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A vest or belt is integrally formed with tubular, pet receiving passageways which extend around the wearer's body and terminate in pocket-like chambers for feeding and retrieval.
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| Number | Title | Issue Date |
| 7521384 | Method and apparatus for peeling surface protective film A method and an apparatus for peeling a surface protective film attached on the surface of a semiconductor wafer are provided. A heating block is set in proximity to the whole surface of the semiconductor wafer, and the whole surface protective film is heated by the... | 04/21/2009 |
| 7390742 | Method for producing a rewiring printed circuit board The invention relates to a method for producing a rewiring printed circuit board with a substrate wafer having passage connections between a first and a second surface. One embodiment of the method comprises applying and patterning masking layers on the first and th... | 06/24/2008 |
| 7374584 | Interconnects forming method and interconnects forming apparatus The present invention provides an interconnects-forming method and an interconnects-forming apparatus which can minimize the lowering of processing accuracy in etching, minimize light exposure processing for the formation of interconnect recesses in the production o... | 05/20/2008 |
| 7371591 | Process for manufacturing liquid ejection head A process includes forming a protective layer in a region of a substrate including a PAD electrode; forming a soluble resin layer in a region including a region on the substrate where an energy generating element has been formed, for forming a liquid chamber; formin... | 05/13/2008 |
| 7335605 | Protective tape applying and separating method In a protective tape applying and separating method according to this invention, a protective tape applied by a tape applying mechanism to a surface of a wafer suction-supported by a chuck table is cut to a wafer configuration by a cutter unit. Subsequently, a prote... | 02/26/2008 |
| 7306695 | Apparatus and method for picking up semiconductor chip A semiconductor chip pick-up apparatus includes: a pick-up head for picking up the chip on a sheet; a holding table for holding the sheet; a recognition means for recognizing the chip; a positioning means for positioning the chip relatively to the pick-up head on th... | 12/11/2007 |
| 7303647 | Driving mechanism for chip detachment apparatus A driving mechanism and method are provided for driving a detachment tool adapted to detach a chip from an adhesive tape to which the chip is mounted. The mechanism includes a first actuator coupled to the detachment tool and operative to drive the detachment tool t... | 12/04/2007 |
| 7297412 | Fabrication of stacked microelectronic devices Manufacture of stacked microelectronic devices is facilitated by producing subassemblies wherein adhesive pads are applied to the back surfaces of a plurality of microelectronic components in a batch fashion. In one embodiment, an adhesive payer is applied on a rear... | 11/20/2007 |
| 7282417 | Ion doping method to form source and drain An ion doping method to form source and drain is disclosed. First form a gate structure and a gate spacer on a semiconductor substrate, and then use dielectric layer having trenches therein to define heavily ion-doped positions and use a Y-shaped polysilicon layer f... | 10/16/2007 |
| 7264979 | Method of manufacturing light emitting device A high-quality light emitting device is provided which has a long-lasting light emitting element free from the problems of conventional ones because of a structure that allows less degradation, and a method of manufacturing the light emitting device is provided. Aft... | 09/04/2007 |
| 7238258 | System for peeling semiconductor chips from tape A system for peeling semiconductor chips from tape is provided with a nose on a housing. The nose has transverse dimensions smaller than the transverse dimensions of a target chip. Apertures are provided through the nose from the housing. Vacuum ports are provided i... | 07/03/2007 |
| 7234237 | Method for producing a protective cover for a device In a method for producing a protective cover for a device formed in a substrate, at first a sacrificial structure is produced on the substrate, wherein the sacrificial structure comprises a first portion covering a first area of the substrate including the device an... | 06/26/2007 |
| 7223320 | Method and apparatus for expanding a semiconductor wafer Methods, systems, and apparatuses are described for expanding an area of a semiconductor wafer, an enhancing die transfer capability. A wafer is attached to a support structure. The wafer is separated on the support structure into a plurality of dies. An area of the... | 05/29/2007 |
