Class 438/800 - MISCELLANEOUS

Subclass of Class 438 - Semiconductor device manufacturing: process
Definition: Process not provided for above.
No. of patents: 367
Last issue date: 04/09/2013

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Number	Title	Issue Date
6033942	Method of forming a metal-semiconductor field effect transistors having improved intermodulation distortion using different pinch-off voltages A comb-shape MESFET assembly has a plurality of unit FETs including first, second and third groups of unit FETs. The pinch-off voltages of the unit FETs are different from group to group by a step difference. The different pinch-off voltages provide a tai...	03/07/2000
6017812	Bump bonding method and bump bonding apparatus The present invention provides a bump bonding method that can prevent bumps from being inappropriately shaped. The bump bonding method comprises forming a gold ball (16) at the tip of a gold wire (1) that is inserted through a capillary (3), lowering the ...	01/25/2000
6015744	Method of manufacturing a shallow trench isolation alignment mark A method of manufacturing a shallow trench isolation alignment mark comprises the steps of first providing a silicon wafer whose surface has an alignment mark formed thereon. Next, a silicon nitride layer is formed over the silicon wafer, and then shallow...	01/18/2000
6013567	Controlled cleavage process using pressurized fluid A technique for forming a film of material (12) from a donor substrate (10). The technique has a step of introducing energetic particles (22) in a selected manner through a surface of a donor substrate (10) to a selected depth (20) underneath the surface,...	01/11/2000
6010939	Methods for making shallow trench capacitive structures Disclosed is a capacitive structure and method for making the capacitive structure for suppressing inductive noise produced by high performance device power supplies. The capacitive structure includes a trench having a bottom surface and respective walls ...	01/04/2000
6001189	Method for reducing gaseous species of contamination in wet processes A method for wet processing of a semiconductor-containing substrate that reduces contamination in the wet process by removing undesired sources of gas contamination, the method comprising: pumping a processing liquid through a degasifier, exposing the sem...	12/14/1999
5998298	Use of chemical-mechanical polishing for fabricating photonic bandgap structures A method is disclosed for fabricating a two- or three-dimensional photonic bandgap structure (also termed a photonic crystal, photonic lattice, or photonic dielectric structure). The method uses microelectronic integrated circuit (IC) processes to fabrica...	12/07/1999
5989983	Method of fabricating and curing spin-on-glass layers by electron beam irradiation An insulating layer may be fabricated on a microelectronic substrate by spinning a layer of spin-on-glass (SOG) on a microelectronic substrate and curing the SOG layer by irradiating the SOG layer with an electronic beam. Irradiating may take place simult...	11/23/1999
5904545	Apparatus for fabricating self-assembling microstructures Apparatus for assembling microstructures onto a substrate through fluid transport. The apparatus includes a vessel that contains the substrate, a fluid, and microstructures. The substrate has at least one recessed region thereon. The microstructures being...	05/18/1999
5883017	Compartmentalized substrate processing chamber A process chamber for semiconductor wafers is formed of multiple compartments. A first compartment is provided for supplying an isolated environment for processing the wafers, and a second compartment is provided, in selective communication with the first...	03/16/1999
5858861	Reducing nitride residue by changing the nitride film surface property A new method of changing the surface property of a nitride film from hydrophobic to hydrophillic and thereby reducing nitride residue after photolithography is described. A pad oxide layer is provided on the surface of a semiconductor substrate. A nitride...	01/12/1999
5795356	Microelectronic component fabrication facility, and process for making and using the facility A process for manufacturing microelectronic components that can be fabricated in a facility 1 including integrated circuits on silicon wafers, flat panel displays on glass substrates or any other microelectronic components fabricated in a similar fashion,...	08/18/1998
5700696	Method for preparation of conjugated arylene or heteroarylene vinylene polymer and device including same A technique is described for the preparation of conjugated arylene and heteroarylene vinylene polymers wherein conversion of the polymer precursor is effected at a temperature ranging from 150°-300° C. in the presence of forming gas. Studies have s...	12/23/1997
