Did You Know...
...that the inventor of the electric motor was a blacksmith named Thomas Davenport? Described as "a brilliantly unsuccessful inventor", Davenport invented the first rotary electric motor. In 1836 he headed out -- on foot -- from his Vermont home to file a patent application at the Patent Office in Washington, D.C. By the time he got there, he had squandered away his money and couldn't afford the $30 filing fee so he turned around and went home. When he later mailed in his application with money he'd raised, the Patent office was destroyed in a fire. He did finally get credit for his invention on Feb. 5, 1837.
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| Number | Title | Issue Date |
| 7442644 | Method for manufacturing nitride semiconductor wafer or nitride semiconductor device; nitride semiconductor wafer or nitride semiconductor device made by the same; and laser irradiating apparatus used for the same To remove the disparate substrate from nitride semiconductor layer grown over the disparate substrate, that is made of a material different from nitride semiconductor, by irradiating the disparate substrate with laser beam having a wavelength shorter than the band g... | 10/28/2008 |
| 7442629 | Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate The present invention generally provides semiconductor substrates having submicron-sized surface features generated by irradiating the surface with ultra short laser pulses. In one aspect, a method of processing a semiconductor substrate is disclosed that includes p... | 10/28/2008 |
| 7419912 | Laser patterning of light emitting devices Light extraction features are provided for a light emitting device having a substrate and a semiconductor light emitting element on the substrate by shaping a surface of a layer of semiconductor material utilizing a laser to define three dimensional patterns in the ... | 09/02/2008 |
| 7396706 | Synchronization technique for forming a substantially stable laser output pulse profile having different wavelength peaks A specially shaped laser pulse energy profile characterized by different laser wavelengths at different times of the profile provides reduced, controlled jitter to enable semiconductor device micromachining that achieves high quality processing and a smaller possibl... | 07/08/2008 |
| 7348261 | Wafer scale thin film package A chip module having a chip with a flexible multilayer redistribution thin film attached thereto for connection to a substrate. The thin film acts as both a redistribution medium with multiple layers of redistribution metallurgy for chip power and signals and as a c... | 03/25/2008 |
| 7348516 | Methods of and laser systems for link processing using laser pulses with specially tailored power profiles A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link. The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a ... | 03/25/2008 |
| 7338843 | Method for producing an electronic component, especially a memory chip A method for producing an electronic component, especially a memory chip, using a laser-induced correction to equalize an integrated circuit by means of at least one laser via in a layer at least partially covering the circuit. The component comprises a rewiring of ... | 03/04/2008 |
| 7316936 | Laser decapsulation method A decapsulation apparatus 100 has a laser 8 that removes plastic encapsulant from a device 24. Chamber 20 is sealed. Exhaust port 9 removes debris and fumes. The device 24 is positioned and scanned using an X, Y table 2 | 01/08/2008 |
| 7301981 | Methods for synchronized pulse shape tailoring A plurality of subresonators (12, 14), having different design configurations, share a common resonator section (18) such that the lasing action can be substantially synchronized to provide coherent laser pulses that merge the different respective puls... | 11/27/2007 |
| 7289549 | Lasers for synchronized pulse shape tailoring A plurality of subresonators (12, 14), having different design configurations, share a common resonator section (18) such that the lasing action can be substantially synchronized to provide coherent laser pulses that merge the different respective puls... | 10/30/2007 |
| 7285428 | Production method of electron source and image display In a production method of an electron source wherein a plurality of electron-emitting devices are connected by and driven by matrix wirings, the upper wiring of the matrix wiring is partially removed at a short circuit region at a cross portion between the matrix wi... | 10/23/2007 |
| 7241669 | Method of forming a scribe line on a passive electronic component substrate A method of forming a scribe line having a sharp snap line entails directing a UV laser beam along a ceramic or ceramic-like substrate such that a portion of the thickness of the substrate is removed. The UV laser beam forms a scribe line in the substrate without ap... | 07/10/2007 |
