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| Number | Title | Issue Date |
| 7357704 | Polishing pad An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally co... | 04/15/2008 |
| 7354334 | Reducing polishing pad deformation A polishing system can have a polishing pad with a polishing surface and a bottom surface that includes a recess with a thickness less than the thickness of the polishing pad. An in-situ monitoring module can be positioned in a cavity formed in part by the recess. A... | 04/08/2008 |
| 7354475 | Adsorption filter material and its use A gas and water vapor pervious adsorption filter material having a protective function against biological and chemical noxiants and poisons and a multilayered layer construction including a first sheetlike carrier layer, a second sheetlike carrier layer and, interpo... | 04/08/2008 |
| 7354336 | Abrading tool and method for refurbishing electrical connector pin contacts An abrading tool for refurbishing pin contacts in situ in an electrical connector is provided. The abrading tool includes a bore defined in a first end for receiving the pin contacts therein and a transverse slot which intersects the bore. A removable abrading eleme... | 04/08/2008 |
| 7350518 | Blade ring saw blade A flat-sided annular blade for a blade ring saw for cutting hard material such as tile along straight paths and curved paths in which the workpiece is moved through the central portion of the blade. In addition to the usual sintered abrasive diamond coating on the o... | 04/01/2008 |
| 7344574 | Coated abrasive article, and method of making and using the same A coated abrasive article has a backing treatment preparable by at least partially polymerizing an isotropic backing treatment precursor comprising polyepoxide, polyfunctional urethane (meth)acrylate, non-urethane polyfunctional (meth)acrylate, acidic free-radically... | 03/18/2008 |
| 7344575 | Composition, treated backing, and abrasive articles containing the same A curable composition comprises epoxy resin preparable by reaction of epichlorohydrin with at least one of bisphenol A or bisphenol F, polyfunctional urethane(meth)acrylate, dicyandiamide and photoinitiator. The curable composition is useful for preparing treated ba... | 03/18/2008 |
| 7341502 | Methods and systems for planarizing workpieces, e.g., microelectronic workpieces Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator which is adapted to change an optical property in response to a planarizing condition. This process indicator may, for example, change color in response to reaching a particular... | 03/11/2008 |
| 7337700 | Precision tool holder with flexure-adjustable, three degrees of freedom for a four-axis lathe A precision tool holder for precisely positioning a single point cutting tool on 4-axis lathe, such that the center of the radius of the tool nose is aligned with the B-axis of the machine tool, so as to facilitate the machining of precision meso-scale components wi... | 03/04/2008 |
| 7338349 | Apparatus and process for cylindrically grinding workpieces An apparatus for cylindrically grinding workpieces includes a first holding tool (100) for positioning pre-grinding workpieces (40) and a second holding tool (200) for positioning partially ground workpieces (i.e. workpieces which have been grou... | 03/04/2008 |
| 7338348 | Dust collection system for a belt sander An electrically powered belt sander comprising a housing, a dust flow path defined by the housing, a motor mounted in the housing at a first location and having an output shaft, a fan connectable to the motor output shaft and rotateably mounted in the housing at a s... | 03/04/2008 |
| 7338569 | Method and system of using offset gage for CMP polishing pad alignment and adjustment A method and system are provided using an offset dial gage for alignment and adjustment of a polishing pad that has been attached to a turntable of a chemical mechanical polishing (CMP) device. In a described embodiment, an offset dial gage has a surface that contac... | 03/04/2008 |
| 7335090 | Substrate processing apparatus and substrate handling method A substrate processing apparatus includes: a carrier holding unit for holding a carrier which houses a substrate; a substrate holding mechanism for holding a substrate when a predetermined process is executed on the substrate; and a substrate transfer mechanism for ... | 02/26/2008 |
| 7332438 | Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a ... | 02/19/2008 |
| 7331843 | Substrate polishing method and method of manufacturing semiconductor device The substrate polishing method of the present invention can be used, in a substrate polishing apparatus having multiple carriers for one polishing pad, for determining a polishing time necessary to obtain a specific amount of polishing in polishing substrates using ... | 02/19/2008 |
| 7328637 | Apparatus for machining a cylinder bore surface and method of machining the cylinder bore surface using the apparatus An apparatus for machining a circumferential surface defining a cylindrical bore of a workpiece, the apparatus including a tool holder rotatable about a first rotation axis, and a form roller supported on the tool holder so as to be rotatable about a second rotation... | 02/12/2008 |
| 7329170 | Method of producing polishing pad A method of producing a polishing pad having a polishing layer is characterized in that the polishing layer is produced by a photolithographic method including: forming a sheet molding from a curing composition containing at least an initiator and an energy ray-reac... | 02/12/2008 |
| 7326102 | Apparatus for lapping thin film magnetic heads A lapping method and apparatus is provided that increases the yield rate in the magnetic head slider manufacturing process. According to the invention, an apparatus for lapping thin film magnetic heads includes a jig block and a lapping plate. The jig block includes... | 02/05/2008 |
| 7322362 | Nail treating tool and method of treating nails A nail treating tool having a graspable handle, a first treating surface, and a second treating surface. The first and second treating surfaces are interchangeably placeable in an operative position relative to the graspable handle such that the graspable handle can... | 01/29/2008 |
| 7316600 | Metal working method to reduce thermal damage A method for grinding a feature in a work-piece is set forth which includes the step of rotating a grinding wheel about a first axis. The method also includes the step of traversing the rotating grinding wheel and a work-piece relative to one another along a second ... | 01/08/2008 |
