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| Number | Title | Issue Date |
| 8070556 | Grinding wheel for roll grinding and method of roll grinding A method of grinding a ferrous roll may include: rotating a grinding wheel on a machine spindle to form a rotating grinding wheel; rotating a ferrous roll to form a rotating roll surface; bringing the rotating grinding wheel into contact with the rotating roll surfa... | 12/06/2011 |
| 7988531 | Grinding machine Grinding machine with a machine bed, with a tool carriage that is linearly movable on the machine bed in a Y-axis, with a tool spindle, which is mounted in the tool carriage so as to rotate around an X-axis that is perpendicular to the Y-axis, and which can be rotat... | 08/02/2011 |
| 7988532 | Apparatus for fabricating liquid crystal display panels A cut section checking/aligning unit simultaneously checks cut sections of unit liquid crystal display panels that are separated from within first and second base substrates and aligns the unit liquid crystal display panels to a reference position. A grinding unit g... | 08/02/2011 |
| 7963824 | Method of grooving or counter-beveling the periphery of an ophthalmic lens A method for grooving or counter-beveling the periphery of an opthamalic lens in a grinding machine is provided. The grinding machine includes a lens support with a mechanism configured to rotate the lens about a first axis, a grooving or counter-beveling wheel rota... | 06/21/2011 |
| 7854646 | Substrate polishing apparatus and substrate polishing method The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing s... | 12/21/2010 |
| 7670206 | Substrate polishing apparatus and substrate polishing method The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing s... | 03/02/2010 |
| 7585206 | Spool to spool continuous through feed system A grinding machine has a machine bed, a first spool and a second spool mounted on the machine bed. The spools are capable of storing stock to be ground and are rotatable in a coordinated manner. A grinding wheel is mounted on the machine bed. The first spool is capa... | 09/08/2009 |
| 7547245 | Substrate production apparatus for producing a substrate for a display device A substrate production apparatus for producing a substrate for a display device is disclosed. The substrate production apparatus includes a first production apparatus including a first scriber to scribe a first mother substrate into at least one first model substrat... | 06/16/2009 |
| 7442111 | Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a polishing layer and a thickness greater than zero. ... | 10/28/2008 |
| 7438775 | Lens layout block device A lens layout block device comprising a seal feeding device that supplies an elastic seal to a seal sticking position (A5). The elastic seal is loaded in a tape loading part in the form of a seal tape covered by a mount and a protective sheet and wound in a r... | 10/21/2008 |
| 7438628 | Device and control unit for belt sanding systems A belt sanding system comprising a segmented sanding block including a plurality of individually controllable segments and one or more sanding belt deflecting rollers, a plurality of sensing elements corresponding to the plurality of segments, and a device for inter... | 10/21/2008 |
| 7435158 | Initial position setting method of grinding wheel in vertical double disc surface grinding machine The present invention provides an initial position setting method of grinding wheels, before starting a grinding operation, in a vertical double disc surface grinding machine for surface grinding the upper and lower grinding surfaces of a work-piece simultaneously b... | 10/14/2008 |
| 7431632 | Control system and method for processing jewelry and the like A control system for controlling processing of workpieces such as jewelry has gantry and gimbal units having x, y, z translational and x, y, z rotational degrees of freedom, the units carrying a gripper for holding a piece of jewelry. Drive motors are associated wit... | 10/07/2008 |
| 7431633 | Plating removing apparatus for three-piece wheel To provide a plating removing apparatus for 3-piece wheels, which can easily and neatly remove plating at the welding planned portion of the superimposed part of the inner rim and the outer rim. A plating removing apparatus that removes plating of a welding planned ... | 10/07/2008 |
| 7422510 | Lens machining machine The invention relates to a machining machine for lenses, which comprises a first workpiece drive, configured as the transport receptacle and having a workpiece spindle, a workpiece changer for exchanging workpieces between the workpiece drive and a workpiece stock, ... | 09/09/2008 |
| 7422511 | Element for detecting the amount of lapping having a resistive film electrically connected to the substrate An element for detecting an amount of lapping of a stacked structure that includes a substrate and a magnetic field detecting sensor is provided. The element comprises: a resistive film that is arranged on a lapping surface of the stacked structure, the resistive fi... | 09/09/2008 |
| 7416472 | Systems for planarizing workpieces, e.g., microelectronic workpieces This disclosure provides methods and apparatus for predictably changing the thickness of a microfeature workpiece. One implementation provides a planarizing method in which a first workpiece is planarized in first and second planarizing processes and a total change ... | 08/26/2008 |
| 7416474 | Planarization apparatus The present invention is a planarization apparatus for planarizing a coating film applied on a substrate before the coating film is hardened, including a contact body such as a brush or sponge brought into contact with a front surface of the coating film on the subs... | 08/26/2008 |
| 7413499 | Grinding process and apparatus with arrangement for grinding with constant grinding load A process of grinding a surface of a workpiece, by a grinding tool rotated about its axis. The process includes a grinding step of grinding the workpiece surface, by pressing at least one of the grinding tool and the workpiece against the other of the grinding tool ... | 08/19/2008 |
| 7413500 | Methods for planarizing workpieces, e.g., microelectronic workpieces This disclosure provides methods and apparatus for predictably changing the thickness of a microfeature workpiece. One implementation provides a planarizing method in which a first workpiece is planarized in first and second planarizing processes and a total change ... | 08/19/2008 |
| 7404754 | CNC tungsten steel cutting machine A CNC tungsten steel cutting machine suitably used to cut a metal material, such as tungsten carbide steel, includes an operational platform, a cutting mechanism, a feeding mechanism, a delivering mechanism, and a control panel. When a metal material to be cut is re... | 07/29/2008 |
