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| Number | Title | Issue Date |
| 8158452 | Backside-illuminated imaging device and manufacturing method of the same A backside-illuminated imaging device, which performs imaging by illuminating light from a back side of a semiconductor substrate to generate electric charges in the semiconductor substrate based on the light and reading out the electric charges from a front side of... | 04/17/2012 |
| 8153467 | Semiconductor device with groove structure to prevent molding resin overflow over a light receiving region of a photodiode during manufacture and method for manufacturing same A method for manufacturing a semiconductor device, includes the steps of: forming a resin layer on an upper surface of a substrate including a photodiode such that the resin layer does not cover a light receiving region of the photodiode; forming at least one groove... | 04/10/2012 |
| 8133752 | Solar cells which include the use of certain poly(vinyl butyral)/film bilayer encapsulant layers with a low blocking tendency and a simplified process to produce thereof The present invention provides a solar cell laminate comprising a preformed bi-layer sheet having a poly(vinyl butyral) sub-layer. ... | 03/13/2012 |
| 8048708 | Method and apparatus providing an imager module with a permanent carrier Method and apparatus providing a wafer level fabrication of imager modules in which a permanent carrier protects imager devices on an imager wafer and is used to support a lens wafer. ... | 11/01/2011 |
| 8034651 | Light receiving device and method of manufacturing light receiving device A light receiving device 1 includes a support substrate 12 provided thereon with a photodetector 11 including a photodetecting portion 111 and a base substrate 112 on which the photodetecting portion 111 is placed; and a tra... | 10/11/2011 |
| 7998780 | Thinned image sensor with trench-insulated contact terminals The invention relates to the fabrication of thinned substrate image sensors, and notably color image sensors. After the fabrication steps carried out from the front face of a silicon substrate the front face is transferred onto a substrate. The silicon is thinned, a... | 08/16/2011 |
| 7947524 | Humidity control and method for thin film photovoltaic materials A method for processing a thin film photovoltaic module. The method includes providing a plurality of substrates, each of the substrates having a first electrode layer and an overlying absorber layer composed of copper indium gallium selenide (CIGS) or copper indium... | 05/24/2011 |
| 7939361 | Semiconductor device and method for fabricating semiconductor device Gold bumps are located over electrode pads of a solid imaging device and an adhesive is formed over the gold bumps. A transparent plate is supported by the gold bumps and is made to adhere over the solid imaging device by the adhesive. The gold bumps and an electrod... | 05/10/2011 |
| 7939360 | Semiconductor device and manufacturing method therefor A semiconductor device which includes a semiconductor chip formed with a light-reception area, a spacer, and a transparent substrate. The spacer is bonded to the semiconductor chip via a first adhesive and surrounding the light-reception area. The transparent substr... | 05/10/2011 |
| 7932121 | Semiconductor device and manufacturing method of the same A semiconductor device includes a semiconductor element, a transparent member separated from the semiconductor element by a designated length and facing the semiconductor element, a sealing member sealing an edge surface of the transparent member and an edge part of... | 04/26/2011 |
| 7919348 | Methods for protecting imaging elements of photoimagers during back side processing Methods for processing photoimagers include forming one or more protective layers over the image sensing elements of a photoimager. Protective layers may facilitate thinning of the substrates of photoimagers, as well as prevent contamination of the image sensing ele... | 04/05/2011 |
| 7906362 | Assembling two substrates by molecular adhesion An assembly method to enable local electrical bonds between zones located on a face of a first substrate and corresponding zones located on a face of a second substrate, the faces being located facing each other, at least one of the substrates having a surface topog... | 03/15/2011 |
| 7901972 | Camera module and method of manufacturing the same Provided is a method of manufacturing a camera module, the camera module including a housing that includes one or more lenses which are sequentially fixed and coupled and of which the focus does not need to be adjusted; a holder assembly that is coupled to a lower e... | 03/08/2011 |
| 7867807 | Method for manufacturing photoelectric converting device The present invention relates to a manufacturing method of obtaining a photoelectric converting device which can sufficiently maintain airtightness of a housing space for photocathode without degradation of the characteristics of the photocathode. In accordance with... | 01/11/2011 |
| 7867806 | Electronic component structure and method of making An external component, typically a surface mount passive, is attached to a semiconductor die. In some embodiments the passive is placed directly over exposed pads on the semiconductor die and attached using conductive tape or conductive epoxy. In some embodiments th... | 01/11/2011 |
| 7858427 | Crystalline silicon solar cells on low purity substrate A method is provided for making a crystalline silicon solar cell on a low purity substrate by depositing p+-p-n+, or n+-n-p+ layers of amorphous silicon, depending on the type of wafer, on a crystalline silicon substrate, such as an upgraded metallurgical grade sili... | 12/28/2010 |
