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| Number | Title | Issue Date |
| 7341649 | Apparatus for electroprocessing a workpiece surface The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer using an electr... | 03/11/2008 |
| 7338353 | Loading device for chemical mechanical polisher of semiconductor wafer The present invention related to a loading device for a chemical mechanical polisher of semiconductor wafers comprising: a loading cup on wherein a cup plate is installed in a cup-shaped bath, a loading plate for receiving wafers sits on the cup plate, and a plurali... | 03/04/2008 |
| 7335092 | Carrier head for workpiece planarization/polishing A carrier head for supporting a workpiece is provided. The carrier head comprises a mount plate having an aperture therethrough, and a clamp ring having a foot portion and a first leg portion extending therefrom. The first leg portion extends through the aperture, a... | 02/26/2008 |
| 7331847 | Vibration damping in chemical mechanical polishing system A carrier head for chemical mechanical polishing, includes a base, a support structure attached to the base having a surface for contacting a substrate, and a retaining structure attached to the base to prevent the substrate from moving along the surface. The retain... | 02/19/2008 |
| 7329174 | Method of manufacturing chemical mechanical polishing pad The present invention relates to a method of manufacturing a chemical mechanical polishing pad which provides a chemical mechanical polishing pad which fully suppresses the occurrence of a scratch on the polished surface and has an excellent polishing rate. T... | 02/12/2008 |
| 7326105 | Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces Retaining rings and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces are disclosed herein. A carrier head configured in accordance with one embodiment of the invention can be used to retain a micro-device workpiece duri... | 02/05/2008 |
| 7323415 | Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer An objective of the present invention is to provide a polishing pad for a semiconductor wafer and a laminated body for polishing of a semiconductor wafer equipped with the same which can perform optical endpoints detection without lowering the polishing performance ... | 01/29/2008 |
| 7316605 | Sheet for mounting polishing workpiece and method for making the same The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate and a surface layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interi... | 01/08/2008 |
| 7316602 | Constant low force wafer carrier for electrochemical mechanical processing and chemical mechanical polishing A carrier head for holding a workpiece during processing of a workpiece surface is provided. The carrier head includes a carrier housing, a base and a pressure member. The base is configured to hold the workpiece and is movable with respect to the carrier housing. T... | 01/08/2008 |
| 7314402 | Method and apparatus for controlling slurry distribution A method and apparatus for ‘through-the-pad’ delivery of slurry polishing agents directly to the land areas of a polishing pad is disclosed. The present invention further provides for improved control of the chemical composition of the slurry to address loss of ... | 01/01/2008 |
| 7309278 | Lean presser for holding eyeglass lens and eyeglass lens processing apparatus having the same A lens presser for holding an eyeglass lens includes: a base member which is to be attached to a distal end of a lens chucking shaft; an abutting member which has an abutting surface which is to be abutted on a rear refractive surface of the lens; a movable member t... | 12/18/2007 |
| 7306509 | Processing device, processing method and method of manufacturing semiconductor device A CMP apparatus 1 is constructed comprising a wafer chucking mechanism 20 which carries and holds a wafer W, a polishing pad 4 which performs polishing working on the surface of the wafer W that is being worked, and a polishing head 2 whi... | 12/11/2007 |
| 7303466 | Carrier head of chemical mechanical polishing apparatus having barriers dividing pressure chamber into a plurality of pressure zones A carrier head of a chemical mechanical polishing apparatus has a support, an elastic membrane secured to the support and spaced from the bottom surface of the support so that a pressure chamber is defined between the membrane and the bottom surface of the support; ... | 12/04/2007 |
| 7303599 | Manufacture of lapping board A method for manufacturing a lapping board having abrasive grains fixed on its surface, which is performed by the steps of: preparing a rotatable metal board having a surface of soft metal, an abrasive slurry-supplying tool arranged over the surface of the metal boa... | 12/04/2007 |
| 7303662 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 12/04/2007 |
| 7300332 | Polished state monitoring apparatus and polishing apparatus using the same A polished state monitoring apparatus capable of easily grasping the progress of polishing is provided. The polished state monitoring apparatus monitors the progress of polishing of a surface to be polished by obtaining a characteristic value indicating a state of t... | 11/27/2007 |
| 7301773 | Semi-compliant joining mechanism for semiconductor cooling applications A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection apparatus as a single-point load. The retaining force is applied along a v... | 11/27/2007 |
| 7294040 | Method and apparatus for supporting a microelectronic substrate relative to a planarization pad A method and apparatus for planarizing a microelectronic substrate. In one embodiment, one surface of the microelectronic substrate is engaged with a planarizing pad and the opposite surface of the microelectronic substrate is positioned proximate to a substrate sup... | 11/13/2007 |
| 7294038 | Process control in electrochemically assisted planarization In one embodiment, a pad assembly for electro-processing a substrate is provided which includes a first conductive layer having a working surface adapted to contact the substrate during a polishing process, an intermediate layer coupled to the first conductive layer... | 11/13/2007 |
| 7291063 | Polyurethane urea polishing pad The present invention relates to an article for altering a surface of a workpiece, or a polishing pad having a window. In particular, the polishing pad includes a polyurethane urea material wherein the polyurethane urea material contains cells which are at least par... | 11/06/2007 |
