Bizarre Patents
Method and apparatus for making a drink hop along a bar or counter
A method for generating a drink which appears to hop from a remote spot on the bar or counter and take one or more leaps, before landing in a patron's glass.
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| Number | Title | Issue Date |
| 7465214 | Substrate holding apparatus and polishing apparatus A substrate holding apparatus holds a substrate such as a semiconductor and presses the substrate against a polishing surface. The substrate holding apparatus includes a top ring body (2) for holding the substrate, a plurality of fluid passages (33, 34, 35... | 12/16/2008 |
| 7434454 | Method and apparatus for tire uniformity measurement There is provided a method and a apparatus for measuring tire uniformity. The apparatus comprises a spindle, a rotating drum, a sensor and a computing means. The method comprises the steps of mounting a tire on the spindle, pressing a circumferential surface of a ro... | 10/14/2008 |
| 7367865 | Methods for making wafers with low-defect surfaces, wafers obtained thereby and electronic components made from the wafers The electronic semiconductor component has a crystalline wafer substrate with an active surface and a semiconductor layer coating the active surface. So that the semiconductor layer has a few surface defects the crystalline wafer substrate is a sapphire or silicon c... | 05/06/2008 |
| 7364393 | Machine adaptation The invention relates to the transmission of power and/or data from/to a stationary part of a machine tool 200 to/from an accessory 100 mounted in the spindle 210 of the machine tool 200. A first electrical link or interface 1a,... | 04/29/2008 |
| 7357695 | Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces Systems and methods for polishing microfeature workpieces. In one embodiment, a method includes determining a status of a characteristic of a microfeature workpiece and moving a carrier head and/or a polishing pad relative to the other to rub the microfeature workpi... | 04/15/2008 |
| 7329168 | Extended Kalman filter incorporating offline metrology An algorithm uses offline metrology to control a process by passing information from an outer control loop to an inner control loop, extended Kalman filter estimator. The inner control loop operates online, and the outer control loop operates asynchronously with res... | 02/12/2008 |
| 7303662 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 12/04/2007 |
| 7294041 | Moving head for semiconductor wafer polishing apparatus Disclosed herein is a moving head for a semiconductor wafer polishing apparatus. The semiconductor wafer polishing apparatus has a table on which a polishing pad is formed, and the moving head mounted via a support unit to hold a wafer relative to a polishing surfac... | 11/13/2007 |
| 7287316 | Lapping monitor device, system and method A lapping monitor element that is juxtaposed with a magnetic transducer element having a magnetoresistance effect film to determine the lapping position upon lapping the element height of the magnetic transducer element to a predetermined dimension. The lapping moni... | 10/30/2007 |
| 7283226 | Measurement system cluster Systems and methods are disclosed for measuring semiconductor wafers in a fabrication process using one or more of a plurality of measurement systems. A measurement system cluster is provided having a plurality of such measurement systems, along with a system for tr... | 10/16/2007 |
| 7273405 | Sintered rare earth magnetic alloy wafer and wafer surface growing machine A method of producing a sintered rare earth magnetic alloy wafer comprises a step of using a cutter to slice a wafer of a thickness of not greater than 3 mm from a sintered rare earth magnetic alloy having ferromagnetic crystal grains surrounded by a more readily gr... | 09/25/2007 |
| 7254995 | Control methodology for a multi-axial wheel fatigue system A testing system and a method for obtaining drive files for the testing system for wheel rim testing, includes providing a wheel assembly in contact with a drum surface, the wheel assembly being rotatable about an axis defining a lateral axis, and wherein a vertical... | 08/14/2007 |
| 7254996 | Method and apparatus for testing rubber tires or solid rubber wheel laboratory samples A method and apparatus for testing rubber tires includes an abrader for rubbing against the surface of the tire and an eraser for removing particles of rubber left on the abrading surface by the tire. The eraser has the capability of absorbing oil or wax included in... | 08/14/2007 |
| 7254458 | Systems and methods for metrology recipe and model generation Systems and methodologies are disclosed for generating setup information for use measuring process parameters associated with semiconductor devices. A system comprises an off-line measurement instrument to measure an unpatterned wafer and a setup information generat... | 08/07/2007 |
| 7249496 | System for inspecting uniformity of tire An uniformity inspection line 1 comprises a decision-only line 2 having first UF machines 2M exclusive for the measurement of the uniformity of a tire 12 sorted and distributed on an automatic sorting line 21 and a correction-only ... | 07/31/2007 |
| 7238094 | Belt oscillating apparatus of belt sander A belt oscillating apparatus of a belt sander, wherein the belt sander includes a machine frame, a driving wheel, a driven wheel, a sand belt mounted on the driving wheel and the driven wheel, and the belt oscillating apparatus is mounted on the machine frame, compr... | 07/03/2007 |
| 7220164 | Advanced finishing control An apparatus and method of using an in situ finishing information for finishing workpieces and semiconductor wafers are described. The method uses operative sensors such as friction sensors for detecting and improving control during finishing. The method can aid con... | 05/22/2007 |
| 7214125 | Method for controlling pH during planarization and cleaning of microelectronic substrates A method and apparatus for processing a microelectronic substrate. In one embodiment, the method can include planarizing the microelectronic substrate with a planarizing liquid and rinsing the substrate with a rinsing liquid having a pH approximately the same as a p... | 05/08/2007 |
| 7206172 | Electrical lapping guide embedded in a shield of a magnetic head An electrical lapping guide (ELG) incorporated into a shield of a magnetic head for measuring lapping process during construction of the magnetic head. ... | 04/17/2007 |
| 7206169 | Sacrificial anode in a kerf for corrosion protection during slider fabrication A slider fabrication assembly and method for making the same are provided. A slider is formed on a substrate. A corrodible component of the slider is exposed to an environment in contact with the slider. A kerf region of the substrate is positioned adjacent to the s... | 04/17/2007 |
