Bizarre Patents
Combination Beverage Container and Spittoon
A combination beverage container and spittoon includes a bottom portion including outer wall and a first inner wall defining a spittoon space.
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| Number | Title | Issue Date |
| 7094069 | Seal member limiting solder flow An intercoupling component is of the type used to couple an array of electrical connection regions disposed on a first substrate to an array of electrical connection regions disposed on a second substrate. The intercoupling component comprises: an insulative support... | 08/22/2006 |
| 7094618 | Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape The present invention provides a method and apparatus for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers or devices which have been subjected to a thinning process, including backgrinding in particular. The pr... | 08/22/2006 |
| 7094065 | Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate A spring contact for establishing electrical contact between a lead element of an IC device and a substrate. The spring contact generally comprises a contact portion and a base portion. The contact portion, which generally comprises a coil-type compression spring, i... | 08/22/2006 |
| 7094628 | Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling microelectronic devices Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of disposing underfill including electrically charged filler elements on microelectroni... | 08/22/2006 |
| 7094062 | Land grid array connector A land grid array connector includes a housing having a plurality of passageways therethrough and a conductive contact provided in each passageway. A recess is formed in each passageway. Each contact has a deformable portion having a tip provided at an end thereof. ... | 08/22/2006 |
| 7090507 | Socket having substrate locking feature A socket is shown having an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies include ... | 08/15/2006 |
| 7092539 | MEMS based acoustic array Embodiments of the present invention described and shown in the specification and drawings include a combination responsive to an acoustic wave that can be utilized as a dynamic pressure sensor. In one embodiment of the present invention, the combination has a subst... | 08/15/2006 |
| 7083429 | IC socket An IC socket includes an insulative housing having an IC package receiving recess, in which an IC package is received. Contacts are disposed within cavities, which are provided in the IC package receiving recess in a matrix arrangement. Each contact includes a base ... | 08/01/2006 |
| 7083457 | Land grid array socket with pressing plate A new land grid array socket (LGA, 100) provided according to a preferred embodiment of the LGA socket includes a base for receiving an integrated circuit (IC) package (200), a number of terminals (40) secured on the base, a pressing mechanism m... | 08/01/2006 |
| 7080993 | Spiral contactor, contact sheet having spiral contactor, and connecting device having contact sheet A supporting portion is provided only at a winding start portion side and an outside of the other part of a deforming portion other than the winding start portion side is opened. Thus, adjacent spiral contactors can be arranged to be close to each other. Therefore, ... | 07/25/2006 |
| 7079398 | Sash for land grid arrays A conductive sash is etched around the periphery of a land grid array interconnection on a carrier for dense integrated circuit connections. If the array comprises more than one module or module chip domain, the conductive sash is also positioned between the modules... | 07/18/2006 |
| 7077659 | Separable electrical interconnect with anisotropic conductive elastomer and a rigid adapter A separable electrical connector for electrically interconnecting an electrical device to a substrate. The connector includes an adapter board electrically connected to the substrate, the adapter board having electrical contacts on both sides, and a layer of ACE bet... | 07/18/2006 |
| 7077663 | Module connector A connector has an inner side face defining a chamber formed with an opening. A module body is inserted from the opening to be accommodated in the chamber. A first conductive member is provided on an outer periphery of the module body which is opposed to the inner s... | 07/18/2006 |
| 7077665 | Contact pin and socket for electrical parts A contact pin made of an electroconductive plate comprising a contact portion formed at a first end edge portion of the plate, the upper end contact portion being designed to electrically connect a part and having a central portion protruded to be an arcuate shape, ... | 07/18/2006 |
| 7077680 | Module connector The present invention provides a module connector including a housing having four sidewalls that define a chamber for receiving a module therein. Each sidewall defines a plurality of contact recesses. A plurality of contacts is accommodated in the contact recesses a... | 07/18/2006 |
| 7072787 | Method for analyzing data storage system test data A method for testing each one of the CPUs on each one of the plurality of director printed circuit. Results from such test are collected in a memory of a computer. The results are collected in a predetermined format. The method processes the collected data to presen... | 07/04/2006 |
| 7066740 | Area array package with low inductance connecting device An area-array integrated circuit package assembly are provided with a plurality of electrically conductive connectors attached to the package I.O. pads, that are used to connect the package to a printed circuit card or other component. The connectors comprise at lea... | 06/27/2006 |
| 7064431 | Electronic assembly having select spacing of rows and columns of contacts to allow for routing of traces to the contacts An electronic assembly is described, having a substrate and contacts on the substrate which are spaced and arranged in a manner that allows for a more dense arrangement of contacts but still allows for routing of traces between the contacts. ... | 06/20/2006 |
| 7059869 | Metal contact LGA socket A socket which has an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies include stampe... | 06/13/2006 |
| 7059870 | IC socket An IC socket includes a package guide member including a package receiving part configured to arrange a semiconductor device where a plurality of external connection terminals are arranged in a single plane surface at a designated position, a contact terminal having... | 06/13/2006 |
