Celebrity Inventors
Magician Harry Houdini patented a "Diver's Suit" enabling the wearer to "quickly divest himself of the suit while being submerged and to safely escape and reach the surface of the water."
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 6975055 | Dynamo-electric machine having a rotor with first and second axially or rotationally displaceable field magnets A dynamo-electric machine has a stator with a primary winding and a rotor with a field magnet and a shaft. the field magnet includes a first field magnet having diferent polarity magnetic poles sequentially arranged in a rotation direction and a second field magnet ... | 12/13/2005 |
| 6971944 | Method and control system for improving CMP process by detecting and reacting to harmonic oscillation A method and control system for detecting harmonic oscillation in a chemical mechanical polishing process and reacting thereto, such as by taking steps to at least one of: 1) reduce or eliminate the harmonic oscillation; and 2) counter the noise which is associated ... | 12/06/2005 |
| 6969307 | Polishing pad conditioning and polishing liquid dispersal system A pad conditioning system for conditioning a polishing pad in conjunction with polishing of a workpiece includes a pad conditioning head coupled with a positioning unit. The pad conditioning head includes a conditioning surface that is configured to be moved into co... | 11/29/2005 |
| 6969298 | Grinding machine, in particular centerless cylindrical grinding machine A grinding machine, in particular a centerless cylindrical grinding machine, comprising: a supporting table, at least one wheel disposed on at least one wheel carriage, a device for holding a workpiece to be machined, the wheel carriage being movable in each case in... | 11/29/2005 |
| 6969300 | Automated processing unit for a working station An automatic processing unit comprising a conveyor (1) extending through the automated processing unit and having a longitudinal direction and a transversal direction; and at least one working station located above the conveyor (1) for processing a wor... | 11/29/2005 |
| 6958000 | Finishing wheel holding mechanism for gear finishing apparatus A finishing wheel holding mechanism for a gear finishing apparatus using a finishing wheel having internal teeth, which permits simple and quick fitting or replacement of a finishing wheel is provided. The finishing wheel holding mechanism comprises a head frame ... | 10/25/2005 |
| 6958001 | Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces Carrier assemblies, planarizing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, the carrier assembly includes a head having a chamber, a magneti... | 10/25/2005 |
| 6957999 | Vehicle wheel rim polisher A vehicle wheel rim polisher may include: a spindle including a mounting end for accepting a vehicle wheel rim, the spindle being drivable to rotate the mounting end about an axis of rotation, a polishing head support and movement mechanism including a polishing hea... | 10/25/2005 |
| 6958006 | Grinding machine In a cylindrical grinding machine, a lateral surrounding cover is mounted on a bed and surrounds and covers lateral surfaces of a machining area in which a work support drive device, a grinding wheel and a bearing unit therefor are arranged and a slide area in which... | 10/25/2005 |
| 6955584 | Grinding machine comprising a measuring system and control for providing a master blade and method for providing a bar blade An apparatus includes a blade grinding machine, a measuring system and a control for providing a bar blade suitable for cutting work pieces. The blade grinding machine includes a clamping mechanism for mounting the bar blade and a grinding wheel for grinding the mou... | 10/18/2005 |
| 6953382 | Methods and apparatuses for conditioning polishing surfaces utilized during CMP processing Methods and apparatus are provided for conditioning of polishing surfaces utilized during CMP processing. The method comprises contacting the polishing surface and a conditioning surface with a first force, one of the surfaces coupled to a support member that has an... | 10/11/2005 |
| 6953383 | Method of determining current position data of a machining tool and apparatus therefor Current position data is determined of a first machining tool in a machining space having a second machining tool, the second tool having known position data with regard to the position data of the first tool which are to be determined, the first tool and the second... | 10/11/2005 |
