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| Number | Title | Issue Date |
| 6736698 | Method and apparatus for wireless transfer of chemical-mechanical planarization measurements A method and apparatus for the wireless transfer of measurements made during chemical-mechanical planarization of semiconductor wafers with a planarizing machine. The apparatus includes a sensor connected to the semiconductor substrate or a movable portion of the pl... | 05/18/2004 |
| 6736697 | Metal part having external surface with particular profile, polishing method for its production and device for implementing the method The invention relates to a circularly-symmetrical metal part (1) having an outer surface (3) which, in axial section, has a general profile made up of a uniform succession of flattened convex arches (4). The invention also relates to a polishing... | 05/18/2004 |
| 6729215 | Dicing machine In the dicing machine, a parallel adjustment process between a cut-line of a blade and cut-line images displayed on a monitor can be easily performed. In the dicing machine, at least one of the first and second cut-line images displayed on the monitor is electronica... | 05/04/2004 |
| 6726528 | Polishing pad with optical sensor A polishing pad having an optical assembly that does not cause excess wear on a wafer workpiece. The optical assembly is disposed within the pad such that it may move in response to forces applied to the optical assembly. ... | 04/27/2004 |
| 6722947 | Lapping machine, lapping method, and method of manufacturing magnetic head A lapping machine comprises a lapping surface plate (1) rotated by a rotating mechanism, a lapping jig (28) having a plurality of projections to bottom surfaces of which a work (30) to be lapped by a lapping surface on the lapping surface plate ... | 04/20/2004 |
| 6722956 | Working apparatus A finishing grindstone member (20) is fixed to a spindle (10) by a bolt. In the spindle (10), there is formed a tool mounting portion (25) into which a rough grindstone member can be mounted. Into the tool mounting portion (25), th... | 04/20/2004 |
| 6722945 | Endface polishing method and endface polishing apparatus The invention is an endface polishing method and an endface polishing apparatus improving polishing accuracy of an optical fiber and making polishing time and polishing work shorten. Polishing is performed making a boundary line center axis while observing the bound... | 04/20/2004 |
| 6722948 | Pad conditioning monitor A modification to a chemical mechanical polishing conditioner of a type having a member with a conditioning surface adapted to apply a force to and condition a polishing pad. The conditioner includes at least one sensor disposed within the member, where the at least... | 04/20/2004 |
| 6712668 | System and method for electropolishing nonuniform pipes A pipe electropolishing system (10, 10a) for in place polishing of a pipe (28) has provision for detecting the instant position of a cathode (14) within the pipe (28) such as cable marks (52) and cable mark sensor (50... | 03/30/2004 |
| 6712671 | Device for edge-machining of optical lenses A device is disclosed for edge-machining an optical lens, clampable between two aligned holding shafts rotatable about the rotational axis of a workpiece, having a Z slide, which is guided longitudinally displaceably on a base frame in a Z direction parallel to the ... | 03/30/2004 |
| 6712670 | Method and apparatus for applying downward force on wafer during CMP An apparatus for applying a wafer to a polishing belt during a CMP operation includes a spindle having an upper end and a lower end. A wafer carrier is coupled to the lower end of the spindle. A linear force generator is disposed at the upper end of the spindle. A l... | 03/30/2004 |
| 6702649 | Method of determining current position data of a machining tool and apparatus therefor The current positioning data of a machining tool with regard to a reference surface of a workpiece or of a body connected to the workpiece, is determined. The tool and the workpiece to be machined are relatively moveable toward and away from one another, ... | 03/09/2004 |
| 6695682 | Polishing method and polishing apparatus A polishing method executes those serial processes described below: a theoretically ideal amount of removable object is computed; based on the comparison to the profile when actually processing a polishing object via a chemical-mechanical polishing proces... | 02/24/2004 |
| 6676483 | Anti-scattering layer for polishing pad windows An anti-scattering layer for polishing pad windows as used in chemical-mechanical planarization (CMP) systems is disclosed. The invention finds particular use in circumstances where the windows have a roughened lower surface. The anti-scattering layer is ... | 01/13/2004 |
| 6672947 | Method for global die thinning and polishing of flip-chip packaged integrated circuits A reliable, inexpensive "back side" thinning process, capable of globally thinning an integrated circuit die to a target thickness of 10 microns, and maintaining a yield of at least 80%, for chip repair and/or failure analysis of the packaged die. The fli... | 01/06/2004 |
| 6672942 | Grinding machine for welding electrodes A grinding machine for welding electrodes comprises a housing 1, grinder motor 2, grinding disk 3, swing plate 4, holder guide 6, electrode holder 7, electrode turning motor 8 and swing plate moving mechanism 9. The axis $c;a of electrode A extends alo... | 01/06/2004 |
| 6669533 | Rail profile grinding machine The grinding machine comprises a grinding head with a rotary abrasive tool, carried by a chassis equipped, at its ends, with rollers for running and guiding on the rail that is to be ground. A balancing assembly, resting on the other rail of the track, is... | 12/30/2003 |
| 6669531 | Apparatus for high tolerance brush honing The present invention relates to a honing method and apparatus which provides greater control over the edge shape, as well as reductions in the effort required to hone multiple edges on workpieces. The invention accomplishes these improvements by controll... | 12/30/2003 |
| 6666749 | Apparatus and method for enhanced processing of microelectronic workpieces Chemical-mechanical planarizing machines and methods to maintain processing pads and other planarizing media used in planarizing microelectronic workpieces. In one embodiment, a planarizing machine can include a surfacing device attached to one of a carri... | 12/23/2003 |
| 6663469 | Polishing method and apparatus A semiconductor substrate having a Cu layer formed so as to fill wiring grooves formed in the substrate surface and to cover regions of the substrate surface where no wiring groove is formed is brought into sliding contact with a polishing surface on a tu... | 12/16/2003 |
