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| Number | Title | Issue Date |
| 6817926 | Polishing pad and method of use thereof A method of chemically modifying a wafer suited for fabrication of semiconductor devices includes a) contacting a surface of wafer with an article that includes a plurality of unit cells repeating across the surface of the article, the individual unit cells includin... | 11/16/2004 |
| 6817925 | Multistage fine hole machining method and device A multistage fine-hole machining device has lap stations for lapping an inner surface defining a through-hole of a workpiece. Each of the lap stations has a passing unit for passing wire through the through-hole of the workpiece, a supply unit for supplying a polish... | 11/16/2004 |
| 6811468 | Polishing apparatus A polishing apparatus and a polishing method which can reduce the amount of consumption of the polishing agent and scratches caused on the object to be polished due to an increase of the particle size in the polishing agent. The polishing apparatus has a polishing h... | 11/02/2004 |
| 6800556 | Polishing method using ceria slurry, and method of manufacturing semiconductor device Polishing processes are separated into a plurality of phases; that is, an early polishing phase, a planarization phase, and a post-planarization phase. Polishing is effected by means of changing polishing requirements from phase to phase. Since polishing is effected... | 10/05/2004 |
| 6800019 | Abrasive cloth and polishing method An abrasive ground fabric which is a composite ground fabric comprising a fiber substrate and a elastic polymer filled in the fiber substrate, wherein (1) the fiber substrate is composed of bundles, each consisting of 20 to 3,000 fine fibers, and (2) the average dia... | 10/05/2004 |
| 6796883 | Controlled lubricated finishing A method of using a finishing element and using organic lubricating films for finishing semiconductor wafers is described. The lubricants in the finishing element can be transferred to operative finishing interface and can form a self-assembling lubricating film. Th... | 09/28/2004 |
| 6783432 | Additives for pressure sensitive polishing compositions A method and composition for planarizing a substrate. The composition includes a pressure sensitive solution and one or more chemical agents for complexing with a metal or oxidized metal. The method for removal of a copper containing layer from a substrate surface, ... | 08/31/2004 |
| 6783429 | Apparatus and method for sampling a chemical-mechanical polishing slurry An apparatus and method for drawing a sample of a chemical-mechanical polishing slurry for analysis of at least one property, e.g., particle size distribution, is described. The apparatus comprises (i) a plurality of sample delivery lines, each line carrying a chemi... | 08/31/2004 |
| 6780212 | Surface finishing composition A finishing composition for a variety of surfaces, including, without limitation, paints, metals, plastics and fiberglass, comprises water, wax, soap, scent, hair conditioner, mineral spirits and abrasives. ... | 08/24/2004 |
| 6780089 | Method and apparatus for removing a predetermined amount of material from a bottom portion of a dovetail slot in gas turbine engine disk A system and method of removing a predetermined amount of material from a bottom portion of a dovetail slot in a gas turbine engine disk, including the steps of configuring a designated flow path through the dovetail slot and providing a flow of abrasive media throu... | 08/24/2004 |
| 6780088 | Chemical mechanical polishing apparatus and a method of chemical mechanical polishing using the same Provided are a chemical mechanical polishing apparatus and a method of chemical mechanical polishing using the same in which the clogs of the polishing fluid are prevented from being trapped between the diamond grains embedded in the dresser or removing such clogs a... | 08/24/2004 |
| 6776696 | Continuous chemical mechanical polishing process for polishing multiple conductive and non-conductive layers on semiconductor wafers A continuous CMP process for polishing multiple conductive and non-conductive layers on a semiconductor substrate. The continuous process comprises the steps of: (a) disposing a substrate on a platen; (b) polishing a first layer using both a mechanical means and a c... | 08/17/2004 |
| 6776693 | Method and apparatus for face-up substrate polishing A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a basin and a polishing head. A carrier is disposed in the basin and has a substrate supporting surface. A retaining ring is dispose... | 08/17/2004 |