| 6951500 | Workpiece-surface processing head A workpiece-surface processing head has at least one processing tool which comes into contact with the surface to be processed and whose longitudinal axis is oriented essentially perpendicularly to the surface to be processed. The processing tool, for processing the... | 10/04/2005 |
| 6945849 | Polishing method and polishing device A polishing method particularly suitable for mirror-polishing the concave surface of a lens and a polishing device, the method characterized by including the step of polishing work surfaces (50a, 50b) while allowing parts of the dome-shap... | 09/20/2005 |
| 6942556 | Polishing jig for bearing for use in back-up roll of rolling mill A polishing jig of a hydraulic integral system is improved to increase efficiency. A polishing jig 1 for bearing for use in back-up roll of rolling mill including a shaft member 2 on which an inner ring 104 of a bearing 100 for use in bac... | 09/13/2005 |
| 6942543 | Substrate polishing apparatus The substrate polishing apparatus for polishing a polishing surface of a substrate comprises a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includ... | 09/13/2005 |
| 6939203 | Fluid bearing slide assembly for workpiece polishing A fluid bearing polishing apparatus for carrying a polishing member for chemical mechanical polishing includes a fluid supply and a fluid dispensing structure to support the polishing member. A method of polishing a workpiece includes supporting a polishing member o... | 09/06/2005 |
| 6939199 | Method and apparatus for cutting semiconductor wafers Improperly mounted wafer saw blades can damage wafers cut or diced with the blades. Embodiments of this invention employ sensors to measure a distance to the blade to help indicate if the blade is improperly mounted. In one method of the invention, a the distance to... | 09/06/2005 |
| 6939200 | Method of predicting plate lapping properties to improve slider fabrication yield A method of predicting the lapping property of a charged lapping plate uses samples with a known lap surface. The samples are lapped on the plate and a non-invasive sensor is used to determine the lapping rate under a fixed load and rotation speed. The total frictio... | 09/06/2005 |
| 6939209 | Method and apparatus for global die thinning and polishing of flip-chip packaged integrated circuits A reliable, inexpensive “back side” thinning process and apparatus therefor, capable of globally thinning an integrated circuit die to a target thickness of 10 microns, and maintaining a yield of at least 80%, for chip repair and/or failure analysis of the packa... | 09/06/2005 |
| 6935924 | Method for deciding a bevel curve, method for determining a locus of a bevel, method for processing a lens and apparatus for processing a lens When a forming a bevel on a lens, the value of the bevel curve is calculated based on the value of the curve of the concave face, a reference axis of the bevel curve is determined to be in the same direction as the curvature of the concave face, a reference position... | 08/30/2005 |
| 6932679 | Apparatus and method for loading a wafer in polishing system The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt... | 08/23/2005 |
| 6932073 | Power tool work table A work table includes a work surface having two generally parallel bars extending across and above the work surface. Two sleeves are slidably connected to the two generally parallel bars, each sleeve of the two sleeves positioned around each bar of the two generally... | 08/23/2005 |
| 6932075 | Blade angle adjustment device for a stone cutter A blade angle adjustment device for a stone cutter includes a framed base having a working table slidably disposed on the base including a vertical cutting groove and a slant cutting groove in upper surface, a tool plate and a support arm respectively secured to a l... | 08/23/2005 |
| 6930461 | Device and method for controlling a machine tool A device and a method are provided for controlling a machine tool, at least one arbitrarily organized database having supplementary data being used for workpiece machining. During the execution of a machining program using a processing unit, the database commands ar... | 08/16/2005 |
| 6926584 | Dual mode hybrid control and method for CMP slurry A DMHC (dual mode hybrid control) system and method which facilitates enhanced control in the delivery of polishing slurry to a CMP (chemical mechanical polishing) apparatus. The DMHC comprises a linear table and a PID (proportional integrated differential) controll... | 08/09/2005 |
