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| Number | Title | Issue Date |
| 8087975 | Composite sheet for mounting a workpiece and the method for making the same The present invention relates to a composite sheet for mounting a workpiece and a method for making the same. The composite sheet includes a buffer layer and an adsorption layer. The buffer layer has a plurality of continuous pores. The adsorption layer is located o... | 01/03/2012 |
| 7438632 | Method and apparatus for cleaning a web-based chemical mechanical planarization system A method and apparatus for cleaning a web-based chemical-mechanical planarization (CMP) system. Specifically, a fluid spray bar is coupled to a frame assembly which may be mounted on a CMP system. The fluid spray bar will move along the frame assembly. As the fluid ... | 10/21/2008 |
| 7431634 | Platen assembly, apparatus having the platen assembly and method of polishing a wafer using the platen assembly In a platen assembly for a polishing apparatus, a platen supports a polishing belt that makes contact with an object during a polishing process, so that the platen provides a pressure on the polishing belt during the polishing process. A plurality of first bladders ... | 10/07/2008 |
| 7371158 | Plating removing apparatus for two-piece wheel To provide a plating removing apparatus for 2-piece wheels, which can easily and beautifully remove plating at the welding planned portion on the rim inner circumferential surface and achieves 2-piece wheels with rims plated without requiring any troublesome operati... | 05/13/2008 |
| 7367873 | Substrate processing apparatus A substrate processing apparatus has a polishing tape and a polishing head for pressing the polishing tape against a peripheral portion of a semiconductor wafer. The substrate processing apparatus polishes the wafer due to sliding contact of the polishing tape and t... | 05/06/2008 |
| 7364498 | Double armed finishing tool for tubing materials A belt grinding finishing tool incorporates a pair of mounting arms projecting forwardly from a drive housing to support a single abrasive belt entrained around drive and idler pulleys. The first mounting arm is positionally fixed relative to the drive housing, but ... | 04/29/2008 |
| 7303467 | Chemical mechanical polishing apparatus with rotating belt A chemical mechanical polishing apparatus has a movable platen, a drive mechanism and a chucking mechanism. The drive mechanism is attached to the platen, is configured to support a generally linear polishing sheet with a portion of the polishing sheet extending ove... | 12/04/2007 |
| 7303662 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 12/04/2007 |
| 7278905 | Apparatus and method for conditioning polishing surface, and polishing apparatus and method of operation A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then the conditioned pad portion may be used again for polishing. The con... | 10/09/2007 |
| 7241204 | Polishing pad, method of producing same and method of polishing A polishing pad has a resin sheet having a flat surface and abrading particles fixed inside and on the surface of this resin sheet. Its tensile strength is in the range of 30 MPa or greater and 70 MPa or less and preferably in the range of 40 MPa or greater and 60 M... | 07/10/2007 |
| 7179154 | Method and apparatus for cleaning a wafer bevel edge and notch using a pin and an abrasive film cassette An apparatus for cleaning a semiconductor wafer edge is provided. The apparatus includes a film with an abrasive layer configured to contact the edge surface of a semiconductor substrate coated with a contaminant residue layer. A first reel having the film wound the... | 02/20/2007 |
| 7179333 | Closure sealant dispenser A machine for applying sealant material to non-circular closures using a rotating chuck connected to a rotational motor and a fixedly mounted dispensing apparatus. The chuck is also moved in at least one linear direction in a plane normal to the rotational axis of t... | 02/20/2007 |
| 7156727 | Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates A web-format polishing pad for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies, and methods for making and using such a web-format pad. In one aspect of the invention, a web-format polishing pad for planarizing a microelec... | 01/02/2007 |
| 7153182 | System and method for in situ characterization and maintenance of polishing pad smoothness in chemical mechanical polishing A system and method for in situ measurement and maintenance of preferred pad smoothness in a CMP process is disclosed. The system includes a linear polisher having one or more sensors for detecting fluid pressure, fluid flow or motor current at the linear polisher d... | 12/26/2006 |
| 7144304 | Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the mi... | 12/05/2006 |
| 7125477 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 10/24/2006 |
| 7115021 | Abrasive, method of polishing target member and process for producing semiconductor device To polish polishing target surfaces of SiO2 insulating films or the like at a high rate without scratching the surface, the present invention provides an abrasive comprising a slurry comprising a medium and dispersed therein at least one of i) cerium oxid... | 10/03/2006 |
| 7115023 | Process tape for cleaning or processing the edge of a semiconductor wafer A wafer bevel processing apparatus comprises a plurality of rollers for rotatably supporting a wafer, first process roller, a second process roller, and a process tape extending between the first process roller and the second process roller. The first and second pro... | 10/03/2006 |
| 7104875 | Chemical mechanical polishing apparatus with rotating belt A chemical mechanical polishing apparatus has a rotatable platen, a polishing sheet that is wider than the substrate extending between two reels, a drive mechanism to advance the polishing sheet, and a chucking mechanism to intermittently secure the polishing sheet ... | 09/12/2006 |
