A method of swing on a swing is disclosed, in which a user positioned on a standard swing suspended by two chains from a substantially horizontal tree branch induces side to side motion by pulling alternately on one chain and then the other.
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8133099 | Reciprocating drive mechanism of abrasive band grinding machine The present invention provides a reciprocating lifting motion of abrasive band grinding machine, wherein two control boxes are arranged correspondingly at lower part of the grinding mechanism of the grinding machine; the grinding mechanism is driven by the drive axl... | 03/13/2012 |
| 7367873 | Substrate processing apparatus A substrate processing apparatus has a polishing tape and a polishing head for pressing the polishing tape against a peripheral portion of a semiconductor wafer. The substrate processing apparatus polishes the wafer due to sliding contact of the polishing tape and t... | 05/06/2008 |
| 7341502 | Methods and systems for planarizing workpieces, e.g., microelectronic workpieces Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator which is adapted to change an optical property in response to a planarizing condition. This process indicator may, for example, change color in response to reaching a particular... | 03/11/2008 |
| 7261618 | Device and method for abrading a wooden barrel A device for abrading a wooden barrel (13) includes a robot having elements (11, 17, 23) for loading a barrel (13), elements (29a, 29b, 33a, 33b) for gripping and rotating the barrel (13... | 08/28/2007 |
| 7241207 | Grinding machine and method for grinding a workpiece Disclosed is a grinding machine comprising oscillating driving means (3, 4) for setting grinding means (1) into an oscillating grinding motion and an actuation device (7) that is provided with a plurality of actuation areas (8) which can ... | 07/10/2007 |
| 7238094 | Belt oscillating apparatus of belt sander A belt oscillating apparatus of a belt sander, wherein the belt sander includes a machine frame, a driving wheel, a driven wheel, a sand belt mounted on the driving wheel and the driven wheel, and the belt oscillating apparatus is mounted on the machine frame, compr... | 07/03/2007 |
| 7229343 | Orbiting indexable belt polishing station for chemical mechanical polishing An apparatus for planarizing a workpiece has a web with a face which is positioned adjacent the workpiece during planarization. At least one tension assembly is configured to maintain tension of the web. An orbiting assembly is configured to orbit the web relative t... | 06/12/2007 |
| 7223160 | System for replacement of sheet abrasive A system for rapid replacement of abrasive in machinery which uses the abrasive to finish the surfaces of workpieces that pass through the machinery on a belt, such as so-called widebelt sanders. One preferred embodiment of the system employs an abrasive material th... | 05/29/2007 |
| 7189150 | System and method for edge blending hard drive head sliders A system and method are disclosed for edge blending hard drive head sliders by oscillating abrasive lapping tape across the edges of multiple sliders simultaneously. Lapping tape is inserted between each of a number of head sliders bonded to a edge blending jig of a... | 03/13/2007 |
| 7169025 | Grinding tool for a grinder with rotary oscillating drive Disclosed is a grinding tool for a grinder comprising a rotary oscillating drive, the output shaft of which is driven so as to oscillate back and forth about its longitudinal axis and is configured for securing the grinding tool thereon. The grinding tool comprises ... | 01/30/2007 |
| 7160182 | Support for sanding apparatus A support stand (2) for a sanding apparatus having a housing, a motor, and a sanding belt of abrasive material adapted to be driven around a plurality of rollers by means of the motor is disclosed. The support stand (2) comprises a body portion (6 | 01/09/2007 |
| 7156727 | Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates A web-format polishing pad for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies, and methods for making and using such a web-format pad. In one aspect of the invention, a web-format polishing pad for planarizing a microelec... | 01/02/2007 |
| 7144304 | Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the mi... | 12/05/2006 |
| 7115023 | Process tape for cleaning or processing the edge of a semiconductor wafer A wafer bevel processing apparatus comprises a plurality of rollers for rotatably supporting a wafer, first process roller, a second process roller, and a process tape extending between the first process roller and the second process roller. The first and second pro... | 10/03/2006 |
| 7087187 | Meta oxide coated carbon black for CMP Using coated carbon black particles, coated with a selected coating material, as an abrasive in slurries or polishing pads for chemical-mechanical polishing processes. By adjusting the coating material on the carbon black particles, new abrasive particles for chemic... | 08/08/2006 |
| 7086936 | Linear chemical mechanical planarization (CMP) system and method for planarizing a wafer in a single CMP module A linear chemical mechanical planarization (CMP) belt pad includes a first portion comprised of a first pad material, e.g., polyurethane, and a second portion comprised of a second pad material, e.g., porous rubber. The first portion has a first end and a second end... | 08/08/2006 |
| 7077733 | Subpad support with a releasable subpad securing element and polishing apparatus including the subpad support A subpad support for use in a web format or belt format polishing apparatus for polishing one or more layers of semiconductor device structures. The subpad support includes a subpad retention element for non-adhesively securing the subpad thereto. The subpad support... | 07/18/2006 |
| 7066787 | Substrate processing apparatus A substrate processing apparatus is used for removing surface irregularities occurring on a peripheral portion (a bevel portion, an edge portion, and a notch) of a substrate, such as a semiconductor wafer, and films deposited as a contaminant on the peripheral porti... | 06/27/2006 |
| 7063595 | Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the mi... | 06/20/2006 |
| 7037179 | Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates Methods and apparatuses for planarizing a microelectronic substrate. In one embodiment, a planarizing pad for mechanical or chemical-mechanical planarization includes a base section and a plurality of embedded sections. The base section has a planarizing surface, an... | 05/02/2006 |
