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An armor with rollers is provided that enables a user to move in all positions by rolling on a hard and smooth surface while constantly varying his bearing points on the ground.
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| Number | Title | Issue Date |
| 7648410 | Polishing pad and chemical mechanical polishing apparatus A polishing pad and a CMP apparatus are provided. The polishing pad includes a plurality of patterns formed of trenches having a predetermined size and may include a groove for slurry flow. The plurality of patterns can include herringbone shaped trenches in concent... | 01/19/2010 |
| 7625263 | Optical disk restoration apparatus The present invention intends to provide an optical disk restoration apparatus that is simple structured and small sized to reduce the production cost, and that can evenly apply a substantially uniform pressing force. This object can be achieved by an optical disk r... | 12/01/2009 |
| 7438795 | Electrochemical-mechanical polishing system Provided is a polishing apparatus and polishing pad, intended for polishing a substrate, and designed for improved flow and distribution of a polishing composition to the area of interaction between the pad and substrate. In one aspect, a polishing pad is provided h... | 10/21/2008 |
| 7435158 | Initial position setting method of grinding wheel in vertical double disc surface grinding machine The present invention provides an initial position setting method of grinding wheels, before starting a grinding operation, in a vertical double disc surface grinding machine for surface grinding the upper and lower grinding surfaces of a work-piece simultaneously b... | 10/14/2008 |
| 7422514 | Dental crown polishing apparatus A dental crown polishing apparatus has a motor, a ball bearing assembly around a shaft of the motor and having balls rotating and circularly moving around the motor shaft by receiving torque from the motor shaft, a brush assembly on the periphery of the ball bearing... | 09/09/2008 |
| 7416474 | Planarization apparatus The present invention is a planarization apparatus for planarizing a coating film applied on a substrate before the coating film is hardened, including a contact body such as a brush or sponge brought into contact with a front surface of the coating film on the subs... | 08/26/2008 |
| 7410411 | Method of determining the number of active diamonds on a conditioning disk The invention relates to a method for determining the number of active diamonds on a conditioning disk. In particular, the method comprises (a) contacting a diamond conditioner disk with a hard surface, wherein the diamond-containing side of the diamond conditioning... | 08/12/2008 |
| 7381116 | Polishing media stabilizer A polishing apparatus that employs a polishing media retention arrangement to prevent slippage or wrinkles in the polishing media during polishing. The polishing media is drawn against a support surface by a vacuum applied between the polishing media and the support... | 06/03/2008 |
| 7367871 | Semiconductor processing methods of removing conductive material The invention includes a semiconductive processing method of electrochemical-mechanical removing at least some of a conductive material from over a surface of a semiconductor substrate. A cathode is provided at a first location of the wafer, and an anode is provided... | 05/06/2008 |
| 7367872 | Conditioner disk for use in chemical mechanical polishing A conditioner disk for use on a polish pad in chemical mechanical polishing process includes a base structure a plurality of curved blades supported by the base structure. The blades radiate outwardly from a center region of the base structure and curve in a common ... | 05/06/2008 |
| 7367867 | Two-side working machine A two-side working machine, comprising an upper and a lower working disc which hold on, and are fixed to, an upper and a lower carrier disc, and which are disposed coaxially with each other and are adapted to be rotationally driven relative to each other by a workin... | 05/06/2008 |
| 7367773 | Apparatus for combining or separating disk pairs simultaneously Various methods and apparatus are provided for merging and demerging pairs of disks. In one embodiment, pairs of merged disks are first separated and then transferred to separate cassettes such that all of the disks in the separate cassettes are oriented in the same... | 05/06/2008 |
| 7364497 | Polish pad and chemical mechanical polishing apparatus comprising the same A polishing pad for use in chemically mechanically polishing a semiconductor substrate enhances the uniformity of the rate at which material is removed from the surface of the semiconductor substrate, thereby ensuring the reproducibility of the chemical mechanical p... | 04/29/2008 |
| 7364493 | Lap grinding and polishing machine An apparatus, system and method for grinding or polishing an optic is provided. The apparatus includes a shell adapted to a bending profile, torque actuators attached at an outer edge of the shell and coupled to each other, a tensioning system attached at the outer ... | 04/29/2008 |
| 7364496 | Polishing head for polishing semiconductor wafers A polishing head and method for handling and polishing semiconductor wafers uses a base structure with at least one recess region and an outer flexible membrane that can conform to the at least one recess region to form at least one depression to hold a semiconducto... | 04/29/2008 |
| 7357842 | Cluster tool architecture for processing a substrate A cluster tool for processing a substrate includes a cassette and a processing module including a first processing chamber that is configured to perform a chill process on a substrate, a second processing chamber that is configured to perform a bake process on the s... | 04/15/2008 |
| 7354332 | Technique for process-qualifying a semiconductor manufacturing tool using metrology data A technique of the present invention utilizes qualification characteristics from a single wafer for qualifying a semiconductor manufacturing tool. Generally speaking, the technique commences with the processing of a wafer by the manufacturing tool. During processing... | 04/08/2008 |
| 7354334 | Reducing polishing pad deformation A polishing system can have a polishing pad with a polishing surface and a bottom surface that includes a recess with a thickness less than the thickness of the polishing pad. An in-situ monitoring module can be positioned in a cavity formed in part by the recess. A... | 04/08/2008 |
| 7347767 | Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces Retaining rings and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces are disclosed herein. A carrier head configured in accordance with one embodiment of the invention can be used to retain a micro-device workpiece duri... | 03/25/2008 |