| 7223319 | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device A semiconductor manufacturing apparatus includes: a peeling mechanism to peel a pressure sensitive adhesive (PSA) tape from a semiconductor wafer constituted by a plurality of semiconductor chips which are separated therefrom, the semiconductor wafer having an eleme... | 05/29/2007 |
| 7217653 | Interconnects forming method and interconnects forming apparatus The present invention provides an interconnects-forming method and an interconnects-forming apparatus which can minimize the lowering of processing accuracy in etching, minimize light exposure processing for the formation of interconnect recesses in the production o... | 05/15/2007 |
| 7172673 | Peeling device and peeling method A peeling device 11 includes an adsorber 15 having an adsorbing face 20A that adsorbs and retains a wafer W, and a peeling element 17 that holds a protective sheet H stuck to the wafer W, and peels off the protective sheet H from the wafe... | 02/06/2007 |
| 7157337 | Method of manufacturing a semiconductor device and semiconductor device obtained by means of such a method Consistent with an example embodiment according to the invention, a material for the intermediate layer is chosen which can be selectively etched with respect to the dielectric layer. Before the deposition of the first conductor layer, the intermediate layer is remo... | 01/02/2007 |
| 7080675 | Method and apparatus for joining adhesive tape to back face of semiconductor wafer In a method for joining an adhesive tape to a back face of a semiconductor wafer after a process of working the back face of the semiconductor wafer, the semiconductor wafer is held at a state where a face having a pattern formed thereon is directed upward, and the ... | 07/25/2006 |
| 7063765 | Adhesive sheet for affixation of a wafer and method for processing using the same An adhesive sheet for affixation of a wafer includes a first substrate, first adhesive layer arranged on the first substrate, second substrate arranged on the first adhesive layer, and second adhesive layer arranged on the second substrate. A chemical reaction which... | 06/20/2006 |
| 7051418 | Method of measuring weak gas flows Firstly, a supporting frame is produced, whose opening is spanned by an auxiliary layer flush on one side. Following the production of microstructures, flat parts or membranes on the common plane defined by the auxiliary layer and the supporting frame, the auxiliary... | 05/30/2006 |
| 7051424 | Method and apparatus for electrically and physically coupling a micro-actuator and slider to a hard drive arm suspension for component replacement after detachment from the suspension A system and method are disclosed for coupling a replacement micro-actuator to a drive arm suspension after a micro-actuator, such as a defective micro-actuator, has been detached from the suspension. ... | 05/30/2006 |
| 6979635 | Method of forming miniaturized polycrystalline silicon gate electrodes using selective oxidation Ultra narrow and thin polycrystalline silicon gate electrodes are formed by patterning a polysilicon gate precursor, reducing its width and height by selectively oxidizing its upper and side surfaces, and then removing the oxidized surfaces. Embodiments include patt... | 12/27/2005 |
| 6946391 | Method for forming dual damascenes A method for forming a dual damascene structure in a semiconductor device manufacturing process including providing a process wafer including a via opening extending through at least one dielectric insulating layer; blanket depositing a negative photoresist layer to... | 09/20/2005 |
| 6924209 | Method for fabricating an integrated semiconductor component A method for the fabrication of an integrated semiconductor component, in which at least one isolation trench is formed, a first layer of a nonconductive material is applied by a nonconformal deposition method, and a second layer of a nonconductive material is appli... | 08/02/2005 |
| 6922890 | Planarization process for thin film surfaces A method is provided for planarization of structures which minimizes step heights, reduces process steps, improves cleanliness, and provides increased ease of debond. Structures are placed with working surfaces facing down onto an adhesive layer such that structures... | 08/02/2005 |
| 6913946 | Method of making an ultimate low dielectric device A method of making a semiconductor device comprising: providing a semiconductor substrate having a plurality of discrete devices formed therein, and a plurality of metal layers and support layers, the support layers comprising an uppermost support layer and other su... | 07/05/2005 |
| 6896762 | Separation method for object and glue membrane The invention provides a separation method for object and glue membrane, and it is characterized: an external force such as tearing apart is pre-applied for appropriately separating the glue membrane and the object, such that the binding ability between the object a... | 05/24/2005 |
