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Pillow with retractable umbrella
A pillow assembly having a supporting assembly and a retractable umbrella assembly that is easily transportable and allows a user to support his/her head while covering their face from sunlight.
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| Number | Title | Issue Date |
| 7432177 | Post-ion implant cleaning for silicon on insulator substrate preparation A combination of a dry oxidizing, wet etching, and wet cleaning processes are used to remove particle defects from a wafer after ion implantation, as part of a wafer bonding process to fabricate a SOI wafer. The particle defects on the topside and the backside of th... | 10/07/2008 |
| 7410826 | Apparatus for manufacturing an electronic device, method of manufacturing an electronic device, and program for manufacturing an electronic device A mounting zone and a reflow zone are arranged in parallel between a loader and an unloader, and mounting and reflow processes are performed simultaneously. ... | 08/12/2008 |
| 7358175 | Serial thermal processor arrangement A serial thermal processing arrangement for treating a wafer of semiconductor material, the steps including: loading the wafer into a chamber at an initial station and purging the chamber with nitrogen gas; introducing formic acid vapor and nitrogen and heating the ... | 04/15/2008 |
| 7354525 | Specimen surface processing apparatus and surface processing method For a surface processing apparatus using a plasma, a mixed gas of a fluorine-containing gas and an oxygen gas is used as an ashing gas. A mixed gas of an oxygen gas and a fluorine-containing gas is introduced as an ashing gas. This allows the following steps to be c... | 04/08/2008 |
| 7353379 | Methods for configuring a plasma cluster tool A method for configuring a plasma cluster tool is disclosed. The method includes generating a key file from option specifications, the key file encapsulating configuration restrictions specifically imposed on the plasma cluster tool. The method also includes generat... | 04/01/2008 |
| 7313452 | Substrate transfer controlling apparatus and substrate transferring method A substrate transfer controlling apparatus can easily maximize throughput of a substrate processing apparatus such as a semiconductor fabrication apparatus, and can satisfy a demand for immediacy of actions of a transfer device. The substrate transfer controlling ap... | 12/25/2007 |
| 7199022 | Manufacturing method of semiconductor device In order to achieve an isolation trench formation process according to the present invention in which the structure of a silicon nitride film liner can be easily controlled and to allow both of reduction of the device feature length and reduction in stress occurring... | 04/03/2007 |
| 7157386 | Photoresist application over hydrophobic surfaces A method of forming a layer of photoresist 28 over a surface 30 of a semiconductor wafer 10 by forming a layer of pre-wet solvent 52 over the surface 30 and forming the layer of photoresist 28 over the layer of pre-wet solve... | 01/02/2007 |
| 7157293 | Method for making a semiconductor light emitting device A method for making a semiconductor light emitting device comprises the steps of: (a) forming a plurality of buttresses on a first supporting substrate such that the buttresses are separated by a plurality of intercommunicated spaces thereamong; (b) forming a base l... | 01/02/2007 |
| 7155360 | Process variation detector and process variation detecting method A process variation detector includes a pulse-signal generating unit that generates a pulse signal having a pulse width corresponding to a characteristic of a process variation in an integrated circuit based on a clock signal; and an output unit that generates a pre... | 12/26/2006 |
| 7144813 | Method and apparatus for thermally processing microelectronic workpieces An apparatus for thermally processing a microelectronic workpiece is provided. The apparatus comprises a rotatable carousel assembly configured to support at least one workpiece. A driver is coupled to the carousel assembly and rotates the carousel assembly, moving ... | 12/05/2006 |
| 7135418 | Optimal operation of conformal silica deposition reactors Methods of forming conformal films that reduce the amount of metal-containing precursor and/or silicon containing precursor materials required are described. The methods increase the amount of film grown following each dose of metal-containing and/or silicon-contain... | 11/14/2006 |
| 7132016 | System for and method of manufacturing a large-area backplane by use of a small-area shadow mask A vapor deposition shadow mask system includes a number of series connected vacuum vessels each having a material deposition source and shadow mask positioned therein. A substrate is translated along a path that has a longitudinal axis that extends through the vacuu... | 11/07/2006 |
