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...During the Civil War, the Confederacy established its own Patent Office which issued 266 patents, a third of which concerned implements of war.
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| Number | Title | Issue Date |
| 6531334 | Method for fabricating hollow package with a solid-state image device A hollow package includes a package body composed of an epoxy resin having a low thermal coefficient of linear expansion, wherein the package body includes a recess for receiving an electronic component, and leads, for extracting electrodes of the electro... | 03/11/2003 |
| 6531333 | Chip photoelectric sensor assembly and method for making same A chip photoelectric sensor assembly includes a substrate with a printed circuit board mounted thereon. A photoelectric sensor chip is provided with a plurality of photoelectric sensors and is mounted on the substrate such that the photoelectric sensor ch... | 03/11/2003 |
| 6528717 | Photovoltaic panel and method of producing same Producing a photovoltaic panel, including forming holes in a first electrode plate, fitting, in the holes, photovoltaic elements, each having a P-N junction between a core and a shell, electrically connecting a first portion of the shell of each photovolt... | 03/04/2003 |
| 6528407 | Process for producing electrical-connections on a semiconductor package, and semiconductor package Process for producing electrical-connections on a semiconductor package containing an integrated-circuit chip and with an external protective layer having apertures that least partly expose metal electrical-connection regions, and semiconductor package pr... | 03/04/2003 |
| 6524891 | Method of pressure curing for reducing voids in a die attach bondline and applications thereof A method of curing adhesives of a die attach material to reduce the formation of voids at the resulting bondline, defined by the interface between the adhesive and the surface of a die being attached. The method includes applying a relatively high pressur... | 02/25/2003 |
| 6521823 | Solar cell and method of fabricating the same In a solar cell, there is provided a method of improving external appearance quality by lowering surface reflection and by making a change of a color tone at openings and portions between electrode patterns, resulting from integrating working, inconspicuo... | 02/18/2003 |
| 6514787 | Opto-electric mounting apparatus An integrated circuit is provided with one or more connectors which allow an opto-electric device to be mounted on the integrated circuit directly on top of or underneath of it. Multiple opto-electric device interface regions can be defined on the integra... | 02/04/2003 |
| 6515218 | Photovoltaic element, process for the production thereof, method for removing a cover portion of a covered wire, and method for joining a covered wire and a conductor A photovoltaic element having a wire disposed on a surface of the photovoltaic element for outputting a power generated by the photovoltaic element, and an electrode electrically joined with the wire while forming a joining portion, wherein the joining po... | 02/04/2003 |
| 6514789 | Component and method for manufacture A component (10) includes a substrate (15), a cap wafer (23), and a protection layer (28) formed over a surface of the cap wafer (23). Together, the protection layer (28) and the cap wafer (23) form a cap structure (39) that is bonded to the substrate (15... | 02/04/2003 |
| 6504107 | Electro-optic module and method for the production thereof An assembly unit comprises a printed circuit board (10) and an optical component (54, 56, 58), the printed circuit board (10) being provided with at least one electro-optical component (16), at least one conducting track (24) for the connection of the ele... | 01/07/2003 |
| 6490166 | Integrated circuit package having a substrate vent hole The present invention involves a method of providing an integrated circuit package having a substrate with a vent opening. The integrated circuit package includes a substrate having an opening and an integrated circuit mounted to the substrate. An underfi... | 12/03/2002 |
| 6489178 | Method of fabricating a molded package for micromechanical devices A plastic land-grid array package, a ball-grid array package, and a plastic leaded package for micromechanical components are fabricated by a molding process characterized by lining the cavity surfaces of the top and bottom mold halves with a protective p... | 12/03/2002 |
| 6479317 | Method for integrating anti-reflection layer and salicide block The present invention is a method for integrating an anti-reflection layer and a salicide block. The method comprises the following steps: A substrate is provided that is divided into at least a sensor area and a transistor area, wherein the sensor area c... | 11/12/2002 |
