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Microwave Oven With Removable Storage Cassette in Dashboard of Motor Vehicle
A microwave oven adapted for use within a motor vehicle dashboard area. The microwave oven has a removable storage cassette, and slidable platforms for securing and serving containers of beverages and foods.
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| Number | Title | Issue Date |
| 7367867 | Two-side working machine A two-side working machine, comprising an upper and a lower working disc which hold on, and are fixed to, an upper and a lower carrier disc, and which are disposed coaxially with each other and are adapted to be rotationally driven relative to each other by a workin... | 05/06/2008 |
| 7364495 | Wafer double-side polishing apparatus and double-side polishing method The present invention provides a wafer double-side polishing apparatus comprising at least a carrier plate having wafer holding holes; upper and lower turn tables to which polishing pads are attached; and a slurry supply means; with wafers held in the wafer holding ... | 04/29/2008 |
| 7347770 | Two-sided surface grinding apparatus A two-sided surface grinding apparatus capable of eliminating undulations of concentric circles produced in the work surfaces by grinding, thereby further improving the degree of flatness of the work surfaces after grinding includes a pair of support pads which hold... | 03/25/2008 |
| 7220171 | Cutting cup for sphere making machines A cutting cup for a sphere making machine. The cutting cup includes a cylindrical ring having an outer wall, an inner wall, a bottom wall, and a top wall, the top wall having at least one beveled facet angled downwardly from the outer wall to the inner wall. A cutti... | 05/22/2007 |
| 7150674 | Both-side grinding method and both-side grinding machine for thin disc work Detecting the deviation of the grinding wheel position from the amount of work deformation after grinding, and correctly adjusting the grinding wheel position, it provides both-side grinding techniques for making the work excellent in flatness and parallelism. When ... | 12/19/2006 |
| 7131900 | Grinding wheel in combination with a grinding ring A combination between a grinding ring and a grinding wheel is disclosed, wherein the grinding ring has a centrally defined hole, a tubular extension extending from a periphery defining the hole, an annular extension extending from an outer periphery of the tubular e... | 11/07/2006 |
| 7125313 | Apparatus and method for abrading a workpiece An apparatus for abrading a workpiece comprises a first plate assembly having a first surface for supporting a workpiece and a second plate assembly having a second surface for engaging the workpiece to abrade a portion thereof. A displacement shaft is mounted for m... | 10/24/2006 |
| 7101258 | Double sided polishing machine Double-sided polishing machine with an upper and a lower working disc, each comprising a polishing disc and a carrier disc. The working disc are co-axially arranged and rotatable relative to each other, a polishing gap being formed between the polishing discs. Said ... | 09/05/2006 |
| 7077726 | Semiconductor wafer with improved local flatness, and method for its production A process for producing semiconductor wafers comprises simultaneous grinding of both sides of the semiconductor wafers in a single step, 1S-DDG, wherein this grinding is the only material-removing mechanical machining step which is used to machine the surfaces of th... | 07/18/2006 |
| 7063607 | Bowling ball resurfacing apparatus A bowling ball resurfacing apparatus comprises a housing, first and second vertical support rollers mounted to the housing for rotation about parallel vertical axes, each of the vertical support rollers adapted to make contact with the surface of the bowling ball at... | 06/20/2006 |
| 7029380 | Double-side polishing method and apparatus In order to improve a flatness of a work in single wafer type double-side polishing in which one wafer is polished with one carrier, a carrier larger in diameter than upper and lower surface plates that rotate is inserted between the surface plates, and a wafer smal... | 04/18/2006 |
| 7014540 | Device for the precision working of planar surfaces A device for the precision working of planar surfaces, in particular for the plane finishing, has a tool (13), which has an outer and an inner operating surface (36, 44). These are designed like cup wheels, which fit into one another, and are rotatable... | 03/21/2006 |