| 7189143 | Machine for superfinishing by honing A honing machine for super finishing workpieces, e.g. by honing using a tool spindle (7), can be rotatably driven and can receive a tool. A motor rotates the tool spindle, the tool spindle (12) being arranged on a carriage (12), which can be dis... | 03/13/2007 |
| 7182882 | Method of improving chemical mechanical polish endpoint signals by use of chemical additives A method for buffering a chemical mechanical polish chemical slurry is disclosed. Buffering the slurry reduces buildup of local acidic areas at the interface between the polished metal and the polishing pad. Reduction of the local acidic areas improves the uniformit... | 02/27/2007 |
| 7175511 | Method of manufacturing substrate for magnetic disk, apparatus for manufacturing substrate for magnetic disk, and method of manufacturing magnetic disk A magnetic polishing method capable of easily and satisfactorily polishing the inner peripheral end face of a circular hole (1) at the center part of a disk substrate (2) even if the diameter of the circular hole is reduced. By this method, a large qua... | 02/13/2007 |
| 7177019 | Apparatus for imaging metrology This invention is an apparatus for imaging metrology, which in particular embodiments may be integrated with a processor station such that a metrology station is apart from but coupled to a process station. The metrology station is provided with a first imaging came... | 02/13/2007 |
| 7171884 | Resilient cutting blades and cutting devices Steel reinforced tire fabrics are cut with long rigid bar blades, circular disc blades and disc and anvil blades. All of these blades may have an open relatively deep slot spaced close to the cutting edge that creates a resilient cantilevered spring element that inc... | 02/06/2007 |
| 7156717 | situ finishing aid control A method of using finishing aids for advanced finishing control is described. A finishing surface is used generally to induce frictional wear. The finishing aids with preferred in situ control can improve control of the coefficient of friction, the tangential force ... | 01/02/2007 |
| 7153194 | Workpiece grinding method which achieves a constant stock removal rate In a method of grinding a component, a reduction in the finish grinding time is achieved by rotating the component through only a single revolution during a final grinding step and controlling the depth of cut and the component speed of rotation during that single r... | 12/26/2006 |
| 7147541 | Thickness control method and double side polisher The object of the present invention is to provide a double side polisher capable of maintaining thickness control accuracy over a long period of time without being affected by a gradual change in thickness of a polishing pad, and a thickness control method. The firs... | 12/12/2006 |
| 7147539 | Head performance based nano-machining process control for stripe forming of advanced sliders The present invention is a method of using direct head electrical response signals for feedback process control. When lapping the air bearing surface of a bar of sliders, a magnetic field is applied to the air bearing surface and a bias current is applied to the rea... | 12/12/2006 |
| 7137867 | Thickness control method and double side polisher The object of the present invention is to provide a thickness control method for a double side polisher, accuracy of which is not affected by wearing of polishing pad and applicable to polishing of nonconductive work pieces. An eddy current sensor in a cavity of an ... | 11/21/2006 |
| 7131890 | In situ finishing control An apparatus and method of using a in situ finishing information for finishing semiconductor wafers is described. The method uses operative sensors such as friction sensors for detecting and improving control during finishing. The method can aid control of finishing... | 11/07/2006 |
| 7131891 | Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces Systems and methods for polishing microfeature workpieces. In one embodiment, a method includes determining a status of a characteristic of a microfeature workpiece and moving a carrier head and/or a polishing pad relative to the other to rub the microfeature workpi... | 11/07/2006 |
| 7131893 | Method for grinding liquid crystal display panel Disclosed is a grinding table apparatus for a liquid crystal display panel and a grinder using the adapt to various sizes of unit liquid crystal display panels for grinding edges of the corresponding liquid crystal display panel by adjusting a variable moving distan... | 11/07/2006 |
| 7132035 | Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes Methods, apparatuses and substrate assembly structures for mechanical and chemical-mechanical planarizing processes used in the manufacturing microelectronic-device substrate assemblies. One aspect of the invention is directed toward a method for planarizing a micro... | 11/07/2006 |
| 7125313 | Apparatus and method for abrading a workpiece An apparatus for abrading a workpiece comprises a first plate assembly having a first surface for supporting a workpiece and a second plate assembly having a second surface for engaging the workpiece to abrade a portion thereof. A displacement shaft is mounted for m... | 10/24/2006 |
| 7116519 | Patterning of integrated closure for implementing pads connected to lapping elements A tape head comprised of a substrate and a closure coupled to the substrate. Read and/or write elements are embedded in the substrate. Contact pads are coupled to the substrate, the pads being in electrical communication with the read and/or write elements. At least... | 10/03/2006 |
| 7108578 | System and method for manufacturing magnetic heads Systems and methods for the manufacture of a magnetic head. A first embodiment provides an apparatus for the manufacture of a magnetic head comprising a feedback control loop to terminate lapping of the magnetic head responsive to achieving a target signal to noise ... | 09/19/2006 |
| 7106433 | Measurement system cluster Systems and methods are disclosed for measuring semiconductor wafers in a fabrication process using one or more of a plurality of measurement systems. A measurement system cluster is provided having a plurality of such measurement systems, along with a system for tr... | 09/12/2006 |
| 7101255 | Polishing apparatus This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes ... | 09/05/2006 |
| 7101251 | Polishing system with in-line and in-situ metrology A computer program product for process control in chemical mechanical polishing is described. The product includes instructions to cause a processor to receive a measurement of an initial pre-polishing thickness of a layer of a substrate from a metrology station, de... | 09/05/2006 |
