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| Number | Title | Issue Date |
| 8187008 | Oblique parts or surfaces Various structures, such as microstructures and wall-like structures, can include parts or surfaces that are oblique. In some implementations, a cantilevered element includes a spring-like portion with a uniformly oblique surface or with another artifact of an obliq... | 05/29/2012 |
| 8182273 | Power semiconductor module with prestressed auxiliary contact spring A power semiconductor module having a housing, a pressure member, a substrate including at least one contact surface, and at least one connection element leading towards the exterior of the housing. The connection element has a first contact device, a resilient sect... | 05/22/2012 |
| 8033838 | Microelectronic contact structure Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrifici... | 10/11/2011 |
| 8021167 | ‘All in one’ spring process for cost-effective spring manufacturing and spring self-alignment A method of forming spring structures using a single lithographic operation is described. In particular, a single lithographic operation both defines the spring area and also defines what areas of the spring will be uplifted. By eliminating a second lithographic ope... | 09/20/2011 |
| 8021168 | Contact spring A contact spring having a free contact end for producing an electrical contact between the free contact end and a contact surface, the contact spring formed from N contact spring metal sheets and N−1 spacer elements. The contact spring metal sheets are fixed in a ... | 09/20/2011 |
| 8007291 | Implementing differential signal circuit board electrical contact A method, and structures are provided for implementing differential signal circuit board electrical contact. A removable member including a pair of independent electrical contacts is removably received within an associated contact-receiving cavity on the circuit boa... | 08/30/2011 |
| 7985081 | Transferable micro spring structure A method for mounting the micro spring structures onto cables or contact structures includes forming a spring island having an “upside-down” stress bias on a first release material layer or directly on a substrate, forming a second release material over at least... | 07/26/2011 |
| 7972149 | Board with connection terminals Connection terminals each include: a bonding portion bonded to a pad of a substrate; a contacting portion disposed to face the bonding portion; a spring portion present between the bonding portion and the contacting portion; and an engaging portion engaged with a po... | 07/05/2011 |
| 7963778 | Burn-in socket with plated contacts A burn-in socket for receiving an IC package comprises a socket body, a plurality of contacts mounted in the socket body and an actuator movably mounted upon the socket body. Each contact in the socket body includes a pair of clipping arms with tip portions at free ... | 06/21/2011 |
| 7938652 | Low profile electrical connector An electrical connector includes an insulative housing and a plurality of terminals secured in the insulative housing. The insulative housing defines a mating surface and a mounting surface opposite to the mating surface and includes a plurality of posts extending f... | 05/10/2011 |
| 7909620 | Socket contact A low-profile socket contact is provided that is mountable on a print substrate and has a high contact pressure. The socket contact includes a base portion provided on a print substrate, and a contact connecting portion connecting to the tab-shaped contact provided ... | 03/22/2011 |
| 7837481 | Socket for an integrated circuit and a method of providing a connection in a socket A socket for an integrated circuit is disclosed. The socket comprises a main body portion having a plurality of holes extending between a top surface and a bottom surface; an overlay positioned adjacent to the main body portion and having a plurality of holes corres... | 11/23/2010 |
| 7806703 | Component part having an electrical printed circuit board A component part has an electrical printed circuit board (12), which has an electronic circuit and has been contact-connected to a lead frame (10), which is generally surrounded at least partially by plastic (11), in which first contact elements... | 10/05/2010 |
| 7798822 | Microelectronic contact structures Microelectronic contact structures are fabricated by separately forming, then joining together, various components thereof. Each contact structure has three components: a “post” component, a “beam” component, and a “tip” component. The resulting contact ... | 09/21/2010 |
| 7780460 | Connecting terminal The invention relates to a connecting terminal with an insulating housing and a clamping contact positioned in the connecting terminal housing for the purpose of connecting an electrical conductor, such that a contact spring, which is electrically connected to the c... | 08/24/2010 |
| 7731509 | Battery connector A battery connector includes an insulating housing defining a receiving cavity cutting through a top surface and a bottom surface thereof and a conductor accommodated in the corresponding receiving cavity of the insulating housing. The conductor includes a substanti... | 06/08/2010 |
| 7654833 | Brittle fracture resistant spring A spring contact has a post-release outer upper surface in compression and a post-release outer lower surface in compression. A compressive lower layer of spring material may be formed at a thickness that is three-eighths or less of a tensile upper layer of spring m... | 02/02/2010 |
| 7628620 | Reinforced contact elements Embodiments of reinforced resilient elements and methods for fabricating same are provided herein. In one embodiment, a reinforced resilient element includes a resilient element configured to electrically probe an unpackaged semiconductor device to be tested, the re... | 12/08/2009 |
| 7625221 | Elastic contact An elastic contact includes a first elastic piece and a second elastic piece. The first elastic piece includes a base configured for being soldered to a circuit board and a connection part. The second elastic piece includes a contact part configured for resiliently ... | 12/01/2009 |
| 7621761 | Systems for testing and packaging integrated circuits Several embodiments of stress metal springs are disclosed, which typically comprise a plurality of stress metal layers that are established on a substrate, which are then controllably patterned and partially released from the substrate. An effective rotation angle i... | 11/24/2009 |