| 6776691 | Polishing/cleaning method as well as method of making a wiring section using a polishing apparatus A polishing apparatus that can effectively and efficiently remove potassium and other alkaline metals comprises integrally a polishing unit for polishing an object by means of a polishing agent and a cleaning unit for cleaning the polished object. The polishing unit... | 08/17/2004 |
| 6769969 | Raised island abrasive, method of use and lapping apparatus Abrasive sheet materials, abrasive sheet materials with island distributions of abrasive particles, processes for manufacture of abrasive sheet materials with minimized abrasive content (with monolayers and as few as four layers of abrasive particles), processes for... | 08/03/2004 |
| 6769961 | Chemical mechanical planarization (CMP) apparatus A chemical mechanical planarization (CMP) apparatus includes a bath of an aqueous solution. A first holder, which is configured to support a wafer, is disposed within the bath. A first spindle is configured to rotate the first holder. A second holder, which is rotat... | 08/03/2004 |
| 6769960 | System for manufacturing a semiconductor device, polishing slurry feeder and method for manufacturing a semiconductor device An apparatus for manufacturing a semiconductor device by polishing the surface of a semiconductor substrate is provided, which comprises a polishing pad for polishing the substrate surface, a polishing slurry feed apparatus for feeding a polishing slurry to the subs... | 08/03/2004 |
| 6769959 | Method and system for slurry usage reduction in chemical mechanical polishing A method and system is disclosed for reducing slurry usage in a chemical mechanical polishing operation utilizing at least one polishing pad thereof. Slurry can be intermittently supplied to a chemical mechanical polishing device. The slurry is generally flushed so ... | 08/03/2004 |
| 6764386 | Air bearing-sealed micro-processing chamber Apparatus for processing a surface of a substrate includes a chamber containing a cavity that has one side that is open, the chamber wall including a lip surrounding the open side of the cavity. Gas ports, disposed within the chamber wall and opening through the lip... | 07/20/2004 |
| 6764384 | System for the precision machining of rotationally symmetrical components An arrangement and method for precision machining of rotationally symmetrical, disk or ring-shaped components. The arrangement includes a container which is open at the top and mounted such that it is able to vibrate. An unbalanced rotor causes the container to vibr... | 07/20/2004 |
| 6755721 | Chemical mechanical polishing of nickel phosphorous alloys CMP formulations for use on nickel/phosphorus alloys comprising abrasive particles and an oxidant, a modifier for the action of the oxidant and first and second accelerants to sequester removed materials containing phosphonate and ammonium or amine groups respective... | 06/29/2004 |
| 6752697 | Apparatus and method for chemical mechanical polishing of a substrate The present invention is directed to a method and apparatus for performing polishing operations on substrates in an integrated circuit manufacturing environment. In one embodiment, the apparatus is comprised of a movable polishing platen, a polishing pad positioned ... | 06/22/2004 |
| 6752685 | Adaptive nozzle system for high-energy abrasive stream cutting A system is provided for delivering onto a workpiece a high-energy abrasive cutting stream. The system generally comprises a head assembly for providing a pressurized fluidic stream; a nozzling unit coupled to the head assembly for nozzling the pressurized fluidic s... | 06/22/2004 |
| 6749488 | Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers The invention relates to a novel CMP slurry composition used for polishing metals, the composition comprising: (a) a dispersion solution comprising an abrasive; and (b) an oxidizer. The slurry composition has a large particle count of less than about 150,000 particl... | 06/15/2004 |
| 6746314 | Nitride CMP slurry having selectivity to nitride A nitride CMP slurry having selectivity to nitride over oxide. The slurry increases the polishing speed of a nitride film by varying the pH of the slurry, and polishes the nitride film faster than an oxide film by decreasing the polishing speed of the oxide film. As... | 06/08/2004 |
| 6746310 | Uniform thin films produced by magnetorheological finishing An improved method for producing a thin layer having highly uniform thickness, which layer may be pre-coated on an undulating surface of a substrate element. A working layer of the material is formed having a thickness greater than the final thickness desired. An ar... | 06/08/2004 |