| 6659847 | Method of cleaning a probe card A method of cleaning a probe card with probe pins contaminated by testing residue. A cleaning wafer is provided and the uneven surface and the grooves thereon are used to polish surfaces of the probe pins. Two kinds of cleaning operations, which utilize s... | 12/09/2003 |
| 6659843 | Substrate dicing method A programmable dicing saw is operable with movement of its spindle and work surface for aligning a dicing blade juxtaposed between flanges on the spindle and dicing a substrate along a predetermined blade path. By locating the center of the substrate, an ... | 12/09/2003 |
| 6652359 | Flat surface grinding machine with a second wheelhead for machining broaches Grinding machine (1) comprising a first wheelhead (4) for machining flat surfaces and a second wheelhead (10) for machining workpieces (3) such as broaches. The first wheelhead (4) is slidably mounted on a vertical column (6) and has a slide (7) on its un... | 11/25/2003 |
| 6645043 | Method and apparatus for cold-end processing full lead crystal An apparatus for grinding and polishing without visible flaws a variety of different size and shape full-lead crystal workpieces. A conveyor supports the workpieces and runs through the apparatus housing. A workpiece calibrator is located proximate the en... | 11/11/2003 |
| 6645045 | Method of measuring thickness of a semiconductor layer and method of manufacturing a semiconductor substrate The disclosed method of measuring the thickness of an active layer of an SOI substrate maintains the accuracy of previous methods but can be performed quickly and during processing of the substrate. The method includes reading data from light reflected fr... | 11/11/2003 |
| 6645047 | Automatic gage head positioning system An automatic gage head positioning system especially adapted for CNC grinding of reciprocating engine crankshaft journals. The system incorporates an actuated four-bar linkage mechanism for accurately controlling the path of a gage device between disengag... | 11/11/2003 |
| 6638142 | Apparatus for sharpening blades A device is proposed for sharpening knives in meat-processing machines, which enables a more precise movement of the sharpening tool (4) against the knife to be sharpened (2), in particular automatic control of this process. This is achieved according to ... | 10/28/2003 |
| 6634935 | Single drive system for a bi-directional linear chemical mechanical polishing apparatus Described is a method and apparatus for producing bi-directional linear polishing that uses a flexible pad. In one aspect, a horizontal drive assembly moves a horizontal slide member that is horizontally moveable over rails attached to a single casting. O... | 10/21/2003 |
| 6634926 | Width utilization prompter/monitor system for wide-belt abrasive machines A prompter/monitor system for use in combination with wide-belt abrasive surface treating apparatus and including an array of individual axially spaced apart signal generating workpiece sensors operatively positioned across the width of the belt with each... | 10/21/2003 |
| 6634925 | Width utilization prompter/monitor system for wide-belt abrasive machines A prompter/monitor system for use in combination with wide-belt abrasive surface treating apparatus and including an array of individual axially spaced apart signal generating workpiece sensors operatively positioned across the width of the belt with each... | 10/21/2003 |
| 6629874 | Feature height measurement during CMP Embodiments of the present invention provide a chemical-mechanical planarization method for planarizing a wafer. The method comprises polishing a surface of the wafer to be planarized, and optically measuring feature heights of features on the surface of ... | 10/07/2003 |
| 6626734 | Method and apparatus for wireless transfer of chemical-mechanical planarization measurements A method and apparatus for the wireless transfer of measurements made during chemical-mechanical planarization of semiconductor wafers with a planarizing machine. The apparatus includes a sensor connected to the semiconductor substrate or a movable portio... | 09/30/2003 |
| 6626736 | Polishing apparatus A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish, and allows a polishing pad to be automatically replaced without stopping rotary or circulatory motion of a polishing table. The polishing appara... | 09/30/2003 |
| 6620030 | Dual grindstone A grinder for use with a tire uniformity machine and being selectially moved into and out of contact with a tire mounted in the tire uniformity machine and including a pair of rotatable grindstones for grinding the tire carried by a grinding head. The gri... | 09/16/2003 |
| 6616511 | Rolling mill equipped with on-line roll grinding system and grinding wheel A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an ab... | 09/09/2003 |
| 6612900 | Method and apparatus for wireless transfer of chemical-mechanical planarization measurements A method and apparatus for the wireless transfer of measurements made during chemical-mechanical planarization of semiconductor wafers with a planarizing machine. The apparatus includes a sensor connected to the semiconductor substrate or a movable portio... | 09/02/2003 |
| 6609948 | Method of making an electronic lapping guide (ELG) for lapping a read sensor An electronic lapping guide (ELG) and method of making are provided for precisely lapping a read sensor to a designed air bearing surface (ABS). In the method a sensor material layer is formed on a wafer after which a portion of the sensor material layer ... | 08/26/2003 |
| 6606985 | Dual-cutting method devoid of useless strokes Disclosed is a dual-cutting method devoid of useless strokes of cutting blades across a workpiece. The work piece has cross lines drawn in the form of lattice, and it is divided into the intermediate and opposite side zones. Two lines of substantially equ... | 08/19/2003 |
| 6604985 | Abrasive article having a window system for polishing wafers, and methods A process for planarizing, polishing, or providing other modification of a wafer surface or other workpiece. The process includes using an abrasive article having a textured abrasive coating affixed to a backing. The abrasive article includes a monitoring... | 08/12/2003 |
| 6599171 | Cup attaching apparatus A cup attaching apparatus for attaching a cup for eyeglass lens processing to a subject lens to be processed, includes: an imaging optical system, which obtains an image of the lens by illuminating the lens with rays of light shaped to be larger in diamet... | 07/29/2003 |
