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| Number | Title | Issue Date |
| 7232706 | Method of making a semiconductor chip assembly with a precision-formed metal pillar A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects... | 06/19/2007 |
| 7232707 | Method of making a semiconductor chip assembly with an interlocked contact terminal A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects... | 06/19/2007 |
| 7229297 | Method and system for making and using an electrical connection between a conductor and a circuit board A method and system for connecting and using a circuit board connected to a conductive element is disclosed. The circuit board includes a backstop and a plurality of conductive traces positioned on an edge. The conductive element includes a plurality of conductive l... | 06/12/2007 |
| 7230437 | Mechanically reconfigurable vertical tester interface for IC probing A wafer test assembly includes multiple probe head substrates arranged like tiles with connectors attached to one side and probes supported on the opposing side. In one embodiment, flexible cable connectors directly connect the connectors on the probe head tile to a... | 06/12/2007 |
| 7229292 | Interconnect structure for transducer assembly An interconnect assembly is presented. The assembly includes an interconnect structure including a plurality of interconnect layers disposed in a spaced relationship, where each of the plurality of interconnect layers comprises a plurality of conductive traces dispo... | 06/12/2007 |
| 7226310 | Control apparatus The control apparatus includes a plurality of control units. Each control unit includes a cable containing electrical conductors. Male and female connectors may be disposed at opposite end portions of the cable. An inline connector may be disposed between the male a... | 06/05/2007 |
| 7223136 | Condenser microphone and method for manufacturing substrate for the same A substrate is obtained as follows. A structure is formed using a metal plate for a lead frame on which terminals and connection portions are formed; the terminals are exposed from either a front or back surface and the connection portions connect the terminals toge... | 05/29/2007 |
| 7223105 | Cable connector incorporating anisotropically conductive elastomer A separable electrical connector for separably, electrically interconnecting the conductors of one multi-conductor cable to the conductors of a second electrical device that may be an electrical device such as a chip, or a second multi-conductor cable, or a flexible... | 05/29/2007 |
| 7223111 | Electrical connector An electrical connector that has an array of conductors each having a contact point to make contact with a mating conductive surface. Upon engaging the contact points in a sliding manner with the mating surface, the conductors are displaced, which, in turn, tensions... | 05/29/2007 |
| 7224583 | Shielding box without any dedicated cooling duct A shielding box includes a first wiring board and a second wiring board maintaining a distance relative to the first wiring board and facing thereto. A ventilating hole is formed in the second wiring board and having side surfaces facing each other. A pair of flat c... | 05/29/2007 |
| 7223119 | Cable connector assembly and system The invention relates to a cable connector assembly including cover means and connecting means, wherein the cover means include wall portions and an opening adapted to accommodate the connecting means. At least one of the wall portions is at least partially curved f... | 05/29/2007 |
| 7220133 | Optical disc apparatus An optical disc apparatus is constructed so that: a first member formed of a plate-shaped or sheet-shaped insulating material is disposed on a flexible printed-wiring board which interconnects a main circuit board and an optical pickup; a second member with a protru... | 05/22/2007 |
| 7217151 | Electrical connector with strain relief features A preferred embodiment of a connector system includes a first electrical connector for mounting on a first substrate. The first electrical connector has a housing, and a contact mounted on the housing. The connector system also includes a second electrical connector... | 05/15/2007 |
| 7210942 | Connection structure for printed wiring board The present invention relates to a connection structure for a printed wiring board to be electrically connected to a FPC. The FPC comprises a long substrate, a plurality of conductors laminated on the surface of the substrate and extending along an axial direction o... | 05/01/2007 |
| 7212409 | Cam actuated cold plate A cooling system for a computer includes a cam-actuated cold plate. Compliant, thermally conductive pins on the cold plate contact electronic heat generating electronic components when the cold plate is moved toward a circuit assembly that includes the electronic co... | 05/01/2007 |
| 7212413 | Electronic device with flexible printed circuit board structure An electronic device with flexible printed circuit board structure. The electronic device includes a first flexible printed circuit board and a second flexible printed circuit board. The first flexible printed circuit board has a first bent portion. The second flexi... | 05/01/2007 |
| 7210108 | Structure of power supply path utilized in design of integrated circuit According to a method of designing an integrated circuit, a plurality of outgoing lines branch off from each of main lines of respective power supply paths on the sides of VDD and VSS, and the pitches between adjacent outgoing lines of the plurality of outgoing line... | 04/24/2007 |
| 7205484 | Bonding structure for a hard disk drive suspension using anisotropic conductive film A plurality of bonding structures and their forming methods for bonding a FPC to a bonding pad, in particular a bonding pad of a wireless suspension in a head gimbal assembly, using anisotropic conductive adhesive; such structures eliminate the spring-back force in ... | 04/17/2007 |
| 7204698 | Circuit board solder connection with feature to prevent solder bridging An electronic device comprises a flexible printed circuit board and a circuit board. The flexible printed circuit board comprises two first connection portions and a multifunction opening, wherein the multifunction opening comprises a flow-stopping portion and a fir... | 04/17/2007 |
| 7204697 | Non-oriented wire in elastomer electrical contact A method and apparatus for interconnecting an electronic module to a substrate through resilient wire conductors in an interposer arrangement. A carrier layer of insulating material with an array of apertures, arranged to align with both the electrical pads on an el... | 04/17/2007 |