| 6479316 | Decals and methods for providing an antireflective coating and metallization on a solar cell A decal for use in forming a solar cell comprises an antireflective precursor material and a patterned electrically conductive material. The antireflective precursor material and the patterned electrically conductive material are disposed over a base mate... | 11/12/2002 |
| 6475824 | X-ray detector and method of fabricating the same An X-ray detector, which comprises a gate pad connected to a gate line disposed crosswise in a first direction, a data pad connected to a data line disposed lengthwise in a second direction substantially perpendicular to the first direction, a switching e... | 11/05/2002 |
| 6471816 | Method of solar battery output section fabrication In this method of solar battery output section fabrication, a metal foil is attached to an output terminal on a substrate surface, or a resin film is disposed over a conductive paste as the output terminal on the substrate surface. Subsequently, an openin... | 10/29/2002 |
| 6472247 | Solid-state imaging device and method of production of the same In a solid-state imaging device and its production method according to the present invention, a solid-state image sensor has an effective light-receiving region on a circuit formation surface provided in a face-down condition. A transparent substrate has ... | 10/29/2002 |
| 6472246 | Electrostatic discharge protection for integrated circuit sensor passivation A structure and method for creating an integrated circuit passivation (24) comprising, a circuit (16), a dielectric (18), and metal plates (20) over which an insulating layer (26) is disposed that electrically and hermetically isolates the circuit (16), a... | 10/29/2002 |
| 6469242 | Thin-film solar cell module and method of manufacturing the same In a substrate-integration-type thin-film solar cell module wherein an element is directly formed on a transparent insulating substrate, wiring between a bus region and a terminal box is formed of a solder-plated copper foil. To ensure insulation between ... | 10/22/2002 |
| 6469243 | Dye-sensitizing solar cell, method for manufacturing dye-sensitizing solar cell and solar cell module A dye-sensitizing solar cell comprising: a first substrate whose surface is at least conductive; a second substrate on which a conductive layer is formed, the second substrate being transparent, the first and second substrates being spaced by a distance w... | 10/22/2002 |
| 6462266 | Photovoltaic cell and method for the production thereof A new photovoltaic cell is described, in particular a dye or solar cell having electrically conducting coatings on spaced, glass support panes. In its border zones, the cell is provided with a circumferentially extending seal. Furthermore, the electricall... | 10/08/2002 |
| 6455855 | Sealed detector for a medical imaging device and a method of manufacturing the same An apparatus and method are provided for sealing a light imaging array and scintillator of an imaging device which prevents light or moisture from entering the sealed cavity while controlling the lateral expansion of the epoxy material during construction... | 09/24/2002 |
| 6440778 | Optical semiconductor element package and manufacturing method thereof An optical semiconductor element package including a housing, electric signal input and output wiring boards, and external leads. The housing has a metal frame and a metal bottom plate, for storing optical semiconductor elements. The electric signal input... | 08/27/2002 |
| 6420645 | Roof with plurality of solar cell modules having filler layer of varying thickness and manufacturing method thereof A roof member module is provided which is excellent in foldability and durability. The filler thickness in the downwardly facing parts, engagement parts, and upwardly facing folded parts of the roof member module are made thinner than the filler that is p... | 07/16/2002 |
| 6420204 | Method of making a plastic package for an optical integrated circuit device A method of making a package for an integrated circuit device having an optical cell is disclosed. The package includes a base of molded encapsulant material. A metal leadframe is embedded in the plastic base at the upper surface of the base. Encapsulant ... | 07/16/2002 |
| 6420647 | Texturing of glass by SiO2 film A thin film silicon solar cell is provided on a glass substrate, is illustrated, the glass having a textured surface, including larger scale surface features and smaller scale surface features. Over the surface is deposited a thin barrier layer which also... | 07/16/2002 |
