Bizarre Patents
Decorative Jeweled Wheel Cover
An improved wheel is provided wherein decorative items such as gem stones are embedded in either the wheel surface, a special mounting section attached to the wheel surface, or to a spoke strap that wraps around each spoke and positions embedded gem stones on the outside surface of the spoke.
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| Number | Title | Issue Date |
| 7435158 | Initial position setting method of grinding wheel in vertical double disc surface grinding machine The present invention provides an initial position setting method of grinding wheels, before starting a grinding operation, in a vertical double disc surface grinding machine for surface grinding the upper and lower grinding surfaces of a work-piece simultaneously b... | 10/14/2008 |
| 7399217 | Lapping machine A lapping machine includes upper and lower lapping wheels and a sprocket having a common centered rotational axis. A rotational drive source for at least one of the upper and lower lapping wheels provides rotational movement about the axis. At least two independentl... | 07/15/2008 |
| 7367867 | Two-side working machine A two-side working machine, comprising an upper and a lower working disc which hold on, and are fixed to, an upper and a lower carrier disc, and which are disposed coaxially with each other and are adapted to be rotationally driven relative to each other by a workin... | 05/06/2008 |
| 7364495 | Wafer double-side polishing apparatus and double-side polishing method The present invention provides a wafer double-side polishing apparatus comprising at least a carrier plate having wafer holding holes; upper and lower turn tables to which polishing pads are attached; and a slurry supply means; with wafers held in the wafer holding ... | 04/29/2008 |
| 7347770 | Two-sided surface grinding apparatus A two-sided surface grinding apparatus capable of eliminating undulations of concentric circles produced in the work surfaces by grinding, thereby further improving the degree of flatness of the work surfaces after grinding includes a pair of support pads which hold... | 03/25/2008 |
| 7300335 | Glass substrate for data recording medium, manufacturing method thereof and polishing pad used in the method A polishing pad is used when a surface of a glass workpiece is polished for manufacturing a glass substrate of information recording medium. The polishing pad has a nap layer. The nap layer includes an inner layer that contains a plurality of closed cells, and an ou... | 11/27/2007 |
| 7267602 | Seal assembly manufacturing methods Finishing a seal assembly as a unit is proposed, which prevents alignment of the end gaps of the annular body and the annular ring of the seal assembly, provides the ability to manufacture the seal assembly to very low tolerances, and establishes virtually perfect p... | 09/11/2007 |
| 7255635 | Polishing apparatus In polishing apparatus of the present invention, collars can be easily exchange. The polishing apparatus comprises: an outer pin gear having an inner gear section; an inner pin gear having an outer gear section; and a carrier having outer gear teeth, which are engag... | 08/14/2007 |
| 7207865 | Apparatus for machining workpieces, in particular workpieces provided with cutting teeth In an apparatus for machining workpieces, in particular workpieces provided with cutting teeth, such as bandsaw blades or circular-saw blades for example, comprising a base (12), a machining device (18) displaceable relative to the base (12) and... | 04/24/2007 |
| 7207870 | Seal assembly manufacturing methods and seal assemblies manufactured thereby Finishing a seal assembly as a unit is proposed, which prevents alignment of the end gaps of the annular body and the annular ring of the seal assembly, provides the ability to manufacture the seal assembly to very low tolerances, and establishes virtually perfect p... | 04/24/2007 |
| 7186165 | Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to polish at least one semiconductor wafer while another semiconductor wa... | 03/06/2007 |
| 7147541 | Thickness control method and double side polisher The object of the present invention is to provide a double side polisher capable of maintaining thickness control accuracy over a long period of time without being affected by a gradual change in thickness of a polishing pad, and a thickness control method. The firs... | 12/12/2006 |
| 7137867 | Thickness control method and double side polisher The object of the present invention is to provide a thickness control method for a double side polisher, accuracy of which is not affected by wearing of polishing pad and applicable to polishing of nonconductive work pieces. An eddy current sensor in a cavity of an ... | 11/21/2006 |
| 7115026 | Polishing apparatus An upper polishing plate is moved downward until facing a lower polishing plate to polish a work piece. The upper polishing plate is rotated in a horizontal plane together with a first elastic member, a second elastic member, an outer member and a connecting member.... | 10/03/2006 |
| 7104867 | Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to polish at least one semiconductor wafer while another semiconductor wa... | 09/12/2006 |
| 7101258 | Double sided polishing machine Double-sided polishing machine with an upper and a lower working disc, each comprising a polishing disc and a carrier disc. The working disc are co-axially arranged and rotatable relative to each other, a polishing gap being formed between the polishing discs. Said ... | 09/05/2006 |
| 7077726 | Semiconductor wafer with improved local flatness, and method for its production A process for producing semiconductor wafers comprises simultaneous grinding of both sides of the semiconductor wafers in a single step, 1S-DDG, wherein this grinding is the only material-removing mechanical machining step which is used to machine the surfaces of th... | 07/18/2006 |
| 7022001 | Polishing apparatus The small polishing apparatus is capable of simultaneously polishing both side faces of a work piece, and a lower polishing plate, an internal gear and a sun gear are respectively driven by direct drive (DD) motors. The polishing apparatus comprises: an upper and a ... | 04/04/2006 |
| 7008310 | Wafer carrier wear indicator A wafer carrier for use in polishing disks. The wafer carrier includes a main body and an integral visual inspection wear indicator. The main body has at least one opening formed therein adapted to receive a disk. The visual inspection wear indicator provides a visu... | 03/07/2006 |