| 7201606 | Wire connection structure and connector A body of a connector is constituted by combining a first support member for supporting a plurality of terminal elements with a second support member for supporting the first support member. The second support member has a plurality of bearing surfaces individually ... | 04/10/2007 |
| 7198969 | Semiconductor chip assemblies, methods of making same and components for same Semiconductor chip assemblies incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals on the sheet-like element are movable with respect to the chip, so as to compensa... | 04/03/2007 |
| 7199309 | Structure for repairing or modifying surface connections on circuit boards A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a h... | 04/03/2007 |
| 7197817 | Method for forming contact bumps for circuit board Disclosed is a method of forming bump electrodes on wired circuit boards. A high-concentration impurity Si template doped with boron and having a pit formed therein is prepared. A plated resist is formed on the high-concentration impurity Si template and an opening ... | 04/03/2007 |
| 7193858 | Organic electroluminescent display device in which an electromagnetic field preventing and protecting circuit is easily arranged An organic electroluminescent display device in which electromagnetic field preventing and protecting circuit, for protecting internal circuits from abnormal signals having specific characteristics generated during manufacturing process or operation, is easily arran... | 03/20/2007 |
| 7192286 | Printed circuit board and an image forming apparatus having the printed circuit board Disclosed is a printed circuit board comprising a contact terminal, which prevents a poor contact and reduces a manufacturing cost, and an image forming apparatus having the same. The printed circuit board comprises a circuit part for controlling and processing an o... | 03/20/2007 |
| 7193158 | Wiring board device At the tip of a marginal land of a wiring board corresponding to a marginal electrode of a QFP is provided a partly projecting area that projects in a direction away from another land. The partly projecting area and the marginal land can be formed simultaneously and... | 03/20/2007 |
| 7189593 | Elimination of RDL using tape base flip chip on flex for die stacking A flexible film interposer for stacking a flip chip semiconductor die onto a second (bottom) semiconductor die, semiconductor devices and stacked die assemblies that incorporate the flexible film interposer, and methods of fabricating the devices and assemblies are ... | 03/13/2007 |
| 7188408 | Method of making a straddle mount connector A method of making an electrical connector includes the steps of: providing a connector body (2) having an insert (5) defining a recessed area (54a) at one side and a number of channels (54b) at an opposite side; assembling ... | 03/13/2007 |
| 7190080 | Semiconductor chip assembly with embedded metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line... | 03/13/2007 |
| 7187518 | Flexible printed circuit for spindle motor and disk drive having the same A flexible printed circuit (FPC), electrically connecting a spindle motor on a base of a disk drive with a printed circuit board (PCB) outside of the base, and a disk drive including the FPC, are provided. The FPC includes a wiring portion having one end connected t... | 03/06/2007 |
| 7186126 | Floating electrical connector A floating connector is disclosed which can avoid a danger that the pin bodies will contact the inner circumferential surfaces of the through-holes formed in the movable housing when the movable housing moves in the vertical direction with respect to the fixed housi... | 03/06/2007 |
| 7186136 | FFC-connection assembly An FFC-connection assembly includes an electrical component for a motor vehicle having an electrical tracing, at least one access window, a molded flange, and at least one hook. An FFC lies over the electrical tracing, mates the electrical tracing through the access... | 03/06/2007 |
| 7182672 | Method of probe tip shaping and cleaning Methods are provided for shaping, maintaining the shape of, and cleaning a probe tip using a pad such as a multi-layer adhesive and abrasive pad. The multi-layer adhesive and abrasive pad may be formed from layers of adhesive material having abrasive particles in-be... | 02/27/2007 |
| 7184202 | Method and system for packaging a MEMS device A MEMS-based display device is described, wherein an array of interferometric modulators are configured to reflect light through a transparent substrate. The transparent substrate is sealed to a backplate and the backplate can contain electronic circuitry for contro... | 02/27/2007 |
| 7180546 | Devices including a thermally conductive member which guides heat produced by an image capturing unit to a display chassis An LCD having a backlight is inserted in a shield for protecting various types of electronic components used in an electronic camera by shielding static electricity applied to the LCD, and the LCD is held by the shield. In this structure, thermal conductive rubber i... | 02/20/2007 |
| 7180750 | Structure for preventing stacking connectors on boards from coming apart and electronic device A structure is disclosed for preventing stacking connectors on a first and a second boards from coming apart that are fitted to each other. The first and second boards connected by said stacking connectors being fitted to each other are clamped by a clamping member.... | 02/20/2007 |
| 7179091 | Edge mount electrical connector An edge mount electrical connector assembly includes a flexible circuit having a first end for connecting to one major surface of the circuit board and a second end for connecting to another major surface of the circuit board, and an electrical connector connected t... | 02/20/2007 |
| 7180315 | Substrate with patterned conductive layer A method of processing a substrate is provided. The method includes providing a substrate having a first surface, a second surface, and conductive paths extending from the first surface to the second surface. The method also includes (1) covering a portion of the fi... | 02/20/2007 |
| 7176812 | Wireless blade monitoring system and process The present invention can be generally described as a blade monitoring and wireless communications system. This monitoring and communications system is formed by the integration of commonly available or easily developed hardware and/or software components, which may... | 02/13/2007 |