| 7014544 | Reciprocating and deflecting swing device for the roller of a cylindrical emery-polishing machine A reciprocating and deflecting swing device for the roller of a cylindrical emery-polishing machine includes a motor fixing base having its inner side provided with a lower holder engaged thereon with an upper holder, with an emery-tape roller fitted in the upper ho... | 03/21/2006 |
| 7014529 | Substrate processing method and substrate processing apparatus A substrate processing apparatus polishes a to-be-polished portion of a semiconductor substrate with a polishing tape. Part of the polishing tape is heated in advance. Part of the polishing tape is deformed conforming to a shape of the to-be-polished portion. Part o... | 03/21/2006 |
| 7011566 | Methods and systems for conditioning planarizing pads used in planarizing substrates Monitoring the process of planarizing a workpiece, e.g., conditioning a CMP pad, can present some difficulties. Aspects of this invention provide methods and systems for monitoring and/or controlling such a planarization cycle. For example, a control system may moni... | 03/14/2006 |
| 7008303 | Web lift system for chemical mechanical planarization Generally, a method and system for lifting a web of polishing material is provided. In one embodiment, the system includes a platen that has a first lift member disposed adjacent to a first side and a second lift member disposed adjacent to a second side. The platen... | 03/07/2006 |
| 7001250 | Synchronous tape head polishing device and method In the tape head polishing method of the present invention the tape head is moved orthogonally to the polishing medium (such as diamond polishing tape) direction of motion during polishing. The polishing medium motion is synchronized with the tape head motion, such ... | 02/21/2006 |
| 6997789 | Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the mi... | 02/14/2006 |
| 6951511 | Platen with peripheral frame for supporting a web of polishing material in a chemical mechanical planarization system Generally, a method and apparatus for supporting a web of polishing material. In one embodiment, the apparatus includes a platen adapted to support the web, a frame assembly, and one or more flexures coupled between the platen and the frame assembly. The flexure all... | 10/04/2005 |
| 6942554 | Apparatus and process for polishing a substrate An apparatus for polishing a substrate with an optical surface. The apparatus contains a polishing pad and and a device for oscillating the polishing pad while simultaneously contacting it with at least 90 percent of said optical surface. ... | 09/13/2005 |
| 6939203 | Fluid bearing slide assembly for workpiece polishing A fluid bearing polishing apparatus for carrying a polishing member for chemical mechanical polishing includes a fluid supply and a fluid dispensing structure to support the polishing member. A method of polishing a workpiece includes supporting a polishing member o... | 09/06/2005 |
| 6918301 | Methods and systems to detect defects in an end effector for conditioning polishing pads used in polishing micro-device workpieces Methods and systems to detect defects in an end effector for conditioning polishing pads used in polishing micro-device workpieces are disclosed herein. In one embodiment, a method of detecting defects in an end effector includes applying energy to a contact element... | 07/19/2005 |
| 6918816 | Apparatus and method for polishing a fiber optic connector A fiber optic polishing apparatus including a support system, a polishing sub-assembly coupled to the support system including a plurality of pads, and a fixture to hold a plurality of fiber optic connectors. The fixture is positioned adjacent to the plurality of pa... | 07/19/2005 |
| 6916230 | Abrasive belt and machining process associated therewith A process and device for machining by abrasive belt, on a part 1 with an axis of rotation, of a non-cylindrical bearing surface 2, two portions of the same running abrasive belt 14, which are spaced apart from each other in the longitudinal dire... | 07/12/2005 |
| 6908368 | Advanced Bi-directional linear polishing system and method The present invention describes a chemical mechanical polishing apparatus and method that uses a portion of a polishing pad that is disposed under tension between a supply spool and a receive spool, with a motor providing the tension to either the supply spool or th... | 06/21/2005 |
| 6908369 | Apparatus for and method of smoothing substrate surface An apparatus for smoothing a surface of a rotatably supported substrate includes a base plate, a block having an extending arm structure and being attached to the base plate so as to be movable along the surface of the base plate, a roller attached to a tip portion ... | 06/21/2005 |
| 6902466 | Oscillating chemical mechanical planarization apparatus A chemical mechanical polishing (CMP) apparatus is provided. The CMP apparatus includes a first roller situated at a first point and a second roller situated at a second point. The first point is separate from the second point. Also included in the apparatus is a po... | 06/07/2005 |
| 6899594 | Relative lateral motion in linear CMP Apparatus and methods are disclosed that promote greater polishing uniformity in linear CMP systems by introducing a relative lateral motion between a CMP belt and a rotating polish head securing a wafer. A belt polish module comprises a linear CMP belt forming a lo... | 05/31/2005 |
| 6863598 | Equipment for grinding optical fiber end A device for grinding and polishing optical fiber ends. The device includes a holder and an elastic grinding surface. The holder is used to hold equidistantly a set of optical fibers such that the ends of the optical fibers are in contact with the elastic grinding s... | 03/08/2005 |
| 6835122 | Device for grinding an external sleeve surface Device for grinding an external sleeve surface on a rotationally symmetrical body comprises a support frame displaceable along the external sleeve surface of the body and to which a driven belt grinder is fixed, and pivoted running rollers spaced in the circumferent... | 12/28/2004 |
| 6800020 | Web-style pad conditioning system and methods for implementing the same A system for conditioning a pad is provided. The system includes a pad conditioning media, a feed-roll containing a supply of the pad conditioning media, and a take-up roll for receiving an end of the pad conditioning media. Further included in the system is a press... | 10/05/2004 |
| 6796880 | Linear polishing sheet with window A polishing article for chemical mechanical polishing. The polishing article includes a generally elongated polishing sheet with a polishing surface. The polishing article is formed from a material that is substantially opaque, and has a discrete region extending su... | 09/28/2004 |