5656557	Process for producing various gases for semiconductor production factories Disclosed is a production process and apparatus of high-purity air and various air material gases for semiconductor production factories that, together with enabling the production of high-purity air, also enables the production high-purity nitrogen simul...	08/12/1997
5637532	Interconnect decoupling scheme Capacitive coupling between neighboring conductive lines of the semiconductor device is reduced by applying an alternating magnetic field in a direction perpendicular to the plane of the conductive lines....	06/10/1997
5610103	Ultrasonic wave assisted contact hole filling A method of eliminating or substantially eliminating voids formed in the bottom of high aspect ratio holes following the physical vapor deposition of a material over the surface of a substrate. The method includes placing the substrate in an ultrasonic pr...	03/11/1997
5516732	Wafer processing machine vacuum front end method and apparatus A carrousel type wafer processing machine in which wafers are held in vertical orientations in holders on a rotatable plate and sequenced through a plurality of processing stations for processing, such as by the application of a sputtered film thereto, is...	05/14/1996
5484748	Method for storage of silicon wafer The single crystal silicon wafers which have undergone a treatment with a chemical liquid such as an acid or an alkali are stored without entailing contamination of their surfaces by causing the wafers to be immediately immersed, either directly or after ...	01/16/1996
5462900	Method of manufacturing semiconductor elements without burrs A method of manufacturing semiconductor elements with metal electrode films formed thereon in which the elements are spread on a metal screen having a mesh size small enough to prohibit the semiconductor elements from passing through it. The metal screen ...	10/31/1995
5448488	Computer-controlled individual chip management system for processing wafers Chips formed on respective wafers are numbered. A map in which chip positions are correlated with chip numbers is created. A process is specified for each individual chip. A host computer creates processing information from inputted lot information for ea...	09/05/1995
5424254	Process for recovering bare semiconductor chips from plastic packaged modules by thermal shock The method of the present invention is particularly directed to plastic packaged modules of the type wherein the contact zones of the chip are connected by wire-bonding to lead conductors and wherein the chip is molded in etch resistant resins. The openin...	06/13/1995
5401692	Method for minimizing particle generation on a wafer surface during high pressure oxidation of silicon A wafer 2 is supported polished (active) face down in a recess formed in the upper surface of a second wafer 4 which serves as a wafer support. The two wafers 2, 4 are disposed in an atmosphere of steam at 900° C. at a pressure of 500 psi which results i...	03/28/1995
5380567	Hermetic coatings by heating hydrogen silsesquinoxane resin in an inert atmosphere The present invention relates to a method of forming a coating on a substrate in the absence of oxygen. The method comprises coating the substrate with a solution comprising a solvent and hydrogen silsesquioxane resin. The solvent is evaporated and a prec...	01/10/1995
5380682	Wafer processing cluster tool batch preheating and degassing method A wafer processing cluster tool, having one or more load-locks, is provided with one or more batch preheating modules that receive wafers only from the cluster tool transport module at the internal vacuum pressure of the machine. The loading, unloading, h...	01/10/1995
5348893	Method for treatment of semiconductor wafer A method for the impartation of a mechanical distortion to a semiconductor wafer by the collision of particles against the surface of the semiconductor wafer is disclosed which represses the pollution of the semiconductor wafer with impurities from the pa...	09/20/1994
5314848	Method for manufacturing a semiconductor device using a heat treatment according to a temperature profile that prevents grain or particle precipitation during reflow Described is a method for manufacturing semiconductor devices which includes a heat treating process for heating and cooling semiconductor substrates mounted on a boat at a predetermined pitch according to a predetermined temperature profile, in order to ...	05/24/1994
