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| Number | Title | Issue Date |
| 8002610 | Double side polishing method and apparatus To provide a technique for rotating a plurality of carriers 500 between an upper and a lower rotary surface plates to simultaneously polish both surfaces of a plurality of works 400. The work 400 is merged with the carrier 500 outside a p... | 08/23/2011 |
| 7722443 | Knife blade dressing apparatus A dressing device for sharpening or conditioning of a blade or the like includes one or more disk pairs each having a pair of disks respectively presenting a plurality of ribs. The disks are oriented in face-to-face relationship with the ribs thereof in meshed, inte... | 05/25/2010 |
| 7435158 | Initial position setting method of grinding wheel in vertical double disc surface grinding machine The present invention provides an initial position setting method of grinding wheels, before starting a grinding operation, in a vertical double disc surface grinding machine for surface grinding the upper and lower grinding surfaces of a work-piece simultaneously b... | 10/14/2008 |
| 7399217 | Lapping machine A lapping machine includes upper and lower lapping wheels and a sprocket having a common centered rotational axis. A rotational drive source for at least one of the upper and lower lapping wheels provides rotational movement about the axis. At least two independentl... | 07/15/2008 |
| 7367867 | Two-side working machine A two-side working machine, comprising an upper and a lower working disc which hold on, and are fixed to, an upper and a lower carrier disc, and which are disposed coaxially with each other and are adapted to be rotationally driven relative to each other by a workin... | 05/06/2008 |
| 7364495 | Wafer double-side polishing apparatus and double-side polishing method The present invention provides a wafer double-side polishing apparatus comprising at least a carrier plate having wafer holding holes; upper and lower turn tables to which polishing pads are attached; and a slurry supply means; with wafers held in the wafer holding ... | 04/29/2008 |
| 7347770 | Two-sided surface grinding apparatus A two-sided surface grinding apparatus capable of eliminating undulations of concentric circles produced in the work surfaces by grinding, thereby further improving the degree of flatness of the work surfaces after grinding includes a pair of support pads which hold... | 03/25/2008 |
| 7300335 | Glass substrate for data recording medium, manufacturing method thereof and polishing pad used in the method A polishing pad is used when a surface of a glass workpiece is polished for manufacturing a glass substrate of information recording medium. The polishing pad has a nap layer. The nap layer includes an inner layer that contains a plurality of closed cells, and an ou... | 11/27/2007 |
| 7270592 | Milling machine The improved milling machine makes use of individually controlled x-axis, y-axis, and z-axis carriages. These carriages provide positive and precise control of the position of the cutting tools and the blank to be cut. The tools are located in spindles that are move... | 09/18/2007 |
| 7267602 | Seal assembly manufacturing methods Finishing a seal assembly as a unit is proposed, which prevents alignment of the end gaps of the annular body and the annular ring of the seal assembly, provides the ability to manufacture the seal assembly to very low tolerances, and establishes virtually perfect p... | 09/11/2007 |
| 7255635 | Polishing apparatus In polishing apparatus of the present invention, collars can be easily exchange. The polishing apparatus comprises: an outer pin gear having an inner gear section; an inner pin gear having an outer gear section; and a carrier having outer gear teeth, which are engag... | 08/14/2007 |
| 7252576 | Method and apparatus for magnetic float polishing A method of polishing workpieces in a magnetic float polishing chamber comprising a lower chamber piece and an upper chamber piece which is removably receivable in the lower chamber piece and is connected to a powered spindle for rotating the upper chamber piece in ... | 08/07/2007 |
| 7241209 | Orbiting polishing tool An orbiting polishing tool for at least one of polishing and material removal. The orbiting polishing tool may include a housing of a housing assembly rotatable about a first axis. The orbiting polishing tool may also include at least one abrasive wheel rotatable ab... | 07/10/2007 |