| 7004816 | Grinding method for vertical type of double disk surface grinding machine A grinding method for a vertical type of double disk surface grinding machine comprising a pair of rotating grinding wheels vertically opposed to each other and vertically movable and a moving table for moving a work having a work holding jig, wherein vertical posit... | 02/28/2006 |
| 6984167 | Polishing agent and lapping method Disclosed are a polishing agent containing at least globular-silica powder and alumina powder, as well as a lapping method in which a workpiece is held between an upper turn table and a lower turn table and is lapped by rotating the upper and the lower turn tables w... | 01/10/2006 |
| 6976903 | Apparatus for controlling retaining ring and wafer head tilt for chemical mechanical polishing A CMP system accurately measures eccentric forces applied to carriers for wafer or polishing pad conditioning pucks. An initial coaxial relationship between wafer axis of rotation and a carrier axis is maintained during application of the eccentric force, such that ... | 12/20/2005 |
| 6932685 | Vertical type of double disc surface grinding machine for a brake disc A vertical type of double disc surface grinding machine of the present invention comprises a clamp device which can clamps and holds a work like a brake disc at a correct clamping position under a stable state even when a configuration of a work upper surface is com... | 08/23/2005 |
| 6846228 | Structure for a polishing machine of an optical disk A structure for a polishing machine of an optical disk, which comprises a motor, a turntable unit integrated with a housing, at least two polishing wheel positioned on a cover which can cover up the housing, and a timer. When the cover is closed, the polishing wheel... | 01/25/2005 |
| 6767428 | Method and apparatus for chemical mechanical planarization An invention is provided for a chemical mechanical planarization apparatus. The apparatus includes a cylindrical frame, a polishing membrane attached to an end of the cylindrical frame, and a pad support disposed within the cylindrical frame and below the polishing ... | 07/27/2004 |
| 6733368 | Method for lapping a wafer An improved method for lapping the opposed major surfaces of a wafer is provided. In this regard, a multi-step lapping process is provided in which lapping continues while transitioning from a first slurry having larger abrasive particles to a second slurry having s... | 05/11/2004 |
| 6726525 | Method and device for grinding double sides of thin disk work A double side grinding apparatus comprises a pair of grinding wheels (4), work rotating device (1) and moving device (2). The apparatus operates to bring the grinding faces (4a) into contact with the respective work surfaces (a) to... | 04/27/2004 |
| 6402600 | Bowling ball surface abrading and polishing tool assembly This invention consists of a two-component cylindrical tool assembly suitable for contour rough abrading, texturing, fine surface abrading and extra fine polishing of a spherical surface. The tool body, fabricated from a rigid material, is smaller in diam... | 06/11/2002 |
| 6309280 | Method of grinding semiconductor articles Disclosed is a method of grinding semiconductor articles comprising the steps of: dicing a semiconductor wafer having bumps formed on one surface into individual chips or pellets; putting the pellets on a printed-wiring board with their flat, bump-less su... | 10/30/2001 |
| 6299514 | Double-disk polishing machine, particularly for tooling semiconductor wafers A double-disk polishing machine, particularly for tooling semiconductor wafers, comprising a machine housing, an upper and a lower working disk, carrier disks for the lower and upper working disks either of which is connected to a vertical driving shaft w... | 10/09/2001 |
| 6273783 | Concentric machining device and method There are provided a concentric machining device and method. The concentric machining device is used to machine the outer curcumferential surface of a cylindrical body having an inner diameter and an outer diameter with respect to the center of the inner ... | 08/14/2001 |
| 6261161 | Sharpener assembly for a food slicer and related method A sharpener assembly for a food slicer includes a rotatable frame with a sharpening member and a truing member operatively connected for rotation with the frame. The frame is mounted on a food slicer to place the sharpening member and truing member on opp... | 07/17/2001 |
| 6250997 | Processing machine A lapping or polishing machine which processes the surface of silicon wafer or other work piece by rotating a platen with constant supply of lapping or polishing compound. Said platen of the lapping or polishing machine is connected directly to a direct d... | 06/26/2001 |
