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| Number | Title | Issue Date |
| 5635083 | Method and apparatus for chemical-mechanical polishing using pneumatic pressure applied to the backside of a substrate A novel method and apparatus for uniformly polishing thin films formed on a semiconductor substrate. A substrate is placed face down on a moving polishing pad so that the thin film to be polished is placed in direct contact with the moving polishing pad. ... | 06/03/1997 |
| 5624299 | Chemical mechanical polishing apparatus with improved carrier and method of use A carrier apparatus for positioning and biasing a substrate against a polishing pad. The carrier apparatus includes a resilient membrane which loads the substrate against the pad. The membrane is configured to create one or more vacuum regions which chuck... | 04/29/1997 |
| 5618227 | Apparatus for polishing wafer There is disclosed a wafer-polishing apparatus suitably designed to carry out a chemical mechanical polishing operation. The apparatus includes a lower polishing plate assembly, a first rotating mechanism for rotating the first polishing plate assembly, a... | 04/08/1997 |
| 5616212 | Method for polishing a wafer by supplying surfactant to the rear surface of the wafer In a wafer polishing method and a device therefor, a surfactant solution is applied to the rear of a wafer by spraying or immersion before the wafer is attached to a holder. Even when the rear of the wafer is hydrophobic, it does not repel the solution an... | 04/01/1997 |
| 5605487 | Semiconductor wafer polishing appartus and method Apparatus for polishing semiconductor wafers comprises a housing, a mounting apparatus within the housing for wax mounting a first face of a semiconductor wafer to a first face of a polishing block, and a first semiconductor wafer polisher within the hous... | 02/25/1997 |
| 5597346 | Method and apparatus for holding a semiconductor wafer during a chemical mechanical polish (CMP) process An improved semiconductor wafer carrier (16) holds semiconductor wafer (14) during a CMP process and achieves a more uniform layer of slurry (24) at greater polishing speeds. Carrier (16) directs slurry (24) between semiconductor wafer (14) and conditioni... | 01/28/1997 |
| 5584746 | Method of polishing semiconductor wafers and apparatus therefor A method of polishing semiconductor wafers and apparatus therefore are described. According to the present invention, a semiconductor wafer mounted on the lower side of a wafer mounting plate may be polished on a polishing pad by the front referenced poli... | 12/17/1996 |
| 5562529 | Apparatus and method for uniformly polishing a wafer An apparatus and method for polishing a semiconductor wafer. A polisher includes a supporting plate having a conductive film and a polishing cloth formed on the conductive film of the supporting plate. The polishing cloth has a plurality of openings to ex... | 10/08/1996 |
| 5542874 | Wafer polishing apparatus A wafer polishing apparatus has a wafer chuck for holding a wafer with a surface to be polished directed upward, the wafer chuck being rotatable by a wafer chuck rotation motor; a pair of nozzles for supplying slurries used as polishing solutions to the w... | 08/06/1996 |
| 5538465 | Elastic foamed sheet and wafer-polishing jig using the sheet An elastic foamed sheet is disclosed which is usable as waxless polishing backing pads for wafers and capable of producing mirror polish wafers excelling in flatness. This elastic foamed sheet possesses at least a foamed layer 2 and is characterized by th... | 07/23/1996 |
| 5514025 | Apparatus and method for chamfering the peripheral edge of a wafer to specular finish An apparatus for chamfering the peripheral edge of a semiconductor wafer to specular finish, consisting of a turn table with an abrasive table surface, and a wafer holder, which holds the wafer firmly by sucking one face of the wafer, turn the wafer circu... | 05/07/1996 |
| 5498199 | Wafer polishing method and apparatus A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantia... | 03/12/1996 |
| 5452905 | Spinning plate for substrates A spinning plate for substrates has on the surface of its spinning disk a continuous seal that is pressed from below against the edge of the substrate. The substrate can thus be retained by suction on the spinning disk. In order to center the substrate, a... | 09/26/1995 |
| 5449316 | Wafer carrier for film planarization The apparatus is used to remove material uniformly from all regions of a wafer surface that is being polished. This is in contrast to conventional lapping machines which preferentially remove material from the high spots on the surface being polished so a... | 09/12/1995 |
| 5441444 | Polishing machine An object of the present invention is to provide a polishing machine having a smaller holding section. In the polishing machine of the present invention, a polishing plate polishes a wafer. A holding section has a concave section. A carrying plate, which ... | 08/15/1995 |
| 5433652 | Glass sheet partial chamfering machine The present invention discloses a glass sheet chamfering machine which is improved such that it is suitable for a partial chamfering for a glass sheet. In the conventional glass sheet chamfering machine, and in carrying out a partial chamfering with this ... | 07/18/1995 |
| 5423558 | Semiconductor wafer carrier and method An improved semiconductor wafer carrier provides gimballing motion of the wafer to dynamically align the wafer to a polishing platen. This gimballing motion is achieved by providing a conical receptacle which has a spring friction fit with a spherical but... | 06/13/1995 |
| 5423716 | Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied An apparatus for acquiring, holding, and releasing a wafer includes a soft resilient membrane that covers a horizontal backing plate. The lower face of the backing plate includes a number of recessed areas to which a vacuum can selectively be applied. To ... | 06/13/1995 |
| 5380387 | Lens blocking/deblocking method In a method for manufacturing ophthalmic, telescopic, microscopic, etc. lenses, the use of a radiation (e.g., UV or visible light) curable adhesive formulation containing a predominant amount of an acrylic capped organic prepolymer; a lesser amount of an ... | 01/10/1995 |
| 5368645 | Vacuum chuck for coating apparatus Apparatus for coating the surface of an object with a coating material are disclosed. The apparatus comprise a vacuum chuck assembly suitable for holding the object to be coated in a downward, i.e., inverted position, and a coating material applicator mov... | 11/29/1994 |