| 7227172 | Group-III-element nitride crystal semiconductor device In a Group-III-element nitride semiconductor device including a Group-III-element nitride crystal layer stacked on a Group-III-element nitride crystal substrate, the substrate is produced by allowing nitrogen of nitrogen-containing gas and a Group III element to rea... | 06/05/2007 |
| 7135405 | Method to form an interconnect Embodiments of methods, apparatuses, devices, and/or systems for forming an interconnect are described. ... | 11/14/2006 |
| 7126746 | Generating sets of tailored laser pulses In a master oscillator power amplifier, a driver (208) of a diode laser (202) is specially controlled to generate a set of two or more injection laser pulses that are injected into a power amplifier (204) operated in an unsaturated state to gene... | 10/24/2006 |
| 7122489 | Manufacturing method of composite sheet material using ultrafast laser pulses A patterned, multi-layered thin film structure is patterned using ultra-fast lasers and absorption spectroscopy without damaging underlying layers of the layered structure. The structure is made by selecting ablatable layers based on their thermal, strength and abso... | 10/17/2006 |
| 7115503 | Method and apparatus for processing thin metal layers A method and apparatus for processing a thin metal layer on a substrate to control the grain size, grain shape, and grain boundary location and orientation in the metal layer by irradiating the metal layer with a first excimer laser pulse having an intensity pattern... | 10/03/2006 |
| 7115514 | Semiconductor manufacturing using optical ablation The present invention relates to methods and systems for ablation based material removal configuration for use in semiconductor manufacturing that includes the steps of generating an initial wavelength-swept-with-time optical pulse in an optical pulse generator, amp... | 10/03/2006 |
| 6998220 | Method for the production of thin layer chip resistors A method for manufacturing thin-film chip resistors, in which method a resistor layer (14) and a contact layer (15, 16) are applied onto the upper surface of a substrate (10) and structured using laser light so as to form on said substrate (1... | 02/14/2006 |
| 6995035 | Method of making a top-emitting OLED device having improved power distribution A method of making a top-emitting OLED device, includes providing over a substrate laterally spaced and optically opaque lower electrodes and upper electrode busses which are electrically insulated from the lower electrodes; depositing an organic EL medium structure... | 02/07/2006 |
| 6967125 | Quad flat no lead (QFN) grid array package, method of making and memory module and computer system including same A quad flat no-lead (QFN) grid array semiconductor package and method for making the same is disclosed. The package includes a semiconductor die and a lead frame having a plurality of conductive elements patterned in a grid-type array. A plurality of bond pads on th... | 11/22/2005 |
| 6894747 | Manufacturing method for reflector, reflector, and liquid crystal display A flat organic insulating layer is formed on a substrate provided with thin film transistors by coating and baking. Next, a pulse-shaped laser beam is irradiated on the organic insulating layer and a contact hole and an undulation are formed in and on the organic in... | 05/17/2005 |
| 6887804 | Passivation processing over a memory link A set (50) of one or more laser pulses (52) is employed to remove passivation layer (44) over a conductive link (22). The link (22) can subsequently be removed by a different process such as chemical etching. The duration of the se... | 05/03/2005 |
| 6881687 | Method for laser cleaning of a substrate surface using a solid sacrificial film An improved semiconductor wafer processing apparatus 10 includes a series of processing stations combined in one form, coupled together by computer-controlled cluster tooling. Wafers are supplied in a pod to an input station 28 which initiates a data r... | 04/19/2005 |
| 6878567 | Method and apparatus for fabrication of passivated microfluidic structures in semiconductor substrates A method and apparatus for fabrication of passivated microfluidic structures is disclosed. The method includes providing a substrate having a microfluidic structure formed therein. The microfluidic structure is embedded by an embedding layer. The method further incl... | 04/12/2005 |
| 6872649 | Method of manufacturing transparent conductor film and compound semiconductor light-emitting device with the film A light emitting-layer is provided on a substrate. A p-type semiconductor layer is provided on the light-emitting layer. An upper electrode is provided on the p-type semiconductor layer. The upper electrode includes an Au thin film coming into contact with the p-typ... | 03/29/2005 |
