |
| 7332224 | Cleaning article containing hydrophilic polymers The invention relates to a cloth that can function as a moisturizing cleanser. When the cloth is moistened with water, it works up into a warm, sudsy cleansing lotion that feels great and works well as a facial cleansing cloth. The cloth contains water, at least one... | 02/19/2008 |
| 7331847 | Vibration damping in chemical mechanical polishing system A carrier head for chemical mechanical polishing, includes a base, a support structure attached to the base having a surface for contacting a substrate, and a retaining structure attached to the base to prevent the substrate from moving along the surface. The retain... | 02/19/2008 |
| 7331846 | Blasting apparatus for outer surface of pipe The present invention provides a blasting apparatus for an outer surface of a pipe which ejects a blast material to an outer side of a pipe and grinds the outer surface, comprising: a blast head containing a nozzle which ejects the blast material and a suction port ... | 02/19/2008 |
| 7330250 | Nondestructive evaluation of subsurface damage in optical elements A non-destructive process for evaluating subsurface damage in an optical element focuses a microscope at points within the optical element and measures the intensity of reflected light. In one embodiment, a microscope focus a laser beam at a measurement point with t... | 02/12/2008 |
| 7326356 | Substrate and method of forming substrate for fluid ejection device A method of forming an opening through a substrate having a first side and a second side opposite the first side includes abrasive machining a first portion of the opening into the substrate from the second side toward the first side, and abrasive machining a second... | 02/05/2008 |
| 7323189 | Liquid and low melting coatings for stents A method for forming liquid coatings for medical devices such as stents and angioplasty balloons is provided. The liquid coatings can be made from biodegradable materials in liquid, low melting solid, or wax forms, which preferably degrade in the body without produc... | 01/29/2008 |
| 7323416 | Method and composition for polishing a substrate Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at... | 01/29/2008 |
| 7320735 | Fan cleaning method and apparatus A simple yet effective system for cleaning fans and air circulators facilitates the cleaning of ceiling and hard-to-reach units without having to remove the blades or other parts to be cleaned. A flexible bag encloses parts of a fan to be cleaned. A source of compre... | 01/22/2008 |
| 7317324 | Semiconductor integrated circuit testing device and method A plurality of resistors is connected to a plurality of output terminals of a semiconductor integrated circuit, respectively, and a predetermined voltage is applied to the plurality of resistors. Also, a predetermined operation pattern signal used to test functions ... | 01/08/2008 |
| 7316603 | Compositions and methods for tantalum CMP A composition suitable for tantalum chemical-mechanical polishing (CMP) comprises an abrasive, an organic oxidizer, and a liquid carrier therefor. The organic oxidizer has a standard redox potential (E0) of not more than about 0.5 V relative to a standard... | 01/08/2008 |
| 7314575 | Manufacturing method of glass substrate for magnetic disk, and manufacturing method of magnetic disk A method for manufacturing a glass substrate for a magnetic disk comprises mirror surface polishing and cleaning of a glass substrate, wherein polishing agent of which the principal component is rare-earth oxide with content of fluorine 5% by weight or less, is supp... | 01/01/2008 |
| 7309373 | Method of making a ceramic body of densified tungsten carbide A method of making tungsten carbide and a method of making a densified tungsten carbide-containing ceramic body with a transverse rupture strength greater than 300,000 psi are disclosed. ... | 12/18/2007 |
| 7303600 | Unexpanded perlite ore polishing composition and methods An unexpanded perlite ore polishing composition is shown. The composition comprises base material having grains of unexpanded perlite ore of a selected distribution of particle sizes which undergo fracturing of the grains as a function of an abrasive force applied t... | 12/04/2007 |
| 7303601 | Polishing composition A polishing composition for memory hard disk containing water and silica particles, wherein the silica particles have a particle size distribution in which the relationship of a particle size (R) and a cumulative volume frequency (V) in a graph of particle size-cumu... | 12/04/2007 |
| 7303691 | Polishing method for semiconductor wafer A polishing method includes a slurry adjusting step for adjusting a polishing slurry containing silica particles so that the number of silica particles having a composition ratio of Si/O of 50–60 wt %/40–50 wt %, a modulus of elasticity of 1.4×1010 P... | 12/04/2007 |
| 7303662 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 12/04/2007 |
| 7299533 | Process for lapping ring and pinion gears A method for processing a gear set through a lapping operation that includes: providing a lapping machine tool having a first spindle and a second spindle, the second spindle being rotatable about an axis that is generally perpendicular to a rotational axis of the f... | 11/27/2007 |