| 6926586 | Fixture for attaching indicator to grinding machine A fixture includes a fixing member attached to a grinding machine (10), a guiding shaft (37) attached to the fixing member and a clamp (38). The clamp defines a pair of holes (381, 382) in opposite ends thereof, for movably receiving the ... | 08/09/2005 |
| 6926587 | CMP apparatus, CMP polishing method, semiconductor device and its manufacturing method A CMP apparatus is provided for polishing wafers that are substrates to be polished by CMP. The CMP apparatus comprises a stage that is structured to be rotatable and holds a wafer to be polished, a polishing head holding section that holds a polishing head equipped... | 08/09/2005 |
| 6921319 | Method for grinding a rail, and device for carrying out said method The invention relates to a method for grinding at least the running surface of a rail (1), especially of a railway rail, by producing a relative movement between a grinding wheel (12) having a profile that mates the profile of the running surface, and ... | 07/26/2005 |
| 6918816 | Apparatus and method for polishing a fiber optic connector A fiber optic polishing apparatus including a support system, a polishing sub-assembly coupled to the support system including a plurality of pads, and a fixture to hold a plurality of fiber optic connectors. The fixture is positioned adjacent to the plurality of pa... | 07/19/2005 |
| 6918815 | System and apparatus for predicting plate lapping properties to improve slider fabrication yield A device for predicting the lapping property of a charged lapping plate uses samples with a known lap surface. The samples are lapped on the plate and a non-invasive sensor is used to determine the lapping rate under a fixed load and rotation speed. The total fricti... | 07/19/2005 |
| 6917420 | Rotational stage with vertical axis adjustment A stage system is disclosed for supporting and positioning a semiconductor wafer for inspection in an optical metrology device. A chuck for supporting a wafer is mounted to the stage system. The stage system can move the chuck along two linear orthogonal axes. A rot... | 07/12/2005 |
| 6913510 | Lens stocking device and lens processing system having the same A lens processing system (1) includes a lens stocking device (400a; 400b) capable of stocking a plurality of lenses (LE); and a lens grinding device (100a; 100b); and a lens conveying device (200)... | 07/05/2005 |
| 6913509 | Method and apparatus for polishing, and lapping jig Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the wor... | 07/05/2005 |
| 6913516 | Dummy process and polishing-pad conditioning process for chemical mechanical polishing apparatus A dummy process and a polishing-pad conditioning process suitable for a chemical mechanical polishing (CMP) is provided. The CMP apparatus includes a polishing head, a polishing table, and a polishing pad. The polishing head includes a protective hood, a base, a ret... | 07/05/2005 |
| 6913523 | Method for controlling pH during planarization and cleaning of microelectronic substrates A method and apparatus for processing a microelectronic substrate. In one embodiment, the method can include planarizing the microelectronic substrate with a planarizing liquid and rinsing the substrate with a rinsing liquid having a pH approximately the same as a p... | 07/05/2005 |
| 6910946 | Polishing machine The polishing machine processes a workpiece put on table of body by four-directional control and is provided with a pair of columns. It comprises: first carrying unit having both ends fixed to pair of columns and having carrying part mounted on upper side; a second ... | 06/28/2005 |
| 6910953 | Methods and apparatus for edge finishing glass sheets A rotating belt (10) is used to finish the edges (23) of glass sheets (11), such as, the thin sheets (e.g., 0.7 mm) used as substrates for liquid crystal displays (LCDs). The edge (23) of the sheet (11) engages the working zone ( | 06/28/2005 |
| 6908368 | Advanced Bi-directional linear polishing system and method The present invention describes a chemical mechanical polishing apparatus and method that uses a portion of a polishing pad that is disposed under tension between a supply spool and a receive spool, with a motor providing the tension to either the supply spool or th... | 06/21/2005 |
| 6905393 | Method for simultaneous machining and measuring parameters of a surface being subjected to machining A method for establishing different parameters of a surface of a work piece during machining of the surface using a spindle supporting a tool and displacement sensors for measuring displacement to which the spindle is subjected during machining. The method involves ... | 06/14/2005 |
