Celebrity Inventors
Mark Twain (Samuel L. Clemens) received Patent No. 121,992 for "An Improvement in Adjustable and Detachable Straps for Garments." He later received two more patents: one for a self-pasting scrapbook and one for a game to help players remember important historical dates.
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| Number | Title | Issue Date |
| 7338344 | Automated drill bit re-sharpening and verification system A completely automated apparatus for verifying the identity and geometry of drill bits, re-sharpening the cutting tip of a drill bit and re-positioning a locating ring upon the shank portion of the drill bit subsequent to the re-sharpening of the cutting tip thereof... | 03/04/2008 |
| 7322787 | Devices and methods for reversing, transporting, and processing substrates A substrate is supported on a plurality of substrate supporting pins mounted to a second movable member. Next, so as to bring the plurality of substrate supporting pins close to a plurality of substrate supporting pins mounted to a first movable member, the first mo... | 01/29/2008 |
| 7241203 | Six headed carousel The present invention relates to an apparatus and method for polishing semiconductor substrates with improved throughput and reduced foot print. One embodiment of the present invention provides an apparatus for polishing a substrate. The apparatus comprises a base, ... | 07/10/2007 |
| 7223153 | Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces An apparatus and method for polishing objects, such as semiconductor wafers, utilizes one or more polishing surfaces, multiple wafer carriers and at least one load-and-unload cup. The load-and-unload cup may be configured to move to and from the wafer carriers in a ... | 05/29/2007 |
| 7204743 | Integrated circuit interconnect fabrication systems A system for processing a conductive surface on a front surface of a wafer to form a metallic interconnect structure is disclosed. The system for processing comprises an electrochemical mechanical processing (ECMPR) module configured to form a substantially planariz... | 04/17/2007 |
| 7165927 | Automated material handling system for semiconductor manufacturing based on a combination of vertical carousels and overhead hoists An Automated Material Handling System (AMHS) that allows an overhead hoist transport vehicle to load/ unload parts directly to/from storage units included in the system. The AMHS includes an overhead hoist transport subsystem and a vertical carousel stocker having a... | 01/23/2007 |
| 7166016 | Six headed carousel The present invention relates to an apparatus and method for polishing semiconductor substrates with improved throughput and reduced foot print. One embodiment of the present invention provides an apparatus for polishing a substrate. The apparatus comprises a base, ... | 01/23/2007 |
| 7147542 | Centerless grinder A centerless grinder for grinding an elongated workpiece includes a grinding wheel having a working surface with a plurality of raised areas extending circumferentially around at least a portion of the working surface. A platform is provided having an elongated top ... | 12/12/2006 |
| 7137874 | Semiconductor wafer, polishing apparatus and method A wafer polishing apparatus for polishing a semiconductor wafer. The polisher comprises a base (23), a turntable (27), a polishing pad (29) and a drive mechanism (45) for driven rotation of a polishing head (63). The polishing head... | 11/21/2006 |
| 7128825 | Method and composition for polishing a substrate Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic ... | 10/31/2006 |
| 7101259 | Polishing method and apparatus A polishing apparatus is used for chemical mechanical polishing a copper (Cu) layer formed on a substrate such as a semiconductor wafer and then cleaning the polished substrate. The polishing apparatus has a polishing section having a turntable with a polishing surf... | 09/05/2006 |
| 7101253 | Load cup for chemical mechanical polishing A load cup for transferring a substrate in a chemical mechanical polishing system is provided. In one embodiment, a load cup for transferring substrates in a chemical mechanical polishing system includes a substrate support having a first side adapted to support a s... | 09/05/2006 |
| 7101138 | Extractor/buffer An automated material handling system that includes an extractor/buffer apparatus capable of simultaneously accessing multiple Work-In-Process (WIP) parts, thereby providing a highly efficient interface between WIP storage locations and transport equipment. The extr... | 09/05/2006 |
| 7070483 | Automated drill bit re-sharpening and verification system A completely automated apparatus for verifying the identity and geometry of drill bits, re-sharpening the cutting tip of a drill bit and re-positioning a locating ring upon the shank portion of the drill bit subsequent to the re-sharpening of the cutting tip thereof... | 07/04/2006 |
| 7066787 | Substrate processing apparatus A substrate processing apparatus is used for removing surface irregularities occurring on a peripheral portion (a bevel portion, an edge portion, and a notch) of a substrate, such as a semiconductor wafer, and films deposited as a contaminant on the peripheral porti... | 06/27/2006 |
| 7004815 | Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to polish at least one semiconductor wafer while another semiconductor wa... | 02/28/2006 |
| 6976903 | Apparatus for controlling retaining ring and wafer head tilt for chemical mechanical polishing A CMP system accurately measures eccentric forces applied to carriers for wafer or polishing pad conditioning pucks. An initial coaxial relationship between wafer axis of rotation and a carrier axis is maintained during application of the eccentric force, such that ... | 12/20/2005 |
| 6966821 | Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to... | 11/22/2005 |
| 6953392 | Integrated system for processing semiconductor wafers An integrated system for processing a plurality of wafers, having a conductive front surface, is provided. The system includes a plurality of processing subsystems for depositing on or removing metal from the front surfaces of the wafers. Each processing subsystem i... | 10/11/2005 |
| 6942545 | Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to polish at least one semiconductor wafer while another semiconductor wa... | 09/13/2005 |
| 6887124 | Method of polishing and cleaning substrates The substrate processing system has a factory interface module, a chemical mechanical polisher, a cleaner, a particle monitor and a substrate transfer system disposed as an integrated system. The factory interface module may includes a chamber a storage station loca... | 05/03/2005 |