| 7300335 | Glass substrate for data recording medium, manufacturing method thereof and polishing pad used in the method A polishing pad is used when a surface of a glass workpiece is polished for manufacturing a glass substrate of information recording medium. The polishing pad has a nap layer. The nap layer includes an inner layer that contains a plurality of closed cells, and an ou... | 11/27/2007 |
| 7300876 | Method for cleaning slurry particles from a surface polished by chemical mechanical polishing A method is provided to clean slurry particles from a surface in which tungsten and dielectric are coexposed after a dielectric CMP step. Such a surface is formed when tungsten features are patterned and etched, the tungsten features are covered with dielectric, and... | 11/27/2007 |
| 7300342 | Scratch removal device and method A polishing wheel including a lower polishing surface and defining a different color from a secondary portion of the polishing wheel, so as to indicate wear of the polishing surface. The polishing surface includes a plurality of main radial flutes extending from a c... | 11/27/2007 |
| 7300480 | High-rate barrier polishing composition The solution is useful for removing a barrier material from a semiconductor substrate. The solution comprises, by weight percent, 0.01 to 25 oxidizer, 0 to 15 inhibitor for a nonferrous metal, 0 to 15 abrasive, 0 to 20 complexing agent for the nonferrous metal, 0.01... | 11/27/2007 |
| 7300603 | Chemical mechanical planarization compositions for reducing erosion in semiconductor wafers An aqueous chemical mechanical planarizing composition includes an oxidizer for promoting barrier removal and an abrasive. Inhibitor decreases removals of a metal interconnect. The composition has a carboxylic acid polymer having at least one repeat unit of the poly... | 11/27/2007 |
| 7297048 | Apparatus and methods for dispensing particulate media A particulate media/fluid delivery system comprises a tank for containing a supply of particulate media, preferably an abrasive powder. A modulator is disposed upstream of the tank for modulating the pressure of air flowing therethrough. A mixing chamber is adjacent... | 11/20/2007 |
| 7294042 | Method and apparatus for abrasive recycling and waste separation system The present invention provides a method of handling abrasive solids materials used in an abrasive cutting procedure which jets a high-pressure abrasive slurry through a nozzle (7) onto a work piece over and/or in a catcher tank (8). This handling metho... | 11/13/2007 |
| 7294049 | Method and apparatus for removing material from microfeature workpieces Methods and apparatus for removing materials from microfeature workpieces. One embodiment of a subpad in accordance with the invention comprises a matrix having a first surface configured to support a polishing medium and a second surface opposite the first surface.... | 11/13/2007 |
| 7294040 | Method and apparatus for supporting a microelectronic substrate relative to a planarization pad A method and apparatus for planarizing a microelectronic substrate. In one embodiment, one surface of the microelectronic substrate is engaged with a planarizing pad and the opposite surface of the microelectronic substrate is positioned proximate to a substrate sup... | 11/13/2007 |
| 7291188 | Polishing cloth and method of manufacturing semiconductor device A polishing cloth used in the chemical mechanical polishing treatment comprises a molded body of (meth)acrylic copolymer having an acid value of 10 to 100 mg KOH/g and a hydroxyl group value of 50 to 150 mg KOH/g. ... | 11/06/2007 |
| 7288021 | Chemical-mechanical polishing of metals in an oxidized form The invention provides a method for polishing a substrate comprising a metal in an oxidized form, the method comprising the steps of: (a) providing a substrate comprising a metal in an oxidized form, (b) contacting a portion of the substrate with a chemical-mechanic... | 10/30/2007 |
| 7288206 | High-purity alkali etching solution for silicon wafers and use thereof A high-purity alkali etching solution for silicon wafers results in silicon wafers with extremely low metal impurity contamination, and excellent surface flatness. The alkali etching solution contains sodium hydroxide containing 1 ppb or less of the elements Cu, Ni,... | 10/30/2007 |
| 7288019 | Method of changing the surface wettability of polymer materials The present invention belongs to the field of surface modification of solid materials, specifically relates to a method of changing the surface wettability of polymer materials. The method of the present invention comprises of rubbing the surface of the polymer mate... | 10/30/2007 |
| 7285233 | Method of manufacturing polishing pad A method of manufacturing a polishing pad is described. A mold having a mold cavity therein is provided. At least a strip is buried in the mold. A polymer foam material is injected into the mold cavity of the mold. The polymer foam material is cured to mold the poly... | 10/23/2007 |
| 7281968 | Method of manufacturing auxiliary mirror, method of manufacturing light source lamp, projector, and method of manufacturing hole opening parts Aspects of the invention can provide a manufacturing method of a sub-mirror that can readily enhance manufacturing yield. The manufacturing method of a sub-mirror used for a light source lamp provided with an arc tube, an ellipsoidal reflector to reflect lights emit... | 10/16/2007 |