| 7226338 | Milling machine The improved milling machine makes use of individually controlled x-axis, y-axis, and z-axis carriages. These carriages provide positive and precise control of the position of the cutting tools and the blank to be cut. A tool changer allows the tools to be changed t... | 06/05/2007 |
| 7189143 | Machine for superfinishing by honing A honing machine for super finishing workpieces, e.g. by honing using a tool spindle (7), can be rotatably driven and can receive a tool. A motor rotates the tool spindle, the tool spindle (12) being arranged on a carriage (12), which can be dis... | 03/13/2007 |
| 7179155 | Device for grinding liquid crystal display panel Disclosed is a device for grinding a liquid crystal display panel improving the efficiency of using equipment by independently operating first and second grinding units for grinding the unit liquid crystal display panel. The present invention includes a first grindi... | 02/20/2007 |
| 7163650 | Process for producing ceramic bearing components A process for producing ceramic bearing components in which a material mixture is produced from an organometallic compound as a preceramic precursor and from silicon in element form or in the form of an alloy as a chemically reactive filler. The material mixture is ... | 01/16/2007 |
| 7150674 | Both-side grinding method and both-side grinding machine for thin disc work Detecting the deviation of the grinding wheel position from the amount of work deformation after grinding, and correctly adjusting the grinding wheel position, it provides both-side grinding techniques for making the work excellent in flatness and parallelism. When ... | 12/19/2006 |
| 7147541 | Thickness control method and double side polisher The object of the present invention is to provide a double side polisher capable of maintaining thickness control accuracy over a long period of time without being affected by a gradual change in thickness of a polishing pad, and a thickness control method. The firs... | 12/12/2006 |
| 7137867 | Thickness control method and double side polisher The object of the present invention is to provide a thickness control method for a double side polisher, accuracy of which is not affected by wearing of polishing pad and applicable to polishing of nonconductive work pieces. An eddy current sensor in a cavity of an ... | 11/21/2006 |
| 7134936 | Grinding head for a grinding machine for glass slabs, and machine equipped with such head A grinding machine (1) for glass slabs (2) comprising a grinding head (77) that comprises a supporting structure (9), grinding wheels (20, 28) for grinding and polishing the edge of the slab (2), and grinding wheels (24, ... | 11/14/2006 |
| 7125320 | Apparatus and method for grinding and/or polishing an edge of a glass sheet An apparatus and method are described herein which help prevent particles and other contaminants that are generated when an edge of a glass sheet is processed from contaminating or damaging the glass sheet. The apparatus includes an encapsulation device and a proces... | 10/24/2006 |
| 7125313 | Apparatus and method for abrading a workpiece An apparatus for abrading a workpiece comprises a first plate assembly having a first surface for supporting a workpiece and a second plate assembly having a second surface for engaging the workpiece to abrade a portion thereof. A displacement shaft is mounted for m... | 10/24/2006 |
| 7101253 | Load cup for chemical mechanical polishing A load cup for transferring a substrate in a chemical mechanical polishing system is provided. In one embodiment, a load cup for transferring substrates in a chemical mechanical polishing system includes a substrate support having a first side adapted to support a s... | 09/05/2006 |
| 7101258 | Double sided polishing machine Double-sided polishing machine with an upper and a lower working disc, each comprising a polishing disc and a carrier disc. The working disc are co-axially arranged and rotatable relative to each other, a polishing gap being formed between the polishing discs. Said ... | 09/05/2006 |
| 7083502 | Method for simultaneous two-disk texturing Various methods and apparatus for simultaneously texturing two single-sided hard memory disks is provided. The two disks are placed in a concentric contact merge orientation such that the outwardly facing surface of each disk may be simultaneously subjected to textu... | 08/01/2006 |
| 7052372 | Chemical-mechanical polisher hardware design A polish apparatus for planarizing wafers and films over wafers comprising the following. A substrate chuck for holding a substrate with a surface to be polished thereof being directed about vertically. A first drive means for rotating the substrate chuck. A polishi... | 05/30/2006 |