| 7285145 | Electro chemical mechanical polishing method and device for planarizing semiconductor surfaces Embodiments of the invention include a method for electro chemical mechanical polishing of a substrate. The process includes flowing an electro chemical mechanical polishing (ECMP) slurry having a high viscosity with a polishing agent over a portion of the substrate... | 10/23/2007 |
| 7278908 | Polishing disk for a tool for the fine machining of optically active surfaces on spectacle lenses in particular A polishing disk for a tool for the fine machining of optically active surfaces on spectacle lenses in particular is disclosed, which comprises a support body, to which a foam layer is attached, wherein a polishing film bears against the foam layer. The polishing fi... | 10/09/2007 |
| 7276446 | Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies Planarizing solutions, planarizing machines and methods for planarizing microelectronic-device substrate assemblies using mechanical and/or chemical-mechanical planarizing processes. In one aspect of the invention, a microelectronic-device substrate assembly is plan... | 10/02/2007 |
| 7273407 | Transparent polishing pad The present invention relates to a polishing pad useful for planarizing a substrate in a CMP process using a polishing composition. The polishing pad is transparent and allows for the use of an in-situ optical end-point detection apparatus without the need for a sep... | 09/25/2007 |
| 7273408 | Paired pivot arm The present invention relates to an apparatus and method for polishing semiconductor substrates. In one embodiment, two polishing heads are mounted on two independent pivoting arms that share one pivot point. Each of the pivoting arms enable the corresponding polish... | 09/25/2007 |
| 7267607 | Transparent microporous materials for CMP The invention is directed to a chemical-mechanical polishing pad substrate comprising a microporous closed-cell foam characterized by a narrow pore size distribution in the range of about 0.01 microns to about 10 microns. The polishing pad is produced by foaming a s... | 09/11/2007 |
| 7264536 | Polishing pad with window A polishing layer of a polishing has a window member with a top surface positioned a predetermined distance below the polishing surface. A transparent layer can be positioned below the polishing layer and supporting the window member. ... | 09/04/2007 |
| 7264641 | Polishing pad comprising biodegradable polymer The invention is directed to a polishing pad for use in chemical-mechanical polishing comprising a biodegradable polymer. The biodegradable polymer comprises a repeat unit selected from the group consisting of glycolic acid, lactic acid, hydroxyalkanoic acids, hydro... | 09/04/2007 |
| 7261621 | Pad conditioner for chemical mechanical polishing apparatus A pad conditioner may include a surface having a first region including a portion having relatively irregular shaped and friable polishing particles, and a second region including a portion having relatively regular shaped and tough polishing particles. The relative... | 08/28/2007 |
| 7258520 | Methods and apparatus for using substrate carrier movement to actuate substrate carrier door opening/closing A system for opening a substrate carrier includes a substrate carrier having an openable portion. The substrate carrier also has an opening mechanism coupled to the openable portion. A substrate transfer location has a support adapted to support a substrate carrier.... | 08/21/2007 |
| 7252582 | Optimized grooving structure for a CMP polishing pad A polishing pad for a chemical mechanical polishing has a body rotatable in a predetermined direction and having a working surface, the working surface being provided with grooves, the grooves being formed so that over the course of a single revolution of the pad sa... | 08/07/2007 |
| 7252871 | Polishing pad having a pressure relief channel The present invention provides a chemical mechanical polishing pad comprising a window formed in the polishing pad, the window having a void provided on a side thereof. The polishing pad further comprises a void-pressure relief channel provided in the polishing pad ... | 08/07/2007 |
| 7252736 | Compliant grinding wheel A pre-planarization module configured to perform a long range planarization operation is provided. The pre-planarization module includes a semiconductor substrate support configured to rotate about a first axis. The pre-planarization module also includes an annular ... | 08/07/2007 |
| 7252577 | Methods for lapping using pneumatically actuated flexible coupling end effectors Methods for performing surface lapping using a robotic system are provided. In one embodiment, a method for lapping a surface includes providing a lapping assembly having a first base coupled to a second base by a flexible coupling member, and a lapping medium coupl... | 08/07/2007 |
| 7247084 | Polishing head elbow fitting An improvement is provided for a wafer carrier having an annular inflatable tube for exerting pressure on the edge of a perforated plate during wafer dechucking, and a flexible plastic tube for supplying pressure to the annular inflatable tube. The improvement compr... | 07/24/2007 |
| 7247083 | Polishing apparatus The polishing apparatus is capable of precisely controlling polishing pressure, correctly positioning a press plate and uniformly polishing a workpiece. In the polishing apparatus, a holding head comprises: first pressing means for introducing a pressurized fluid in... | 07/24/2007 |
| 7244168 | Methods for reducing delamination during chemical mechanical polishing Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a ... | 07/17/2007 |
| 7241202 | Substrate polishing apparatus A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a tab... | 07/10/2007 |
| 7243003 | Substrate carrier handler that unloads substrate carriers directly from a moving conveyor In a first aspect, a substrate loading station is served by a conveyor which continuously transports substrate carriers. A substrate carrier handler that is part of the substrate loading station operates to exchange substrate carriers with the conveyor while the con... | 07/10/2007 |
| 7238083 | Wafer carrier with pressurized membrane and retaining ring actuator A wafer carrier for controlling downward force and edge effect during chemical mechanical planarization. A retaining ring actuator is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. ... | 07/03/2007 |