| 6739953 | Mechanical stress free processing method According to one embodiment, a method of planarizing of a surface of a semiconductor substrate is provided. A copper layer is inlaid in a dielectric layer of the substrate. The semiconductor substrate is disposed opposite to a polishing pad and relative movement pro... | 05/25/2004 |
| 6739950 | Pipe renovating system and method A pipe renovating method and system is described, in which a pipe is first cleaned and then coated with a suitable coating material. In the cleaning step, pressurized air and particles of abrasive material are pumped into a first end of a pipe while suction is appli... | 05/25/2004 |
| 6736952 | Method and apparatus for electrochemical planarization of a workpiece An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge ... | 05/18/2004 |
| 6736706 | Device for defining a designated flow path through a dovetail slot in a gas turbine engine disk A device for defining a designated flow path through a dovetail slot in a gas turbine engine disk, wherein a longitudinal axis extends through the dovetail slot. The device includes a first portion having a bottom section contoured to form the flow path in conjuncti... | 05/18/2004 |
| 6736705 | Polishing process for glass or ceramic disks used in disk drive data storage devices Disk substrates are polished in a process which uses a single load of the disks to a polishing apparatus and a single polishing slurry. Preferably, the process varies at least one polishing parameter at multiple stages to achieve both a reasonable rate of removal du... | 05/18/2004 |
| 6736701 | Eliminate broken line damage of copper after CMP A new method is provided for the post-deposition treatment of copper lines. A damascene copper line pattern whereby a TaN barrier layer and a seed layer have been provided is polished. Under the first embodiment of the invention, the deposited copper is polished (Cu... | 05/18/2004 |
| 6733368 | Method for lapping a wafer An improved method for lapping the opposed major surfaces of a wafer is provided. In this regard, a multi-step lapping process is provided in which lapping continues while transitioning from a first slurry having larger abrasive particles to a second slurry having s... | 05/11/2004 |
| 6729935 | Method and system for in-situ monitoring of mixing ratio of high selectivity slurry A method and system for monitoring the quality of a slurry utilized in a chemical mechanical polishing operation. A slurry is generally delivered through a tubular path during a chemical mechanical polishing operation. A laser light is generally transmitted from a l... | 05/04/2004 |
| 6726545 | Linear polishing for improving substrate uniformity A linear polishing apparatus for polishing a semiconductor substrate including a novel polishing belt arrangement with at least two polishing belts forming a continuous loop. Each belt having an outside polishing surface and an inside smooth surface. The belts are s... | 04/27/2004 |
| 6726534 | Preequilibrium polishing method and system The invention provides a polishing system that comprises a liquid carrier, an alkali metal ion, hydroxide ions, and a polishing pad and/or an abrasive. The abrasive can be dispersed in the liquid carrier of the polishing system or bound to the polishing pad. The alk... | 04/27/2004 |
| 6722956 | Working apparatus A finishing grindstone member (20) is fixed to a spindle (10) by a bolt. In the spindle (10), there is formed a tool mounting portion (25) into which a rough grindstone member can be mounted. Into the tool mounting portion (25), th... | 04/20/2004 |
| 6722951 | Method for lapping and a lapping apparatus A method for lapping which eliminates lapping damage includes a high-speed lapping operation at a high torque which is continuously performed after performing intermittently a low-speed lapping operation under low torque on a workpiece. Therefore, the excessive load... | 04/20/2004 |
| 6722950 | Method and apparatus for electrodialytic chemical mechanical polishing and deposition Embodiments of the invention include methods and apparatus for electrodialytic polishing of various layers formed on semiconductor substrates. In certain embodiments the use of electrodialytic processes in conjunction with chemical mechanical forces to achieve a cop... | 04/20/2004 |
| 6722949 | Ventilated platen/polishing pad assembly for chemcial mechanical polishing and method of using A ventilated platen/polishing pad assembly for chemical mechanical polishing copper conductors on a semiconductor wafer is disclosed. The ventilated platen is constructed by a platen having a multiplicity of apertures through a thickness of the platen, and a polishi... | 04/20/2004 |