| 6858542 | Semiconductor fabrication method for making small features A semiconductor fabrication method that includes forming a film (109) comprising an imaging layer (112) and an under layer (110) over a semiconductor substrate (102). The imaging layer (112) is patterned to produce a printed featur... | 02/22/2005 |
| 6843879 | Separation method for object and glue membrane The invention provides a separation method for object and glue membrane, and it is characterized: an external force such as tearing apart is pre-applied for appropriately separating the glue membrane and the object, such that the binding ability between the object a... | 01/18/2005 |
| 6841030 | Electronic component handling apparatus and electronic component handling method An electronic-component handling apparatus includes a) an electronic-component retainer provided with an adhesive layer for retaining multiple electronic components by an adhesion force at the bottom surface thereof and b) a blade which is used for removing the elec... | 01/11/2005 |
| 6824643 | Method and device of peeling semiconductor device using annular contact members In a semiconductor device manufacturing process, a semiconductor wafer is diced into a plurality of semiconductor chips, which are then peeled, from a dicing tape, using a peeling device. The peeling device includes a plurality of annular contact members arranged on... | 11/30/2004 |
| 6808975 | Method for forming a self-aligned contact hole in a semiconductor device A method for forming a self-aligned contact hole includes forming a plurality of conductive structures on a semiconductor substrate, each conductive structure including a conductive film pattern and a protection pattern formed on the conductive film pattern, forming... | 10/26/2004 |
| 6806146 | Method for making a semiconductor device having a high-k gate dielectric A method for making a semiconductor device is described. That method comprises forming on a substrate a high-k gate dielectric layer that includes impurities, then forming a silicon containing sacrificial layer on the high-k gate dielectric layer. After the silicon ... | 10/19/2004 |
| 6790705 | Manufacturing method for semiconductor apparatus Provided is a semiconductor apparatus manufacturing method capable of severing a base material without producing burrs. A multiplicity of semiconductor apparatuses are produced as follows. A multi-segment base material is obtained by mounting a multiplicity of semic... | 09/14/2004 |
| 6790733 | Preserving TEOS hard mask using COR for raised source-drain including removable/disposable spacer The present invention provides a method for preserving an oxide hard mask for the purpose of avoiding growth of epi Si on the gate stack during raised source/drain formation. The oxide hard mask is preserved in the present invention by utilizing a method which inclu... | 09/14/2004 |
| 6790305 | Method and structure for small pitch z-axis electrical interconnections A method for producing small pitch z-axis electrical interconnections in layers of dielectric materials which are applied to printed wiring boards and diverse electronic packages. A method for parallel fabrication of intermediate structures which are subsequently jo... | 09/14/2004 |
| 6784084 | Method for fabricating semiconductor device capable of reducing seam generations The present invention is related to a method for fabricating a semiconductor device capable of preventing occurrences of void and seam phenomena caused by a negative slope of an insulation layer or a bowing profile phenomenon in a cross-sectioned etch profile of a c... | 08/31/2004 |
| 6777333 | Method for fabricating semiconductor device A method for fabricating a semiconductor device includes the steps of: forming an insulating film on a conductive pattern formed on a substrate; forming a resist pattern on the insulating film; performing etching to the insulating film using the resist pattern as a ... | 08/17/2004 |
| 6727163 | Method for sawing wafer A method for sawing a wafer having a large number of semiconductor devices, e.g., image sensor devices is provided. In one embodiment, a protective layer covers micro-lenses of the image sensor devices to protect the lenses from being damaged or polluted by, for exa... | 04/27/2004 |
| 6724967 | Method of making a functional device with deposited layers subject to high temperature anneal A method is disclosed for making a device having one or more deposited layers and subject to a post deposition high temperature anneal. Opposing films having similar mechanical properties are deposited on the front and back faces of a wafer, which is subsequently su... | 04/20/2004 |