| 6790689 | Curved waveguide ring laser A ring-type laser including a traveling wave cavity which incorporates at least first and second straight cavity sections and at least one curved cavity section. Corresponding first ends of the straight cavity sections are interconnected at a first light-emitting fa... | 09/14/2004 |
| 6753253 | Method of making wiring and logic corrections on a semiconductor device by use of focused ion beams Herein disclosed are a variety of techniques relating to the wiring and logic corrections on a chip by making use of the focused ion beam (which is shortly referred to as “FIB”) or the laser selection metal CVD. The time periods for the wiring corrections and fo... | 06/22/2004 |
| 6734083 | Dicing method and dicing apparatus for dicing plate-like workpiece Provision is made of a dicing apparatus, for dicing a plate-like workpiece, comprising a disk-like blade which rotates to form a groove in one surface of the workpiece; a water discharging portion which discharges water toward a bottom of the groove of the one surfa... | 05/11/2004 |
| 6720240 | Silicon based nanospheres and nanowires A nanowire, nanosphere, metallized nanosphere, and methods for their fabrication are outlined. The method of fabricating nanowires includes fabricating the nanowire under thermal and non-catalytic conditions. The nanowires can at least be fabricated from metals, met... | 04/13/2004 |
| 6667252 | Method of manufacturing compound semiconductor substrate A compound semiconductor substrate is manufactured by forming a higher-quality compound semiconductor layer having a smaller number of crystalline defects on a single-crystal substrate, and removing the single-crystal substrate without causing damage to t... | 12/23/2003 |
| 6667243 | Etch damage repair with thermal annealing A method of manufacturing a semiconductor device etches a feature on a substrate in accordance with a photoresist mask. The photoresist mask is removed by plasma etching. Laser thermal annealing is performed to vaporize polymer residue created during the ... | 12/23/2003 |
| 6617249 | Method for making thin film bulk acoustic resonators (FBARS) with different frequencies on a single substrate and apparatus embodying the method A method for fabricating a resonator, and in particular, a thin film bulk acoustic resonator (FBAR), and a resonator embodying the method are disclosed. An FBAR is fabricated on a substrate by introducing a mass loading top electrode layer. For a substrat... | 09/09/2003 |
| 6602790 | Method for patterning a multilayered conductor/substrate structure A method for patterning a multilayered conductor/substrate structure includes the steps of: providing a multilayered conductor/substrate structure which includes a plastic substrate and at least one conductive layer overlying the plastic substrate; and ir... | 08/05/2003 |
| 6541369 | Method and apparatus for reducing fixed charges in a semiconductor device A method and apparatus for reducing trapped charges in a semiconductor device having a first layer and a second layer, said method comprising the steps of providing said first layer, flowing a deposition, a dilution and a conversion gas upon said first la... | 04/01/2003 |
| 6527967 | Thin piece forming method A method of forming a thin-piece sample for use in an electron microscope. The ion beam scanning used for etching a sample block to form a thin-wall portion is initiated from the outer perimeter of two opposite sides of the sample block to be formed, one ... | 03/04/2003 |
| 6472295 | Method and apparatus for laser ablation of a target material A method and apparatus for laser cutting a target material is disclosed. The method includes the steps of generating laser pulses from a laser system and applying the laser pulses to the target material so that the laser pulses cut through the material. T... | 10/29/2002 |
| 6468902 | Semiconductor device and its manufacturing method After making a GaN FET by growing GaN semiconductor layers on the surface of a sapphire substrate, the bottom surface of the sapphire substrate is processed by lapping, using an abrasive liquid containing a diamond granular abrasive material and reducing ... | 10/22/2002 |
| 6461929 | Method for the fine tuning of a passive electronic component A method for the fine tuning of a passive electronic component having at least a carrier substrate and at least one electrically conducting layer containing a material having a conducting nitride, a conducting oxynitride, a semiconductor, or chromium, by ... | 10/08/2002 |
| 6413839 | Semiconductor device separation using a patterned laser projection A method for separating a semiconductor wafer into several thousand devices or dies by laser ablation. Semiconductor wafers are initially pre-processed to create multiple devices, such as blue LEDs, on the wafers. The wafers are then mounted with tape coa... | 07/02/2002 |