| 7090560 | System and method for detecting abrasive article orientation Systems and methods control abrading operations of an abrading machine by sensing characteristics of an abrading article installed on the abrading machine. When a problem is discovered by sensing the article, appropriate actions may be taken. As one example, the abr... | 08/15/2006 |
| 7090605 | Apparatus for processing a prosthetic component An idler or tensioning assembly for an electronically controlled sanding/polishing machine is provided, the sanding/polishing machine utilizing a plurality of exchangeable polishing wheel assemblies of which the idler assembly is one. Each polishing wheel assembly i... | 08/15/2006 |
| 7077721 | Pad assembly for electrochemical mechanical processing Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A... | 07/18/2006 |
| 7063607 | Bowling ball resurfacing apparatus A bowling ball resurfacing apparatus comprises a housing, first and second vertical support rollers mounted to the housing for rotation about parallel vertical axes, each of the vertical support rollers adapted to make contact with the surface of the bowling ball at... | 06/20/2006 |
| 7044837 | Magnetic head cleaning method A method for cleaning a magnetic head using a cleaning tape comprising a substrate and a cleaning layer, wherein the cleaning tape has a stiffness of 2 or less in a width direction, and the magnetic head has trenches substantially parallel to a sliding direction of ... | 05/16/2006 |
| 7037173 | Method of grinding A grinding method comprises steps of simultaneously grinding plural grinding portions of a workpiece by plural grinding wheels T1, T2 moved individually each other, and terminating said grinding by a predetermined grinding wheel T1 prior to a te... | 05/02/2006 |
| 7033245 | Lapping apparatus and lapping method A lapping apparatus lapping a work having a pre-machined surface comprises a lapping film which includes a thin substrate having a surface provided with abrasive grains, a shoe disposed at a back surface side of the lapping film, a shoe driving unit which drives the... | 04/25/2006 |
| 7029369 | End-point detection apparatus An apparatus is provided for polishing a substrate. The apparatus includes a polishing pad configured to traverse from at least a first point to a second point. A first sensor is located near the first point and oriented so as to sense an incoming temperature of the... | 04/18/2006 |
| 7029365 | Pad assembly for electrochemical mechanical processing Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an ... | 04/18/2006 |
| 7018276 | Air platen for leading edge and trailing edge control An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to... | 03/28/2006 |
| 7008303 | Web lift system for chemical mechanical planarization Generally, a method and system for lifting a web of polishing material is provided. In one embodiment, the system includes a platen that has a first lift member disposed adjacent to a first side and a second lift member disposed adjacent to a second side. The platen... | 03/07/2006 |
| 7004045 | High thrust valve operator A high thrust operator for gate valves employs an inverted satellite roller screw assembly driven by an internally threaded cylinder carried within a bearing case. The cylinder is sized to provide a relief plenum within the case into which the roller screw assembly ... | 02/28/2006 |
| 6991512 | Apparatus for edge polishing uniformity control An invention is provided for a platen for use in a CMP system. The platen includes an inner set of pressure sub regions capable of providing pressure to a polishing pad disposed above the platen. Each of the inner pressure sub regions is disposed below a wafer and w... | 01/31/2006 |
| 6979248 | Conductive polishing article for electrochemical mechanical polishing An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a body comprising at least a portion of fibers coat... | 12/27/2005 |
| 6971950 | Polishing silicon wafers An endless belt for a belt type polishing machine comprises a support fabric and a polymer layer of relatively low hardness. The polymer layer is formed with drainage grooves. The support fabric may comprise a non woven or woven material, or a membrane with oriented... | 12/06/2005 |
| 6962524 | Conductive polishing article for electrochemical mechanical polishing Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupl... | 11/08/2005 |
| 6955588 | Method of and platen for controlling removal rate characteristics in chemical mechanical planarization Methods and a platen control parameters of a removal rate characteristic in chemical mechanical planarization, while allowing a low-cost polishing pad to be used especially in fast edge operations, and while reducing the amount of fluid used to support the polishing... | 10/18/2005 |
| 6951511 | Platen with peripheral frame for supporting a web of polishing material in a chemical mechanical planarization system Generally, a method and apparatus for supporting a web of polishing material. In one embodiment, the apparatus includes a platen adapted to support the web, a frame assembly, and one or more flexures coupled between the platen and the frame assembly. The flexure all... | 10/04/2005 |
| 6939203 | Fluid bearing slide assembly for workpiece polishing A fluid bearing polishing apparatus for carrying a polishing member for chemical mechanical polishing includes a fluid supply and a fluid dispensing structure to support the polishing member. A method of polishing a workpiece includes supporting a polishing member o... | 09/06/2005 |
| 6929533 | Methods for enhancing within-wafer CMP uniformity A method for enhancing uniformity in the polishing profile of a substrate during chemical mechanical polishing. According to a first embodiment, the method is adapted for a rotary-type chemical mechanical polisher and includes dispensing the polishing slurry onto th... | 08/16/2005 |
| 6926589 | Chemical mechanical polishing apparatus and methods using a flexible pad and variable fluid flow for variable polishing The present invention relates to methods and apparatus that allow for chemical mechanical polishing using a flexible pad and variable fluid flow for variable polishing. ... | 08/09/2005 |