| 7029380 | Double-side polishing method and apparatus In order to improve a flatness of a work in single wafer type double-side polishing in which one wafer is polished with one carrier, a carrier larger in diameter than upper and lower surface plates that rotate is inserted between the surface plates, and a wafer smal... | 04/18/2006 |
| 7029366 | Method and apparatus for abrasive circular machining For the machining of a workpiece (18) rotating about a workpiece axis, a first abrasive tool (20), which rotates about a first tool axis, and the workpiece (18) are advanced towards one another, in order to machine a first workpiece face in a fi... | 04/18/2006 |
| 7021990 | Method and apparatus for circular grinding A method and apparatus for a circular grinding of a workpiece having first and second workpiece faces which are rotationally symmetrical with respect to the workpiece axis and which form a circular transition edge between them are provided. The workpiece rotating ab... | 04/04/2006 |
| 7022001 | Polishing apparatus The small polishing apparatus is capable of simultaneously polishing both side faces of a work piece, and a lower polishing plate, an internal gear and a sun gear are respectively driven by direct drive (DD) motors. The polishing apparatus comprises: an upper and a ... | 04/04/2006 |
| 7008310 | Wafer carrier wear indicator A wafer carrier for use in polishing disks. The wafer carrier includes a main body and an integral visual inspection wear indicator. The main body has at least one opening formed therein adapted to receive a disk. The visual inspection wear indicator provides a visu... | 03/07/2006 |
| 6984167 | Polishing agent and lapping method Disclosed are a polishing agent containing at least globular-silica powder and alumina powder, as well as a lapping method in which a workpiece is held between an upper turn table and a lower turn table and is lapped by rotating the upper and the lower turn tables w... | 01/10/2006 |
| 6976903 | Apparatus for controlling retaining ring and wafer head tilt for chemical mechanical polishing A CMP system accurately measures eccentric forces applied to carriers for wafer or polishing pad conditioning pucks. An initial coaxial relationship between wafer axis of rotation and a carrier axis is maintained during application of the eccentric force, such that ... | 12/20/2005 |
| 6896598 | Vertical type of double disc surface grinding machine In a vertical type of double disc surface grinding machine, an object of this invention is to enable simple adjustment of a parallelism between a grinding surface of a lower grinding wheel and a work end face clamped by a clamping jig of a rotary table, even when a ... | 05/24/2005 |
| 6881133 | Method of grinding for a vertical type of double disc surface grinding machine for a brake disc A double surface grinding method for a vertical type of double disc surface grinding machine in which upper and lower ground surfaces of a work like a disc brake are ground simultaneously. The entire vertical moving stroke of the grinding wheel includes an idle feed... | 04/19/2005 |
| 6852012 | Cluster tool systems and methods for in fab wafer processing The present invention provides exemplary cluster tool systems and methods for processing wafers, such as semiconductor wafers. One method includes providing (710) a wafer having initial thickness variations between two wafer surfaces. The wafer is subjected t... | 02/08/2005 |
| 6843704 | Method and apparatus for automatically loading a double-sided polishing machine with wafer crystals A method and apparatus for automatically loading and unloading wafer crystals to and from a double-sided polishing machine of the type having an upper and a lower polishing plate, runner disks with reception openings for the wafer crystals, and a drive to move runne... | 01/18/2005 |
| 6830505 | Polishing machine The polishing machine is capable of evenly applying a pressing force from an upper polishing plate to work pieces accommodated in through-holes of carriers. The polishing machine comprises: a plurality of the carriers provided around a center of gravity of an upper ... | 12/14/2004 |
| 6755724 | Device for grinding liquid crystal display panel Disclosed is a device for grinding a liquid crystal display panel improving the efficiency of using equipment by independently operating first and second grinding units for grinding the unit liquid crystal display panel. The present invention includes a first grindi... | 06/29/2004 |