| 6414237 | Solar collectors, articles for mounting solar modules, and methods of mounting solar modules There is provided a solar collector comprising at least one solar module; at least one solar module frame which supports the solar module; and at least one solar module bracket comprising a profile channel engagement hook, the profile channel engagement h... | 07/02/2002 |
| 6414238 | Method of fastening a solar cell to a support, especially a structure A solar cell having a rear backing of a polyvinylfluoride foil is bonded by a mortar consisting of a finely divided neutral aggregate, a hydraulic cement and an aqueous dispersion of a polyacrylic acid derivative having a logarithmic decrement of torsiona... | 07/02/2002 |
| 6410362 | Flexible thin film solar cell A clear thermal emissive coating, such as clear polyimide, is deposited directly upon a thin film solar cell forming a flexible thin film solar cell. The thin film solar cell can be deposited on another thermal emissive coating used as a substrate during ... | 06/25/2002 |
| 6403387 | Method and apparatus for transfer molding encapsulation of a semiconductor die with attached heat sink A semiconductor device includes a heat sink adjacent to a die. A dam is positioned at the peripheral edges of the heat sink. During a transfer molding process, the dam serves two purposes. First, the dam prevents damage to the mold. Second, the dam preven... | 06/11/2002 |
| 6399412 | Photovoltaic panel and method of producing same Producing a photovoltaic panel, including forming holes in a first electrode plate, fitting, in the holes, photovoltaic elements, each having a P-N junction between a core and a shell, electrically connecting a first portion of the shell of each photovolt... | 06/04/2002 |
| 6395585 | Method for housing sensors in a package A method for housing sensors in a package and, in particular, housing chemical sensors, flow sensors or optical sensors in a synthetic package. In a first step, the active sensor surface of a semiconductor or IC sensor is provided with a cap forming a hol... | 05/28/2002 |
| 6395972 | Method of solar cell external interconnection and solar cell panel made thereby A method of solar cell external interconnection and a solar cell panel (1) made thereby are disclosed. An assembly (2) including a solar cell module (4), a flexible lead frame (5) to which the solar cell module is to be interconnected and a solder located... | 05/28/2002 |
| 6391673 | Method of fabricating micro electro mechanical system structure which can be vacuum-packed at wafer level A method of fabricating a micro electromechanical system (MEMS) structure which can be vacuum-packaged at the wafer level is provided. The method includes the steps of forming a multilayered stack including a signal line on a first wafer; bonding a second... | 05/21/2002 |
| 6387723 | Reduced surface charging in silicon-based devices A method of treating silicon-based surfaces for reducing charge migration is disclosed. In accordance with the method, a silicon-based surface is treated with Nitrogen-rich pacifying gas environment, after the surface is actuated. The surface is actuated ... | 05/14/2002 |
| 6379988 | Pre-release plastic packaging of MEMS and IMEMS devices A method is disclosed for pre-release plastic packaging of MEMS and IMEMS devices. The method can include encapsulating the MEMS device in a transfer molded plastic package. Next, a perforation can be made in the package to provide access to the MEMS elem... | 04/30/2002 |
| 6379991 | Encapsulation methods for semiconductive die packages The invention includes a semiconductor processing method of forming a die package. An insulative substrate is provided. Circuitry is over a topside of the substrate, and a slit extends through the substrate. A semiconductive-material-comprising die is pro... | 04/30/2002 |
| 6380477 | Method of making photovoltaic device A photovoltaic device and a method for its manufacture. The device essentially comprises a thin film cell layer 14, a contact transfer release sheet 54, and a foil strip interconnect clip 80. The contact transfer release sheet 54 is bonded to the thin fil... | 04/30/2002 |
| 6380563 | Opto-electric mounting apparatus An integrated circuit is provided with one or more connectors which allow an opto-electric device to be mounted on the integrated circuit directly on top of or underneath of it. Multiple opto-electric device interface regions can be defined on the integra... | 04/30/2002 |
| 6369316 | Photovoltaic module and method for producing same A description is given of a photovoltaic module (1) in the form of a laminate, which as the core layer exhibits a solar cell system (2) and encapsulation materials (3, 3') applied on both sides of the latter. According to the invention, at least one encap... | 04/09/2002 |
