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| Number | Title | Issue Date |
| 6893331 | Gimbal assembly for semiconductor fabrication and other tools A gimbal assembly that can be used in conjunction with semiconductor fabrication tools, such as chemical-mechanical polishing (CMP) tools, as well as other types of tools, is disclosed. A gimbal assembly may include a gimbal hub, a pivot head plate, a gimbal sleeve,... | 05/17/2005 |
| 6893332 | Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces The present invention is directed toward carrier assemblies, planarizing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces. In one embodiment, a carrier assembly for holding a microelectr... | 05/17/2005 |
| 6893336 | Polishing pad conditioner and chemical-mechanical polishing apparatus having the same A polishing pad conditioner for a chemical-mechanical polishing apparatus includes a conditioning plate having a first recess and a holder having a second recess. The first recess is formed on the upper face of the conditioning plate, and the second recess is formed... | 05/17/2005 |
| 6890249 | Carrier head with edge load retaining ring A carrier head for chemical mechanical polishing of a substrate having a front surface, a back surface and an edge. The carrier head has a base, an inner retaining ring positioned beneath the base, and an outer retaining ring surrounding the inner retaining ring to ... | 05/10/2005 |
| 6887137 | Chemical mechanical polishing slurry and chemical mechanical polishing method using the same Slurries for chemical mechanical polishing (CMP) are provided including a high planarity slurry and high selectivity ratio slurry. A high planarity slurry includes at least one kind of metal oxide abrasive particle and an anionic polymer passivation agent having a f... | 05/03/2005 |
| 6884146 | Systems and methods for characterizing a polishing process Systems and methods for characterizing a polishing process are provided. One method includes scanning a specimen with two or more measurement devices during polishing. In one embodiment, the two or more measurement devices may include a reflectometer and a capacitan... | 04/26/2005 |
| 6881134 | Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a membrane formed from a compressible, flexible material, such as neoprene or silicone, and having a first portion with a thickness greater than that of ... | 04/19/2005 |
| 6878038 | Combined eddy current sensing and optical monitoring for chemical mechanical polishing A chemical mechanical polishing apparatus has a polishing pad, a carrier to hold a substrate against a first side of the polishing surface, and a motor coupled to at least one of the polishing pad and carrier head for generating relative motion therebetween. An eddy... | 04/12/2005 |
| 6878039 | Polishing pad window for a chemical-mechanical polishing tool A polishing pad assembly for use in a chemical-mechanical polishing apparatus comprises a polishing pad having at least a first aperture therethrough and a platen for supporting the polishing pad having a second aperture therethrough at least a portion of which is l... | 04/12/2005 |
| 6878036 | Apparatus for monitoring a metal layer during chemical mechanical polishing using a phase difference signal A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the co... | 04/12/2005 |
| 6878045 | Ultrasonic conditioning device cleaner for chemical mechanical polishing systems A method and system for cleaning conditioning devices used in chemical mechanical polishing (CMP) systems is disclosed. The system includes a robotic arm for holding and transporting the conditioning device between the polish pad area of the machine and the conditio... | 04/12/2005 |
| 6875078 | Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a lase... | 04/05/2005 |
| 6872122 | Apparatus and method of detecting a substrate in a carrier head A method of detecting a substrate in a carrier head for a chemical mechanical polishing system includes connecting a chamber in a carrier head to a pressure source, measuring the pressure in the chamber as a function of time, calculating the derivative of the pressu... | 03/29/2005 |
| 6872129 | Edge contact loadcup A semiconductor wafer processing apparatus, more specifically, an edge contact loadcup for locating a semiconductor workpiece or wafer into a chemical mechanical retaining ring utilizing a cone, wafer chuck and flexure. The cone aligns the wafer concentrically to th... | 03/29/2005 |
| 6872131 | Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a membrane formed from a compressible, flexible material, such as neoprene or silicone, and having a first portion with a thickness greater than that of ... | 03/29/2005 |
| 6869335 | Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces Retaining rings, planarizing apparatuses including retaining rings, and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, a carrier head for retaining a micro-device workpiece during m... | 03/22/2005 |
| 6869345 | Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a membrane formed from a compressible, flexible material, such as neoprene or silicone, and having a first portion with a thickness greater than that of ... | 03/22/2005 |
| 6869348 | Retaining ring for wafer carriers A long-lasting retaining ring for wafer carriers used in chemical mechanical planarization. A groove is disposed around the retaining ring, with the groove opening facing the mounting plate. A ridge is disposed in the groove. A bladder is disposed in the groove and ... | 03/22/2005 |
| 6863599 | CMP pad having isolated pockets of continuous porosity and a method for using such pad A chemical mechanical polishing pad and a system and a method for using such a pad are described. The polishing pad includes pockets of continuous porosity, each of the pockets being separated from the other pockets by a non-porous matrix. The non-porous matrix may ... | 03/08/2005 |
| 6860798 | Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces The present invention is directed toward carrier assemblies, planarizing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces. In one embodiment, a carrier assembly for holding a microelectr... | 03/01/2005 |