| 5365700 | Apparatus and method for producing magnetic head sliders A magnetic head slider producing apparatus includes a rotary lapping member having a lapping surface, a work member having a surface, and an elastic member fastened to the surface of the work member. The elastic member has [adhesion properties] adhesive c... | 11/22/1994 |
| 5342067 | Method and apparatus for machining substrate plates for magnetic memory disks This invention relates to a method and apparatus for retaining disk-like structures, such as magnetic memory substrate plates, or disks, during machining, cutting, or grinding operations. A fluid is applied to one surface of the disk to retain the other s... | 08/30/1994 |
| 5329732 | Wafer polishing method and apparatus A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantia... | 07/19/1994 |
| 5036630 | Radial uniformity control of semiconductor wafer polishing Disclosed is an improved method of polishing a semiconductor wafer, which involves mounting the wafer to a wafer carrier comprising at least two materials having different coefficients of thermal expansion and regulating the temperature of the carrier, to... | 08/06/1991 |
| 4920700 | Process for finishing optical lenses and apparatus therefor A process and apparatus for finishing optical lenses including processing steps of smoothing and polishing of the lens, suitable in particular for the production of ophthalmic lenses, characterized by a special feature of replacing, after completion of th... | 05/01/1990 |
| 4869779 | Hydroplane polishing device and method A device for hydroplane polishing an exposed face of a sample includes a sample support having freedom of movement in a direction perpendicular to the exposed face; a polishing member having a surface opposite the exposed face; and a polishing fluid sourc... | 09/26/1989 |
| 4753049 | Method and apparatus for grinding the surface of a semiconductor A method and an apparatus for grinding the surface of a semiconductor wafer by moving a holding table and a grinding wheel relative to each other in a predetermined direction substantially parallel to the surface of the semiconductor wafer held onto the h... | 06/28/1988 |
| 4693036 | Semiconductor wafer surface grinding apparatus A grinding apparatus comprising a supporting base and at least one grinding wheel assembly disposed to face to the supporting base. The supporting base includes at least one holding table and the surface of the holding table protrudes beyond the surface o... | 09/15/1987 |
| 4680893 | Apparatus for polishing semiconductor wafers An apparatus for polishing semiconductor material is described in which a movable polishing arm is mounted to a cabinet. Connected to the polishing arm is a workpiece holder or sometimes referred to as a wafer chuck. Adjacent to the polishing arm is a loa... | 07/21/1987 |
| 4640651 | Computer memory disc and method for machining same A method for machining a thin workpiece to equalize machining induced stresses within the workpiece. The method produces a thin workpiece on which the machining lines intersect on the workpiece's machined surface. The method includes passing the workpiece... | 02/03/1987 |
| 4625463 | Wafer attracting and fixing device A work head for attracting and fixing an IC silicon wafer is comprised of an attracting disc and a base seat surrounding the periphery of the attracting disk. The attracting disc is of an inorganic substance shaped and sintered so that the upper layer of ... | 12/02/1986 |
| 4597228 | Vacuum suction device A vacuum suction device comprises a vacuum suction plate formed by baking a porous material and having a flat suction face for holding a workpiece by suction; a base abutting on a bottom of the vacuum suction plate for supporting the vacuum suction plate ... | 07/01/1986 |
| 4583325 | Grinding machine A grinding machine adapted for grinding surfaces of thin workpieces comprises a rotating table provided with at least a workpiece holder on which a workpiece to be ground is held, and a plurality of grinding wheels having different grain sizes ranging fro... | 04/22/1986 |
| 4520596 | Grinding or polishing machine for optical lenses A machine is of the type comprising an oscillating movable head with a tool-holding spindle, driven in rotation above a lens-support. The lens-support is borne by a vertically movable spindle which is mounted inside a sleeve, flared out at its upper part ... | 06/04/1985 |
| 4512113 | Workpiece holder for polishing operation The workholder includes a carrier to which a flat perforated template is removably secured. An insert is removably mounted in each hole and removably supports a silicon wafer to facilitate polishing the wafer.... | 04/23/1985 |
| 4498258 | Spindle tilting control device for a plane and spherical rotary grinding machine, fine grinding machine, lapping machine and polishing machine A spindle tilting control device for a plane and spherical rotary grinding machine, fine grinding machine, lapping machine and polishing machine, which are super precise machines for manufacturing microminiature electronic part components, which device em... | 02/12/1985 |
| 4481738 | Grinding machine A grinding machine adapted for grinding surfaces of thin workpieces comprises a rotating table provided with at least a workpiece holder on which a workpiece to be ground is held, and a plurality of grinding wheels having different grain sizes ranging fro... | 11/13/1984 |
| 4313284 | Apparatus for improving flatness of polished wafers Apparatus for improving polished wafer flatness such as slices of semiconductor materials through mounting of the wafers onto a deformable thin disc carrier which is mounted through a resilient device to a rotable pressure plate, the combined mounting bei... | 02/02/1982 |
| 4194324 | Semiconductor wafer polishing machine and wafer carrier therefor A carrier for semiconductor wafers to be polished is described, as well as mounting structure for securing the carrier within a polishing machine. The carrier is a relatively thick metal plate having on one of its faces, a sheet of material to which wafer... | 03/25/1980 |
| 4193226 | Polishing apparatus The polishing apparatus utilizes a pressure head that imparts rotary motion to a wafer to be polished during the polishing operation and is of such a structure so as to eliminate the need for the use of any bonding agent for holding the wafer in intimate ... | 03/18/1980 |