| 7314377 | Electrical power connector A pair of mating connectors includes a receptacle having an insulative housing and at least one conductive receptacle contact with a pair of spaced walls forming a plug contact receiving space. The plug connector has an insulative housing and at least one conductive... | 01/01/2008 |
| 7312160 | Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor device The removing solution containing a cerium (IV) nitrate salt, periodic acid or a hypochlorite can be applied to metals containing copper, silver or palladium and also to metals containing other metals having a relatively large oxidation-reduction potential. ... | 12/25/2007 |
| 7311588 | Water grinder A water grinder including: a housing in which a rotary shaft is drivably disposed, the rotary shaft being formed with an axial passage; a water incoming flow way formed in the housing; a valve disposed in the housing and controllable by a selection switch; an extern... | 12/25/2007 |
| 7309242 | Power connector A pair of mating connectors includes a receptacle having an insulative housing and at least one conductive receptacle contact with a pair of spaced walls forming a plug contact receiving space. The plug connector has an insulative housing and at least one conductive... | 12/18/2007 |
| 7306509 | Processing device, processing method and method of manufacturing semiconductor device A CMP apparatus 1 is constructed comprising a wafer chucking mechanism 20 which carries and holds a wafer W, a polishing pad 4 which performs polishing working on the surface of the wafer W that is being worked, and a polishing head 2 whi... | 12/11/2007 |
| 7305744 | Apparatus for forming a power transmission belt An apparatus for forming a power transmission belt/belt sleeve with first and second shafts around which a belt/belt sleeve preform is trained. The belt/belt sleeve preform is guided and driven in an endless path around the shaft. A cutter bears against the belt/bel... | 12/11/2007 |
| 7303600 | Unexpanded perlite ore polishing composition and methods An unexpanded perlite ore polishing composition is shown. The composition comprises base material having grains of unexpanded perlite ore of a selected distribution of particle sizes which undergo fracturing of the grains as a function of an abrasive force applied t... | 12/04/2007 |
| 7303461 | Method of machining airfoils by disc tools A method for machining a rotor having a disc and a plurality of integral airfoils projecting outwardly from the disc, according to one aspect of the invention, comprises a step of machining each airfoil with a disc tool having a grinding periphery thereof adapted fo... | 12/04/2007 |
| 7303463 | Semiconductor wafer polishing apparatus, and method of polishing semiconductor wafer Aimed at thoroughly preventing abrasive and dusts from adhering onto the circuit-forming region of a wafer, improving yield ratio of semiconductor devices, and thereby improving operation rates of the individual manufacturing apparatuses in the succeeding stage, a s... | 12/04/2007 |
| 7303691 | Polishing method for semiconductor wafer A polishing method includes a slurry adjusting step for adjusting a polishing slurry containing silica particles so that the number of silica particles having a composition ratio of Si/O of 50–60 wt %/40–50 wt %, a modulus of elasticity of 1.4×1010 P... | 12/04/2007 |
| 7300876 | Method for cleaning slurry particles from a surface polished by chemical mechanical polishing A method is provided to clean slurry particles from a surface in which tungsten and dielectric are coexposed after a dielectric CMP step. Such a surface is formed when tungsten features are patterned and etched, the tungsten features are covered with dielectric, and... | 11/27/2007 |
| 7300341 | Dental grinding tool and method for making the same The present invention provides a dental grinding tool which is unlikely to damage gums and capable of finely shaping a formation part on which a crown is placed, and further provides a method for making the same. The dental grinding tool is made by forming a chamfer... | 11/27/2007 |
| 7300479 | Compositions for abrasive articles A structured abrasive article, methods of making an abrasive article, and methods of using an abrasive article. The abrasive composites forming the abrasive article have a height of at least 500 micrometers, and the abrasive particles in the composites have an avera... | 11/27/2007 |
| 7297170 | Method of using abrasive product The invention provides a method and apparatus for making an abrasive product comprising providing a substantially horizontally deployed flexible backing having a first surface bearing an at least partially cured primer coating and an opposite second surface; providi... | 11/20/2007 |
| 7294158 | Abrasive product, method of making and using the same, and apparatus for making the same The invention provides a method and apparatus for making an abrasive product comprising providing a substantially horizontally deployed flexible backing having a first surface bearing an at least partially cured primer coating and an opposite second surface; providi... | 11/13/2007 |
| 7294043 | CMP apparatus and process sequence method A CMP apparatus and process sequence. The CMP apparatus includes multiple polishing pads or belts and an in-line metrology tool which is interposed between adjacent polishing pads or belts in the apparatus. A material layer on each of multiple wafers is successively... | 11/13/2007 |
| 7291055 | Wafer polishing method and apparatus The present invention provides a wafer polishing method and a polishing apparatus which are capable of preventing peripheral sags of a wafer due to polishing and then manufacturing the wafer, especially an SOI wafer at a high flatness level. There is provided a wafe... | 11/06/2007 |
| 7288019 | Method of changing the surface wettability of polymer materials The present invention belongs to the field of surface modification of solid materials, specifically relates to a method of changing the surface wettability of polymer materials. The method of the present invention comprises of rubbing the surface of the polymer mate... | 10/30/2007 |
| 7288465 | Semiconductor wafer front side protection There is provided a method for making a wafer comprising the steps of providing a substrate having a first surface, an opposite second surface, and at least one side edge defining a thickness of the substrate, the at least one side edge having a first peripheral reg... | 10/30/2007 |
| 7285038 | Sanding attachment for a reciprocating power tool A sanding attachment, for use in conjunction with an existing reciprocating power tool, for sanding a rough surface of an existing object. The sanding attachment comprises a main part being an elongated strip of metal having an attachment end for selective attachmen... | 10/23/2007 |