| 7527505 | Semiconductor device contact resistant to deterioration due to heat and method for manufacturing contact A Contact according to an aspect of the present invention is formed by laminating a shape memory alloy film on a surface of a metal spring film, and the shape thereof is a conical spiral. A manufacturing method therefor is composed of 11 steps including a step of pr... | 05/05/2009 |
| 7503774 | Surface mount contact member A surface mount contact member includes a metal base and a conductive coil spring. The metal base is provided with a nozzle suction surface to be sucked by a suction nozzle and a soldering surface that can be soldered. The soldering surface is faced downward when th... | 03/17/2009 |
| 7448882 | Connector A connector for connecting with an external terminal on an electronic component includes a spiral contact which is wound a plurality of turns. The spiral contact has a single projection that projects outwardly toward an outer circumference of the turns. When the spi... | 11/11/2008 |
| 7442045 | Miniature electrical ball and tube socket with self-capturing multiple-contact-point coupling A socket connector for connecting a bulbous terminal or ball wherein the female element grips the terminal with resilient prongs with end tips at low insertion force but positive contact is maintained and wherein attempted withdrawal is normally inhibited by increas... | 10/28/2008 |
| 7435108 | Variable width resilient conductive contact structures Interconnect assemblies having resilient contact elements and methods for making these assemblies. In one aspect, the interconnect assembly includes a substrate and a resilient electrical contact element disposed on the substrate. A first portion of the resilient co... | 10/14/2008 |
| 7422446 | Connector A discontinuous contact region is formed in the vicinity of the tip of a spiral contact towards the center of the spiral. When a spherical contact is pressed into the spiral contact, a contact point P is formed since the angular portion of the tip of the discontinuo... | 09/09/2008 |
| 7393216 | Socket contact A socket contact includes a base bottom portion and a contact connection portion. The base bottom portion is mounted on a printed board. The contact connection portion is provided on both sides of the base bottom portion in a lateral direction, and connected with a ... | 07/01/2008 |
| 7384277 | Reinforced contact elements Embodiments of reinforced resilient elements and methods for fabricating same are provided herein. In one embodiment, a reinforced resilient element includes a resilient element configured to electrically probe a device to be tested, the resilient element having a f... | 06/10/2008 |
| 7361064 | Conductive contact and electronic apparatus employing the same A conductive contact includes a resilient strip and a post. The resilient strip includes a fixed end configured as a sheet for securing the resilient strip, an arm configured for being resiliently deformed by pressure, and a free end. The fixed end and the free end ... | 04/22/2008 |
| 7357873 | Polymide thin film self-assembly process The invention presents a novel polyimide-based thin film self-assembly technology, including five process steps described as follows: (1) deposits a sacrificial layer and a low-stress microstructure layer on a silicon substrate; (2) patterns and etches the low-stres... | 04/15/2008 |
| 7356920 | Micro-machined structure production using encapsulation Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structur... | 04/15/2008 |
| 7347702 | Contact carriers (tiles) for populating larger substrates with spring contacts An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first... | 03/25/2008 |
| 7349603 | Optical arrangement with two optical inputs/outputs and production methods Optical arrangement comprising two parallel plates each with a through-hole forming an optical input/output with a given optical axis and one at least partly optical component placed between the plates, the component and the first plate comprising first fastening st... | 03/25/2008 |
| 7349223 | Enhanced compliant probe card systems having improved planarity Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more ... | 03/25/2008 |
| 7342596 | Method for direct xerography A system for printing is described. The system uses at least one cantilever, and more typically a plurality of cantilever to transfer charge, either to or from a dielectric surface. The resulting charge distribution represents an image. Toner deposited over the diel... | 03/11/2008 |
| 7341175 | Bonding of light emitting diodes having shaped substrates Bonding of flip-chip mounted light emitting devices having an irregular configuration is provided. Light emitting diodes having a shaped substrate are bonded to a submount by applying forces to the substrate an a manner such that shear forces within the substrate do... | 03/11/2008 |
| 7331830 | High-density orthogonal connector A high-density orthogonal connector is disclosed and may include electrical contacts that are configured to receive contacts from an orthogonal header connector while minimizing signal skew and signal reflection. The electrical contacts in the connector may define c... | 02/19/2008 |
| 7328850 | Financial and similar identification cards and methods relating thereto Apparatuses forming portable identification cards and associated methods are described. A preferred apparatus includes an input device adapted for a consumer to enter authentication data, a memory for storing reference data, a processor configured to compare the aut... | 02/12/2008 |
| 7325903 | Quill-jet printer A system for depositing a material is described. The system uses at least one cantilever, and more typically a plurality of cantilever to transfer small amounts of material from a source of material to a substrate surface. One application for the system is a printin... | 02/05/2008 |
| 7320606 | Electrical connector with terminal having flat indentation The terminals of a pair of connectors are made by deforming sheet metal in the thicknesswise direction so that they are located within an interference area prior to connection. The terminal (12) of a connector (10) has a flat indentation (12B- | 01/22/2008 |