5314847	Semiconductor substrate surface processing method using combustion flame In order to provide the processing required to prevent a semiconductor substrate from becoming contaminated or damaged, without heating it in a kiln, a combustion flame of a gas that is a mixture of hydrogen and oxygen is applied to the surface of the sem...	05/24/1994
5294570	Reduction of foreign particulate matter on semiconductor wafers A substantial reduction in the foreign particulate matter contamination on surfaces, such as the surfaces of semiconductor wafers, is achieved by treating the surfaces with a solution comprising a strong acid and a very small amount of a fluorine-containi...	03/15/1994
5275976	Process chamber purge module for semiconductor processing equipment A process chamber purge module (56) is provided, including a stack module (60) and a process chamber liner (62). The stack module comprises a plurality of quartz plates (100, 110, and 116) having flow apertures to permit radial and axial flow of a purge g...	01/04/1994
5266527	Conformal wafer chuck for plasma processing having a non-planar surface A method of processing a semiconductor wafer using a wafer chuck having a first end with a non-planar surface, the non-planar surface shaped such that a wafer supported at a plurality of points about its periphery will have a uniform pressure between its ...	11/30/1993
5219613	Process for producing storage-stable surfaces of polished silicon wafers Silicon wafers are first subjected to an oxidative treatment and subsequey to exposure to organosilicon compounds which contain at least one radical in the molecule which is hydrolyzably bound to the silicon and at least one radical in the molecule havin...	06/15/1993
5110764	Method of making a beveled semiconductor silicon wafer A semiconductor silicon wafer usable for integrated circuits has beveled portions unsymmetrically formed along circumferential edges of front and back surfaces thereof. An angle between an inclining surface of the beveled portion and a main surface on the...	05/05/1992
5106787	Method for high vacuum controlled ramping curing furnace for SOG planarization An apparatus is described for vacuum degassing and curing a spin-on-glass layer on an article. The machine has a chamber into which an article, such as at least one or more semiconductor wafers are moved by appropriate means. Means are provided for causin...	04/21/1992
5089441	Low-temperature in-situ dry cleaning process for semiconductor wafers A low-temperature (650° C. to 800° C.) in-situ dry cleaning process (FIG. 2) for removing native oxide (and other contaminants) from a semiconductor surface can be used with either multi-wafer or single-wafer semiconductor device manufacturing reactors....	02/18/1992
4983546	Method for curing spin-on-glass film by utilizing ultraviolet irradiation A method for curing spin-on-glass formed on a wafer film which insulates the metal layers and flattens any step difference in the process for manufacturing a multi-layered metal layer of a highly integrated semiconductor device which comprises establishin...	01/08/1991
4983548	Method of fabricating a semiconductor device including removal of electric charges A method of fabricating a semiconductor device comprises steps of accommodating a substrate on which the semiconductor device is to be fabricated in a container of an electrically insulating material, forming a film of a volatile organic solvent such that...	01/08/1991
4937206	Method and apparatus for preventing cross contamination of species during the processing of semiconductor wafers A method for preventing cross-contamination of semiconductor wafers during processing comprising covering a surface portion of a support assembly with a process compatible material, engaging a semiconductor wafer with the support assembly, processing the ...	06/26/1990
4883775	Process for cleaning and protecting semiconductor substrates A process for the production of semiconductor devices which comprises washing a cleaned semiconductor substrate with or without one or more component parts formed thereon, with pure water, freezing the pure water containing the washed substrate, preservin...	11/28/1989
4783225	Wafer and method of working the same A wafer having chamfered bent portions in the joint regions between the contour of the wafer and the cut-away portion of the wafer such as an orientation flatness. The chipping of the wafer can be prevented, and in coating the wafer with a photoresist, fo...	11/08/1988
4756796	Method of producing wafer There is disclosed a method of providing an elongated stock; producing a wafer comprising the steps of processing one end face of an elongated stock to form a first flat surface; cutting through one end portion of the stock transversely by a cutter to pro...	07/12/1988

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Class 438/800 - MISCELLANEOUS