| 6217433 | Grinding device and method Grinding wheels are fabricated with outwardly extending circular peripheral rims having a continuous rim surface to which separate abrasive pieces, preferably of a super abrasive such as CBN, are secured by suitable adhesive. The superabrasive pieces are ... | 04/17/2001 |
| 6210259 | Method and apparatus for lapping of workpieces A lapping assembly for lapping a group of workpieces including a pair of lapping discs and a cassette for positioning the workpieces between the lapping discs. The lapping discs are provided with two-component translational oscillations at the appropriate... | 04/03/2001 |
| 6196901 | Method of double-side lapping a wafer and an apparatus therefor A pair of ring-shaped lapping plates 13, 23 are faced to both surfaces of a wafer 1. Each lapping plate 13, 23 has an outer diameter approximately equal to a radius of the wafer 1 and a lapping surface 14, 24 sliding in contact with the wafer 1. Each lapp... | 03/06/2001 |
| 6186875 | Bowling ball surfacing machine A machine for lapping bowling balls and, thus, re-rounding, smoothing, and cleaning the balls. The machine is comprised of three concave abrasion blocks with drive motors, adjustable mounting brackets attached to an adjustable support table, a catch basin... | 02/13/2001 |
| 6176767 | Double face abrading machine A double face abrading machine for simultaneous removal of material from two plane-parallel surfaces of a work piece, and incorporating a first and a second tool (1, 2) forming between them a machining gap (3), the first tool (1) being attached to a first... | 01/23/2001 |
| 6152804 | Grinding method and grinding apparatus A work W is rotated on a lower grinding wheel 13 provided on a work support base 11. Both surfaces of the work W are simultaneously subjected to grinding process by an upper grinding wheel 24 provided on a grinding shaft 22 of a grinding head 21 and the l... | 11/28/2000 |
| 6142859 | Polishing apparatus A bristle carrier for leaning a polishing apparatus comprises a number of radial slots into which sub-frames carrying bristles can be releasably mounted. The bristle carrier is used in place of a component carrier used during normal polishing, and is driv... | 11/07/2000 |
| 6139405 | Method of making a motor-vehicle brake-disk assembly A brake disk is machined the by first fitting to a wheel hub centered on a hub axis and having a radially projecting flange a wheel bearing having an outer bearing race formed with an axially directed mounting surface for attachment to a motor vehicle. Th... | 10/31/2000 |
| 6099387 | CMP of a circlet wafer using disc-like brake polish pads Apparatus and method for polishing one or both sides of a semiconductor wafer that has a central opening are provided. In one aspect, the apparatus includes a mandrel for holding the wafer and a motor coupled to the mandrel that is operable to rotate the ... | 08/08/2000 |
| 6074275 | Polishing system and method of control of same A polishing system and a method of control of the same enabling reliable transfer of the workpieces into and out of the system while maintaining the precision of polishing of the workpieces. Provision is made of a polishing apparatus 1, a first transfer a... | 06/13/2000 |
| 6001005 | Polishing apparatus A polishing machine includes a platform assembly mounted within three support columns. The platform assembly includes fluidically pressurized bladders for urging the upper polish plate toward and away from the lower polish plate. In one embodiment a movab... | 12/14/1999 |
| 5989108 | Double side grinding apparatus for flat disklike work A double side grinding apparatus for thin disklike work comprises a pair of rotatable grinding wheels having opposed circular grinding faces provided by respective end faces and so arranged as to be movable relative to each other axially thereof, and work... | 11/23/1999 |
| 5975997 | Method of double-side lapping a wafer and an apparatus therefor A pair of ring-shaped lapping plates 13, 23 are faced to both surfaces of a wafer 1. Each lapping plate 13, 23 has an outer diameter approximately equal to a radius of the wafer 1 and a lapping surface 14, 24 sliding in contact with the wafer 1. Each lapp... | 11/02/1999 |
| 5964651 | Apparatus for polishing planar substrates through rotating plates An apparatus for polishing one or more planar substrates, such as magnetic disks, between rotating polishing plates is described. The apparatus is designed to optimize uniformity and flatness of the substrates by maintaining a substantially constant paral... | 10/12/1999 |