| 7059873 | LGA-BGA connector housing and contacts Electrical connectors and contacts are disclosed. An electrical connector having a contact receiving well extending along a contact receiving direction, and having a generally T-shaped cross-section along a direction transverse to the contact receiving direction. An... | 06/13/2006 |
| 7059865 | See-saw interconnect assembly with dielectric carrier grid providing spring suspension An interconnect assembly includes a number of interconnects combined in a preferably planar dielectric carrier frame having resilient portions acting as spring members in conjunction with their respective interconnect's rotational displacement during operational con... | 06/13/2006 |
| 7059866 | integrated circuit contact to test apparatus A contact test set for use in testing integrated circuits. The set includes a housing having oppositely-facing surfaces and one or more slots extending through the housing between the surfaces. A first surface, during use of the test set, is approached by an integra... | 06/13/2006 |
| 7059047 | Sockets for “springed” semiconductor devices Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnecti... | 06/13/2006 |
| 7056130 | Socket connector with inspection datum windows A socket connector is provided that includes a housing holding a plurality of electrical contacts. The housing includes a base having a top side and a bottom side. Opposed side walls upwardly extend from the top side of the base. A datum protrusion is formed on each... | 06/06/2006 |
| 7051427 | Integrated circuit trimming device broken die sensor A broken trim die tool detection sensor. The lands of the tie bar die connect with the leads of the unit to form switches. The states of these switches indicate broken die lands or other malfunctions. ... | 05/30/2006 |
| 7052290 | Low profile connector for electronic interface modules An interface module connector for an interface module card to be used in an electronic device. The interface module connector includes a sheet having raised areas that correspond to the position of the electrical contacts of the interface module card. An electricall... | 05/30/2006 |
| 7043831 | Method for fabricating a test interconnect for bumped semiconductor components by forming recesses and cantilevered leads on a substrate A method for fabricating an interconnect for semiconductor components includes the steps of: providing a substrate; forming a metal layer on the substrate; etching projections in the metal layer; etching the metal layer to form patterns of leads; etching recesses in... | 05/16/2006 |
| 7044768 | Liquid thermal management socket system A liquid thermal management socket system for thermally managing an electronic device in a socket. The liquid thermal management socket system includes a thermal management unit having a chamber for receiving one or more electronic devices, a plurality of first conn... | 05/16/2006 |
| 7044746 | Separable interface electrical connector having opposing contacts A electrical connector system comprising a plug assembly and a socket assembly. The plug assembly includes a plurality of conductive pads. The socket assembly includes a first set of spring contacts and a second set of spring contacts. The first set of spring contac... | 05/16/2006 |
| 7042239 | Arrangement for manual disengagement of a device interface board from a personal tester A semiconductor integrated circuit tester includes a housing having a main housing wall formed with an opening. A tester interface unit is located partially in the housing and incorporates an electrical connector segment that extends partially from the main housing ... | 05/09/2006 |
| 7040903 | Method of connecting a contact with a solder and an electronic device using the method A method of connecting a contact with a solder includes to cling a solder to a contact or an insulative housing alternatively via an adhesive, and to heat the solder in order to weld the contact to a mating electronic device. And an electronic device using the metho... | 05/09/2006 |
| 7037113 | Electrical connector An electrical connector comprising a housing having a plurality of conductive element receiving regions within which a plurality of conductive elements are provided. The conductive elements are of a kind formed from an elongate sheet material which has been bent out... | 05/02/2006 |
| 7037115 | Attaching integrated circuits to printed circuit boards A land grid array socket may receive an integrated circuit package for electrical connection thereto through lands on the integrated circuit package and spring contacts which extend upwardly to engage those lands from the socket. A protector plate may be situated ov... | 05/02/2006 |
| 7037116 | Socket connector having multi-piece housing A socket connector (100) for electrically connecting a central process unit (CPU) to a printed circuit board includes a housing (1), and a number of electrical contacts (2) received in the housing. The housing, being of a frame defining an openi... | 05/02/2006 |
| 7037129 | Axial latch actuator with locking wedge An axial latch actuator includes: a mating portion having a latch for engaging a jack; and a slidable housing that slides along the mating portion and engages the mating portion, wherein when the slidable housing slides in a first direction, the mating portion is in... | 05/02/2006 |
| 7036574 | Heat sink A heat sink arrangement for modular electronic and/or opto-electronic equipment is provided. The equipment module is inserted into an interface and a heat sink is pivotably arranged so as to be brought into contact with the inserted module. The equipment module may ... | 05/02/2006 |
| 7038919 | IC socket having fastening mechanism for sensor An IC socket (10) includes an insulative housing (12) mounted on a burn-in board, a plurality of conductive contacts (14) received in the housing. The housing defines a recessed area (120) bounded by two pairs of sidewalls (122), t... | 05/02/2006 |
| 7032307 | Method for fabricating a probe pin for testing electrical characteristics of an apparatus A probe pin for testing electric characteristics of a semiconductor device comprises a silicon pin core (3, 23, 33), and a conductive film (4, 24, 34) covering the entire surface, including the bottom face, of the pin core. The bottom face of the probe... | 04/25/2006 |
| 7032305 | Method for mounting integrated circuits on a printed circuit card A method of mounting electrical component assemblies on opposite sides of a printed circuit card including inserting a chock on a first side of the printed circuit card; inserting a standoff and placing a spring around each standoff; pressing the chock against the p... | 04/25/2006 |