| 7105463 | Load lock chamber having two dual slot regions Provided herein is a substrate processing system, which comprises a cassette load station; a load lock chamber; a centrally located transfer chamber; and one or more process chambers located about the periphery of the transfer chamber. The load lock chamber comprise... | 09/12/2006 |
| 7098150 | Method for novel deposition of high-k MSiON dielectric films This disclosure discusses the forming of gate dielectrics in semi conductor devices, and more specifically to forming thin high-k dielectric films on silicon substrates typically using chemical vapor deposition or atomic layer deposition processes. The current inven... | 08/29/2006 |
| 7098077 | Semiconductor chip singulation method A method to singulate a circuit die from an integrated circuit wafer is achieved. The method comprises providing an integrated circuit wafer containing a circuit die. The integrated circuit wafer is cut through by performing a single, continuous cut around the perim... | 08/29/2006 |
| 7097712 | Apparatus for processing a semiconductor A multi-chamber system for providing a process of a high degree of cleanliness in fabricating semiconductor devices such as semiconductor integrated circuits. The system comprises a plurality of vacuum apparatus (e.g., a film formation apparatus, an etching apparatu... | 08/29/2006 |
| 7078272 | Wafer scale integration packaging and method of making and using the same A method of making a microelectronic device comprising: making a device B comprising providing a structure having a first bond pad, depositing a first electrically conductive material having a first reflow temperature over the first bond pad, and depositing a second... | 07/18/2006 |
| 7037842 | Method and apparatus for dissolving a gas into a liquid for single wet wafer processing A method and apparatus for processing a wafer is described. According to the present invention a wafer is placed on a substrate support. A liquid is then fed through a conduit having an output opening over the wafer. A gas is dissolved in the liquid prior to the liq... | 05/02/2006 |
| 7018855 | Process controls for improved wafer uniformity using integrated or standalone metrology A method and apparatus is provided for measuring multiple locations on a wafer for controlling a subsequent semiconductor processing step to achieve greater dimensional uniformity across that wafer. The method and apparatus maps a dimension of a feature at multiple ... | 03/28/2006 |
| 6952622 | Robot pre-positioning in a wafer processing system A wafer cluster tool is described which operates in a regular, periodic fashion. Embodiments of the invention have a periodicity of one sending period. The invention enables the determination of pick-up times for process chambers in the cluster tool, and embodiments... | 10/04/2005 |
| 6951803 | Method to prevent passivation layer peeling in a solder bump formation process A method for reducing peeling of a cross-linked polymer passivation layer in a solder bump formation process including providing a multi-level semiconductor device formed on a semiconductor process wafer having an uppermost surface comprising a metal bonding pad in ... | 10/04/2005 |
| 6946354 | Substrate and manufacturing method therefor There is provided a method of manufacturing a substrate which has a partial insulating layer under a semiconductor layer. After the first substrate (10c) is formed, it is bonded to the second substrate (20), thereby forming a bonded substrate st... | 09/20/2005 |
| 6946411 | Method and system for improving the efficiency of a mechanical alignment tool A technique is disclosed that allows alignment of substrates on a run-to-run basis by using the position data of one or more previously aligned substrates to determine a setpoint of a pre-alignment process for one or more subsequent substrates. The setpoint may also... | 09/20/2005 |
| 6943066 | Active matrix backplane for controlling controlled elements and method of manufacture thereof An electronic device is formed from electronic elements deposited on a substrate. The electronic elements are deposited on the substrate by advancing the substrate through a plurality of deposition vacuum vessels, with each deposition vacuum vessel having at least o... | 09/13/2005 |
| 6930046 | Single workpiece processing system A system and method for processing a workpiece, includes workpiece processors. A robot is moveable within an enclosure to load and unload workpieces into and out of the processors. A processor includes an upper rotor having a central air flow opening. The upper roto... | 08/16/2005 |
| 6927177 | Chemical mechanical electropolishing system A system for thinning a layer on a substrate without damaging a delicate underlying layer in the substrate. The system includes means for mechanically eroding the layer on the substrate, and means for electropolishing the layer on the substrate. In this manner, port... | 08/09/2005 |