| 6852007 | Robotic method of transferring workpieces to and from workstations An integral machine for polishing, cleaning, rinsing and drying workpieces such as semiconductor wafers. A load/unload station has a plurality of platforms for receiving cassettes of wafers to be processed. A dry end-effector of a robot retrieves wafers from the cas... | 02/08/2005 |
| 6852008 | Method and apparatus for discharging works from a centerless grinder A method and apparatus for discharging work product from a device wherein a roller which is biased to push against the top of the work product cooperates with a stopper which engages the surface of the work product for displacing the work product, one-by-one from th... | 02/08/2005 |
| 6846224 | Surface planarization equipment for use in the manufacturing of semiconductor devices Surface planarization equipment of a semiconductor wafer safely transfers wafers to an unloading cassette. In addition to the unloading cassette, the surface planarization equipment includes a loading cassette configured to hold wafers awaiting surface planarization... | 01/25/2005 |
| 6843704 | Method and apparatus for automatically loading a double-sided polishing machine with wafer crystals A method and apparatus for automatically loading and unloading wafer crystals to and from a double-sided polishing machine of the type having an upper and a lower polishing plate, runner disks with reception openings for the wafer crystals, and a drive to move runne... | 01/18/2005 |
| 6808445 | Device for loading and unloading optical workpieces The invention relates to a device for loading and unloading optical workpieces, for an optical machine. The device comprises a loading arm (24) which is pivotally driven about an axis (A) and is pivoted in controlled movement sequences on the optical machine ... | 10/26/2004 |
| 6752691 | Device for smoothing gear wheels A device for smoothing gear wheels includes a loading station for supplying the gear wheels, a smoothing station for smoothing the flanks of the teeth, an inspection station for inspecting the degree of smoothing, and an unloading station for carrying away the proce... | 06/22/2004 |
| 6716086 | Edge contact loadcup A semiconductor wafer processing apparatus, more specifically, an edge contact loadcup for locating a semiconductor workpiece or wafer into a chemical mechanical retaining ring utilizing a cone, wafer chuck and flexure. The cone aligns the wafer concentrically to th... | 04/06/2004 |
| 6656028 | Method for loading a semiconductor processing system A method for loading substrates in a processing system is provided. In one embodiment, a method for loading substrates utilizes a substrate loader that generally includes a wall having an exterior side with one or more apertures formed therethrough and a ... | 12/02/2003 |
| 6547650 | Polishing apparatus In a wafer polishing apparatus 1 according to this invention, waiting units 43 having upper-lower two-stage wafer placement tables each for temporarily keeping a wafer from a load/unload unit 3 to a polishing head 42 or vice versa are provided to a polish... | 04/15/2003 |
| 6517420 | Wafer surface machining apparatus A surface machining apparatus comprises a suction transfer device that is capable of transferring a ground thin wafer held thereon without damaging it. After the wafer is ground at two different grinding stages, the suction transfer device transfers the w... | 02/11/2003 |
| 6517411 | Automated drill bit re-sharpening and verification system A completely automated apparatus for verifying the identity and geometry of drill bits, re-sharpening the cutting tip of a drill bit and re-positioning a locating ring upon the shank portion of the drill bit subsequent to the re-sharpening of the cutting ... | 02/11/2003 |
| 6494197 | Dicing machine for cutting CSP plate into pellets Disclosed is a dicing machine for cutting a CSP plate into pellets and for transferring and putting them in a transport tray. The pick-up-and-transport means picks a selected pellet from a diced CSP plate to carry and put the so selected pellet in an allo... | 12/17/2002 |
| 6491574 | Complete blade and wafer handling and support system without tape The wafer handling and support system disclosed herein does not use tape and is adapted for use in conjunction with a number of work stations. The wafer handling and support system includes a chuck plate comprised of a non-porous section surrounding a por... | 12/10/2002 |
| 6435941 | Apparatus and method for chemical mechanical planarization Generally, a semiconductor wafer processing system and more specifically, a semiconductor wafer planarization system for polishing a workpiece, such as a semiconductor substrate or wafer. The system generally includes a first polishing module that has a p... | 08/20/2002 |
| 6413145 | System for polishing and cleaning substrates The substrate processing system has a factory interface module, a chemical mechanical polisher, a cleaner, a particle monitor and a substrate transfer system disposed as an integrated system. The factory interface module may includes a chamber a storage s... | 07/02/2002 |
| 6413356 | Substrate loader for a semiconductor processing system A substrate loader for a semiconductor substrate processing system that generally includes a wall having an exterior side with one or more apertures formed therethrough and a related method of loading a processing system. A door assembly is movably couple... | 07/02/2002 |
| 6406359 | Apparatus for transferring semiconductor substrates using an input module A system for polishing a semiconductor substrate. Specifically, the system includes one or more polishing modules and a cleaning module. A rail is disposed between the polishing modules and the cleaning module. The rail has a first end disposed proximate ... | 06/18/2002 |
| 6398631 | Method and apparatus to place wafers into and out of machine A system for facilitating transfer of a semiconductor wafer into or out of a wafer carrier of a polishing or lapping machine without contacting a face of the wafer. The system includes a wafer transport suitable for placement above the carrier, the transp... | 06/04/2002 |
| 6390897 | Cleaning station integral with polishing machine for semiconductor wafers An integral machine for polishing, cleaning, rinsing and drying workpieces such as semiconductor wafers. A load/unload station has a plurality of platforms for receiving cassettes of wafers to be processed. A dry end-effector of a robot retrieves wafers f... | 05/21/2002 |