| 7386935 | Methods and apparatus for controlling the lapping of a slider based on an amplitude of a readback signal produced from an externally applied magnetic field The lapping of a slider is controlled based on an amplitude of a readback signal which is produced from an externally applied magnetic field. A lapping plate is used to lap a slider which includes at least one magnetic head having a read sensor. During the lapping, ... | 06/17/2008 |
| 7377836 | Versatile wafer refining Methods of refining using a plurality of refining elements are discussed. A refining apparatus having refining elements that can be smaller than the workpiece being refined are disclosed. New refining methods, refining apparatus, and refining elements disclosed. Met... | 05/27/2008 |
| 7371152 | Non-uniform subaperture polishing A method for subaperture polishing includes determining a first portion of a sample to be polished disproportionately compared to a second portion of the sample. Based on the determination of the first portion, a sweep frequency that is a first rate of lateral motio... | 05/13/2008 |
| 7354332 | Technique for process-qualifying a semiconductor manufacturing tool using metrology data A technique of the present invention utilizes qualification characteristics from a single wafer for qualifying a semiconductor manufacturing tool. Generally speaking, the technique commences with the processing of a wafer by the manufacturing tool. During processing... | 04/08/2008 |
| 7347765 | Honing installation with several work stations A honing installation for honing workpieces comprises a plurality of work stations, each work station being configured for performing at least one working step on a workpiece and at least part of the work station is set up as a honing station for performing at least... | 03/25/2008 |
| 7341501 | Gear grinding machine, method for dressing threaded grinding wheel and method for grinding work A gear grinding machine, a method for dressing a threaded grinding wheel, and a method for grinding a work are disclosed. A dressing tool is rotated in a vertical plane, with its position being fixed. The position of a threaded grinding wheel is NC-controlled, where... | 03/11/2008 |
| 7341502 | Methods and systems for planarizing workpieces, e.g., microelectronic workpieces Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator which is adapted to change an optical property in response to a planarizing condition. This process indicator may, for example, change color in response to reaching a particular... | 03/11/2008 |
| 7335091 | Methods and apparatus for machining a coupling A method facilitates fabricating a coupling including a first annular coupling member and a second annular coupling member. The method comprises coupling the first coupling member to a machine assembly that includes a plurality of grinding wheels coupled to a tool s... | 02/26/2008 |
| 7335090 | Substrate processing apparatus and substrate handling method A substrate processing apparatus includes: a carrier holding unit for holding a carrier which houses a substrate; a substrate holding mechanism for holding a substrate when a predetermined process is executed on the substrate; and a substrate transfer mechanism for ... | 02/26/2008 |
| 7335087 | Eyeglass lens processing apparatus An eyeglass lens processing apparatus includes: a controller that controls a second driver for rotating lens chucks for chucking an eyeglass lens and a third driver for changing an axis-to-axis distance between an axis of a processing tool and an axis of the lens ch... | 02/26/2008 |
| 7332099 | Ion bombardment of electrical lapping guides to decrease noise during lapping process A method for reducing noise in a lapping guide. Selected portions of a magnetoresistive device wafer are bombarded with ions such that a magnetoresistive effect of lapping guides is reduced. The device is lapped, using the lapping guides to measure an extent of the ... | 02/19/2008 |
| 7329169 | Apparatus and method for fabricating liquid crystal display panel An apparatus and method for fabricating a liquid crystal display panel are disclosed. In case of the single mode that liquid crystal display panels are fabricated with the same size on a large glass substrate, defective unit liquid crystal display panels are kept an... | 02/12/2008 |
| 7326103 | Vertically adjustable chemical mechanical polishing head and method for use thereof The invention provides a vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof. ... | 02/05/2008 |
| 7326102 | Apparatus for lapping thin film magnetic heads A lapping method and apparatus is provided that increases the yield rate in the magnetic head slider manufacturing process. According to the invention, an apparatus for lapping thin film magnetic heads includes a jig block and a lapping plate. The jig block includes... | 02/05/2008 |
| 7318767 | Device and method for machine control A data set (D) is provided for machine control of a grinding machine to determine time-efficient, collision-free travel paths. The data set has a collision parameter of “0” or “1” in each separate coordination point (X, Y, Z, A) as well as for each combinati... | 01/15/2008 |
| 7314401 | Methods and systems for conditioning planarizing pads used in planarizing substrates Monitoring the process of planarizing a workpiece, e.g., conditioning a CMP pad, can present some difficulties. Aspects of this invention provide methods and systems for monitoring and/or controlling such a planarization cycle. For example, a control system may moni... | 01/01/2008 |
| 7311012 | Elongation measuring device An elongation measuring device 10 measures an elongation in a timing belt 4 included in a driving device 1 provided with a drive roller 2. The elongation measuring device 10 is provided with an encoder 11 and a microphotosen... | 12/25/2007 |
| 7306506 | In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging Chemical-mechanical planarization (CMP) apparatus and methods for detecting polishing pad properties using ultrasonic imaging is presented. An ultrasonic probe assembly transmits ultrasonic signals onto the surface of a polishing pad during a CMP process. Reflected ... | 12/11/2007 |
| 7300333 | Control system and method for processing jewelry and the like A control system for controlling processing of workpieces such as jewelry has gantry and gimbal units having x, y, z translational and x, y, z rotational degrees of freedom, the units carrying a gripper for holding a piece of jewelry. Drive motors are associated wit... | 11/27/2007 |