| 7008308 | Wafer carrier A wafer carrier for retaining at least one semiconductor wafer in a processing apparatus during a processing operation which removes wafer material by at least one of abrading and chemical reaction. The processing apparatus is adapted for removing wafer material fro... | 03/07/2006 |
| 7004815 | Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to polish at least one semiconductor wafer while another semiconductor wa... | 02/28/2006 |
| 7004816 | Grinding method for vertical type of double disk surface grinding machine A grinding method for a vertical type of double disk surface grinding machine comprising a pair of rotating grinding wheels vertically opposed to each other and vertically movable and a moving table for moving a work having a work holding jig, wherein vertical posit... | 02/28/2006 |
| 7001244 | Polishing apparatus A polishing apparatus is provided for accurately detecting the relative displacement between an upper wheel and a lower wheel and thus for reliably polishing workpieces to a desired thickness. The polishing apparatus includes an upper wheel for pressing at least one... | 02/21/2006 |
| 6942545 | Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to polish at least one semiconductor wafer while another semiconductor wa... | 09/13/2005 |
| 6942544 | Method of achieving very high crown-to-camber ratios on magnetic sliders A method of precisely controlling the amount of flatness or curvature in a lapping plate is disclosed. The lapping plate is formed from two layers of metal alloys, such as tin-antimony and steel. A bimetallic effect is exploited to induce a linear expansion in the p... | 09/13/2005 |
| 6942069 | Braking system for a wheeled abrading machine An abrading machine braking system for use in braking a wheeled abrading machine having a rotating abrading tool used in abrading a surface. The abrading machine braking system uses two braking wheels that engage the surface of the wheels of the abrading machine and... | 09/13/2005 |
| 6932685 | Vertical type of double disc surface grinding machine for a brake disc A vertical type of double disc surface grinding machine of the present invention comprises a clamp device which can clamps and holds a work like a brake disc at a correct clamping position under a stable state even when a configuration of a work upper surface is com... | 08/23/2005 |
| 6887127 | Polishing apparatus A polishing apparatus is provided for accurately detecting the relative displacement between an upper wheel and a lower wheel and thus for reliably polishing workpieces to a desired thickness. The polishing apparatus includes an upper wheel for pressing at least one... | 05/03/2005 |
| 6852012 | Cluster tool systems and methods for in fab wafer processing The present invention provides exemplary cluster tool systems and methods for processing wafers, such as semiconductor wafers. One method includes providing (710) a wafer having initial thickness variations between two wafer surfaces. The wafer is subjected t... | 02/08/2005 |
| 6846228 | Structure for a polishing machine of an optical disk A structure for a polishing machine of an optical disk, which comprises a motor, a turntable unit integrated with a housing, at least two polishing wheel positioned on a cover which can cover up the housing, and a timer. When the cover is closed, the polishing wheel... | 01/25/2005 |
| 6830505 | Polishing machine The polishing machine is capable of evenly applying a pressing force from an upper polishing plate to work pieces accommodated in through-holes of carriers. The polishing machine comprises: a plurality of the carriers provided around a center of gravity of an upper ... | 12/14/2004 |
| 6787055 | Carrier heads, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies Planarizing machines, carrier heads for planarizing machines and methods for planarizing microelectronic-device substrate assemblies in mechanical or chemical-mechanical planarizing processes. In one embodiment of the invention, a carrier head includes a backing pla... | 09/07/2004 |
| 6752687 | Method of polishing disks A method of preparing for a disk polishing operation includes providing a polishing machine having a first and a second superposed platen. A first polishing pad is on the first platen and a second polishing pad is on the second platen. A plurality of carriers are di... | 06/22/2004 |
| 6726525 | Method and device for grinding double sides of thin disk work A double side grinding apparatus comprises a pair of grinding wheels (4), work rotating device (1) and moving device (2). The apparatus operates to bring the grinding faces (4a) into contact with the respective work surfaces (a) to... | 04/27/2004 |
| 6669535 | Platform table for cleaning parts An apparatus is provided for cleaning parts in a production line. The part is placed on the apparatus at an ergonomically comfortable height and angle with respect to the worker, thus avoiding fatigue, while at the same time providing a faster turn-around... | 12/30/2003 |
| 6514121 | Polishing chemical delivery for small head chemical mechanical planarization Specific embodiments of the present invention provide a chemical-mechanical planarization apparatus for planarizing an object comprising a shaft having a shaft axis and being connected with a polishing head which is coupled to a polishing pad. The polishi... | 02/04/2003 |
| 6478665 | Multi-wafer polishing tool A wafer polishing tool is disclosed which includes a polishing platen which is rotatable about a central platen axis, and a wafer carrier which supports a wafer for rotational movement to cause a portion of a surface of the wafer to only intermittently co... | 11/12/2002 |
| 6454635 | Method and apparatus for a wafer carrier having an insert A method for repairing a wafer carrier after plural processing operations during which the carrier holds a plurality of semiconductor wafers in a processing apparatus which removes wafer material by at least one of abrading and chemical reaction. The wafe... | 09/24/2002 |
| 6419564 | Grinding device and method Grinding wheels are fabricated with outwardly extending circular peripheral rims having a continuous rim surface to which separate abrasive pieces, preferably of a superabrasive such as CBN, are secured by suitable adhesive. The superabrasive pieces are p... | 07/16/2002 |
| 6419555 | Process and apparatus for polishing a workpiece A process for abrasive machining of wafer-like workpieces, especially semiconductor wafers. The process uses carrier disks in which the outer periphery on which the driving forces mesh, is made of a material having a tensile strength of at least 100 N/mm | 07/16/2002 |