| 7341502 | Methods and systems for planarizing workpieces, e.g., microelectronic workpieces Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator which is adapted to change an optical property in response to a planarizing condition. This process indicator may, for example, change color in response to reaching a particular... | 03/11/2008 |
| 7335088 | CMP system with temperature-controlled polishing head A chemical mechanical polish system for polishing a wafer includes a polishing head; an inner tube connected to the polishing head, wherein the inner tube is filled with a heat media; a media heater connected to the inner tube; and a pressure controller connected to... | 02/26/2008 |
| 7331847 | Vibration damping in chemical mechanical polishing system A carrier head for chemical mechanical polishing, includes a base, a support structure attached to the base having a surface for contacting a substrate, and a retaining structure attached to the base to prevent the substrate from moving along the surface. The retain... | 02/19/2008 |
| 7328512 | Self-contained vacuum saw A self-contained vacuum circular saw is presented. The vacuum saw has a casing around the saw blade that includes an accordion type lower section attached to the lower platform of the saw. A number of vacuum tubes, preferably four, are attached to the side of the ci... | 02/12/2008 |
| 7329171 | Fixed abrasive article for use in modifying a semiconductor wafer An abrasive article that includes a fixed abrasive element having a plurality of abrasive particles, a resilient element, and a plurality of rigid segments disposed between the fixed abrasive element and the resilient element. ... | 02/12/2008 |
| 7326103 | Vertically adjustable chemical mechanical polishing head and method for use thereof The invention provides a vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof. ... | 02/05/2008 |
| 7322098 | Method of simultaneous two-disk processing of single-sided magnetic recording disks Various methods and apparatus for simultaneously processing two single-sided hard memory disks is provided. Disks are positioned in pairs, with one surface of one disk positioned adjacent one surface of the second disk, with the disk surfaces touching or with a slig... | 01/29/2008 |
| 7323415 | Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer An objective of the present invention is to provide a polishing pad for a semiconductor wafer and a laminated body for polishing of a semiconductor wafer equipped with the same which can perform optical endpoints detection without lowering the polishing performance ... | 01/29/2008 |
| 7316600 | Metal working method to reduce thermal damage A method for grinding a feature in a work-piece is set forth which includes the step of rotating a grinding wheel about a first axis. The method also includes the step of traversing the rotating grinding wheel and a work-piece relative to one another along a second ... | 01/08/2008 |
| 7316605 | Sheet for mounting polishing workpiece and method for making the same The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate and a surface layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interi... | 01/08/2008 |
| 7314401 | Methods and systems for conditioning planarizing pads used in planarizing substrates Monitoring the process of planarizing a workpiece, e.g., conditioning a CMP pad, can present some difficulties. Aspects of this invention provide methods and systems for monitoring and/or controlling such a planarization cycle. For example, a control system may moni... | 01/01/2008 |
| 7312154 | Method of polishing a semiconductor-on-insulator structure A method of polishing a semiconductor layer formed on a transparent substrate is described, the method including measuring the thickness of the semiconductor from the substrate side of the semiconductor layer simultaneously with the polishing, and using the thicknes... | 12/25/2007 |
| 7311590 | Polishing pad with grooves to retain slurry on the pad texture A rotational chemical mechanical polishing pad designed for use with a polishing medium. The polishing pad includes a polishing layer having a polishing surface containing a plurality of grooves. At least a portion of each of the plurality of grooves has a shape and... | 12/25/2007 |
| 7303462 | Edge bead removal by an electro polishing process A method and apparatus for the removal of a deposited conductive layer along an edge of a substrate using an electrode configured to electro polish a substrate edge are disclosed. The electro polishing of the substrate edge may occur simultaneously during electroche... | 12/04/2007 |
| 7303466 | Carrier head of chemical mechanical polishing apparatus having barriers dividing pressure chamber into a plurality of pressure zones A carrier head of a chemical mechanical polishing apparatus has a support, an elastic membrane secured to the support and spaced from the bottom surface of the support so that a pressure chamber is defined between the membrane and the bottom surface of the support; ... | 12/04/2007 |
| 7291057 | Apparatus for polishing a substrate A method of polishing substrates enables the size of a polishing table to be reduced. A surface of a substrate to be polished is brought into contact with a polishing surface of a polishing table in such a manner that a portion of the surface of the substrate extend... | 11/06/2007 |
| 7285233 | Method of manufacturing polishing pad A method of manufacturing a polishing pad is described. A mold having a mold cavity therein is provided. At least a strip is buried in the mold. A polymer foam material is injected into the mold cavity of the mold. The polymer foam material is cured to mold the poly... | 10/23/2007 |
| 7278905 | Apparatus and method for conditioning polishing surface, and polishing apparatus and method of operation A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then the conditioned pad portion may be used again for polishing. The con... | 10/09/2007 |
| 7273408 | Paired pivot arm The present invention relates to an apparatus and method for polishing semiconductor substrates. In one embodiment, two polishing heads are mounted on two independent pivoting arms that share one pivot point. Each of the pivoting arms enable the corresponding polish... | 09/25/2007 |
| 7261621 | Pad conditioner for chemical mechanical polishing apparatus A pad conditioner may include a surface having a first region including a portion having relatively irregular shaped and friable polishing particles, and a second region including a portion having relatively regular shaped and tough polishing particles. The relative... | 08/28/2007 |
| 7258598 | Polishing solution supply system, method of supplying polishing solution, apparatus for and method of polishing semiconductor substrate and method of manufacturing semiconductor device A first supply unit sprays and supplies abrasive slurry containing abrasive grains into a mixing unit. A second supply unit sprays and supplies additive into the mixing unit. A third supply unit sprays and supplies pure water into the mixing unit. The mixing unit mi... | 08/21/2007 |