| 6857947 | Advanced chemical mechanical polishing system with smart endpoint detection An apparatus for polishing a workpiece includes a workpiece holder configured to hold the workpiece, a polishing member configured to be positioned adjacent to a face of the workpiece in order to polish the workpiece face with a front side of the polishing member, a... | 02/22/2005 |
| 6857946 | Carrier head with a flexure A carrier head for a chemical mechanical polishing apparatus. The carrier head includes a housing, a base, a loading mechanism, a gimbal mechanism, and a substrate backing assembly. The substrate backing assembly includes a support structure positioned below the bas... | 02/22/2005 |
| 6857945 | Multi-chamber carrier head with a flexible membrane A carrier head that has a base assembly and a flexible membrane. The flexible membrane has a generally circular main portion with a lower surface that provides a substrate-mounting surface and a plurality of concentric annular portions extending from the main portio... | 02/22/2005 |
| 6857941 | Multi-phase polishing pad An article of manufacture, a method, and an apparatus for use in a chemical mechanical polishing system is provided. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a polishing surface, the polishin... | 02/22/2005 |
| 6857931 | Method of detecting a substrate in a carrier head A carrier head has a base, a flexible membrane, and a valve in the carrier head that forms part of a substrate detection system. The valve includes a valve stem that contacts an upper surface of the flexible membrane so that if a substrate is attached to the lower s... | 02/22/2005 |
| 6855043 | Carrier head with a modified flexible membrane A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane that applies a load to a substrate and a retaining ring. The friction coefficient of the lower surface of the flexible membrane is increased to prevent contact between the subs... | 02/15/2005 |
| 6855037 | Method of sealing wafer backside for full-face electrochemical plating The present invention provides a wafer carrier that includes an opening, which in one embodiment is a plurality of holes, disposed along the periphery of the wafer carrier. A gas emitted through the holes onto a peripheral back edge of the wafer assists in preventin... | 02/15/2005 |
| 6855034 | Polishing pad for semiconductor wafer and laminated body for polishing of semiconductor wafer equipped with the same as well as method for polishing of semiconductor wafer An objective of the present invention is to provide a polishing pad for a semiconductor wafer and a laminated body for polishing of a semiconductor wafer equipped with the same which can perform optical endpoint detection without lowering the polishing performance a... | 02/15/2005 |
| 6855032 | Fine force control of actuators for chemical mechanical polishing apparatuses An actuator assembly (432) for positioning a pad (48) includes a first actuator assembly (440), a second actuator subassembly (442) and a control system (524). In one embodiment, the first actuator subassembly (440) includes... | 02/15/2005 |
| 6852019 | Substrate holding apparatus The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being ... | 02/08/2005 |
| 6852017 | Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a membrane formed from a compressible, flexible material, such as neoprene or silicone, and having a first portion with a thickness greater than that of ... | 02/08/2005 |
| 6848981 | Dual-bulge flexure ring for CMP head A diaphragm flexure for a polishing head on a chemical mechanical polisher, particularly a Titan (TM) polishing head. The diaphragm flexure includes an annular flexure body having at least one bulge or protrusion formed in the upper surface thereof and at least one ... | 02/01/2005 |
| 6848977 | Polishing pad for electrochemical mechanical polishing The present invention provides a polishing pad for electrochemical mechanical polishing of conductive substrate. The pad comprises a plurality of grooves formed in a polishing surface of the polishing pad, the grooves being adapted to facilitate the flow of polishin... | 02/01/2005 |
| 6848980 | Vibration damping in a carrier head A carrier head has a backing assembly with a substrate support surface, a housing connectable to a drive shaft to rotate with the drive shaft about a rotation axis, and a dampening material in a load path between the backing assembly and the housing. The dampening m... | 02/01/2005 |
| 6848974 | Polishing pad for semiconductor wafer and polishing process using thereof An object of the present invention is to provide a polishing pad for a semiconductor wafer which can perform a stable polishing while preventing a polishing layer from floating up from a supporting layer and a surface of a polishing pad from bending during polishing... | 02/01/2005 |
| 6846227 | Electro-chemical machining appartus The electro-chemical machining apparatus of this invention is designed to smoothing a metal film by efficiently reducing initial rough surface and removing excessive metal film with reduced damages to the metal film. For this end, the electro-chemical machining appa... | 01/25/2005 |
| 6843707 | Methods for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing CMP methods reduce a cause of differences between an edge profile of a chemical mechanical polished edge of a wafer and a center profile of a chemical mechanical polished central portion of the wafer within the edge. The wafer is mounted on a carrier surface of a wa... | 01/18/2005 |
| 6840845 | Wafer polishing apparatus The wafer polishing apparatus enables the control of proper polishing pressure, so that the quality of wafers can be maintained high. A wafer holding head is composed of a carrier for pressing the wafer against a polishing pad, a retainer ring at the circumference o... | 01/11/2005 |
| 6840846 | Polishing station of a chemical mechanical polishing apparatus An apparatus for polishing a wafer includes a polishing station having a platen on which a polishing pad is installed, a polishing head having a membrane that contacts a surface of the wafer, the membrane securing the wafer and pressuring the wafer against the polis... | 01/11/2005 |
| 6840847 | Device for polishing digital storage discs A device for polishing digital storage discs including a polishing plate rotatably driven about a vertical axis, the upper side of which has a polishing cloth, wherein the polishing cloth is interrupted by a ring-shaped recess concentric with the axis of the polishi... | 01/11/2005 |