| 6924214 | Method for calculating a time-related fill level signal In a method for calculating a time-related fill level signal (h(t)) from a sensor signal (s(t)) of a fill level sensor for detection of the fill level of a liquid, the time-related fill level signal (h(t)) is calculated as a function of the sensor signal (s(t)) and ... | 08/02/2005 |
| 6884701 | Process for fabricating semiconductor device A process for fabricating a semiconductor device having a buried layer comprises the steps of implanting an impurity ion into where the buried layer to be formed in a substrate, providing the substrate inside a reactor furnace, preparing a nonoxidizing atmosphere in... | 04/26/2005 |
| 6872662 | Method for detecting the endpoint of a chemical mechanical polishing (CMP) process A method for detecting the endpoint of a chemical mechanical polishing (CMP) process uses the slope variation of temperature difference of polishing pad. The method combines temperature measurement at polishing pad and atmosphere, and numerical analysis to figure ou... | 03/29/2005 |
| 6838359 | Suppression of n-type autodoping in low-temperature Si and SiGe epitaxy A method of manufacturing a semiconductor device, which method comprises the step of epitaxially growing a stack comprising an n-type doped layer of a semiconductor material followed by at least one further layer of a semiconductor material, the stack being grown in... | 01/04/2005 |
| 6787377 | Determining method of thermal processing condition The invention is a method of determining a set temperature profile for a method of controlling respective substrate temperatures of a plurality of groups in accordance with respective corresponding set temperature profiles, in a method of heat processing a plurality... | 09/07/2004 |
| 6777355 | Manufacturing apparatus and manufacturing method for semiconductor device A manufacturing apparatus for a semiconductor device comprises: a clean room for installing a plurality of semiconductor manufacturing and processing apparatuses; an external air cleaning device connected to a supply port of the clean room for supplying a cleaned-up... | 08/17/2004 |
| 6767846 | Method of securing a substrate in a semiconductor processing machine A method of securing a substrate in a semiconductor processing machine. The method includes moving latch bodies between latched and unlatched positions while permitting contact between a clamping member of each latch body and the substrate only if the latch bodies a... | 07/27/2004 |
| 6743733 | Process for producing a semiconductor device including etching using a multi-step etching treatment having different gas compositions in each step By conducting etching treatment using at least two steps with different compositions of gases for each step, and at least one step comprising using a gas capable of decomposing and vaporizing etching products in an etching apparatus continuously, semicondictor devic... | 06/01/2004 |
| 6734102 | Plasma treatment for copper oxide reduction The present invention provides an in situ plasma reducing process to reduce oxides or other contaminants, using a compound of nitrogen and hydrogen, typically ammonia, at relatively low temperatures prior to depositing a subsequent layer thereon. The adhesion charac... | 05/11/2004 |
| 6670290 | Manufacturing apparatus and manufacturing method for semiconductor device A manufacturing apparatus for a semiconductor device comprises: a clean room for installing a plurality of semiconductor manufacturing and processing apparatuses; an external air cleaning device connected to a supply port of the clean room for supplying a... | 12/30/2003 |
| 6648974 | Device and method for handling substrates by means of a self-leveling vacuum system in epitaxial induction A device for handling substrates, used in an epitaxial apparatus or reactor (20) for chemical vapour deposition (CVD) onto the said substrates, comprises an internal robot (30) provided with means (60) for gripping and transporting substrates, which are i... | 11/18/2003 |
| 6642141 | In-situ silicon nitride and silicon based oxide deposition with graded interface for damascene application A structure to enable damascene copper semiconductor fabrication is disclosed. There is a silicon nitride film for providing a diffusion barrier for Cu as well as an etch stop for the duel damascene process. Directly above the silicon nitride film is a si... | 11/04/2003 |
| 6594536 | Method and computer program for using tool performance data for dynamic dispatch of wafer processing to increase quantity of output A method and computer program for dynamic matching of wafer lots waiting for processing and available tools to maximize wafer output. Wafer lot information and tool capability and availability is provides. Priority wafer lots are processed first. All perm... | 07/15/2003 |