| 7776640 | Image sensing device and packaging method thereof An image sensing device and a packaging method thereof is disclosed. The packaging method includes the steps of providing an adhesive layer; placing a substrate, having an opening, on the adhesive layer; disposing an image sensor within the opening on the adhesive l... | 08/17/2010 |
| 7759155 | Optical data transceivers An optical data transceiver is manufactured by forming an integrated control circuit (101) on a suitable substrate, such as a silicon wafer, and then mounting said integrated circuit (101) onto the lead frame (102). Electrical connections may th... | 07/20/2010 |
| 7749797 | Semiconductor device having a sensor chip, and method for producing the same A semiconductor device and method is disclosed. In one embodiment, the semiconductor device includes a cavity housing and a sensor chip. In one embodiment, the cavity housing has an opening to the surroundings. The sensor region of the sensor chip faces said opening... | 07/06/2010 |
| 7723146 | Integrated circuit package system with image sensor system An integrated circuit package system is provided including providing a wafer including image sensor systems having interconnects connected thereto and encapsulating the image sensor systems and interconnects in a transparent encapsulant. The system includes removing... | 05/25/2010 |
| 7691662 | Optical module producing method and apparatus An optical module is produced by coating, with respect to a substrate having a substrate surface provided with terminal pads and landing pads a solder material on the terminal pads, mounting an optical element package having terminals and a flat top surface on the s... | 04/06/2010 |
| 7674649 | Radio frequency identification (RFID) tag lamination process using liner A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set. ... | 03/09/2010 |
| 7670866 | Multi-die molded substrate integrated circuit device One embodiment includes a substrate having a plurality of dies and a support frame made of molding material which is molded between adjacent dies so as to join together and support adjacent dies. The embodiment further has a plurality of interconnects formed on sele... | 03/02/2010 |
| 7651881 | Solid-state imaging device and method for manufacturing the same A transfer film, on which an adhesive is applied, is glued to plural spacers formed on a glass substrate. The glass substrate is laid on a working table, and one end of the transfer film is fixed to a winding roller. A peeling guide is set at a position over the tra... | 01/26/2010 |
| 7651882 | RFID tag circuit die with shielding layer to control I/O bump flow The present description describes back-end processes, the use of which may help overcome these problems and limitations of the prior art. In one optional embodiment, the back-end process includes depositing a layer over a wafer. The wafer contains a plurality of cir... | 01/26/2010 |
| 7648851 | Method of fabricating backside illuminated image sensor A method for fabricating a back-side illuminated image sensor includes providing a semiconductor substrate having a front surface and back surface, providing a plurality of transistors, metal interconnects, and metal pads on front surface of the substrate, bonding a... | 01/19/2010 |
| 7635606 | Wafer level package with cavities for active devices According to one exemplary embodiment, a method for forming a wafer level package includes fabricating an active device on a substrate in a semiconductor wafer, forming polymer walls around the active device, and applying a blanket film over the semiconductor wafer ... | 12/22/2009 |
| 7615397 | Micro-element package and manufacturing method thereof A method of manufacturing a micro-element package which can reduce a manufacturing cost and improve productivity by simplifying its structure and manufacturing process, and also can make contributions to miniaturization and thinness, and the micro-element package ar... | 11/10/2009 |
| 7572665 | Microelectronics grade metal substrate, related metal-embedded devices and methods for fabricating same Fabricating a microelectronics grade metal substrate comprises forming the metal substrate on a sacrificial substrate. An adhesion layer can be deposited on or over the surface of the sacrificial substrate. A seed layer of the metal can be deposited on or over the a... | 08/11/2009 |
| 7553688 | Methods for packaging image sensitive electronic devices The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a ... | 06/30/2009 |
| 7547571 | Packaging method of a light-sensing semiconductor device and packaging structure thereof The present invention discloses a packaging method of a light-sensing semiconductor device and a packaging structure thereof, wherein a matrix of spacer walls is formed on a light-sensing wafer, which has multiple light-sensing chips, and the adhesive is directly ap... | 06/16/2009 |
| 7534645 | CMOS type image sensor module having transparent polymeric encapsulation material A CMOS type of image sensor module for use in a mobile camera or a PC camera includes an image sensoring semiconductor chip encapsulated in a transparent block of polymeric material on a substrate having a circuit to which the ship is connected. The image sensoring ... | 05/19/2009 |
| 7524696 | Sensor including lead frame and method of forming sensor including lead frame A sensor includes a plurality of leads that have bottom surfaces extending in a first plane, a stage that extends in a second plane that tilts from the first plane, a sensor chip that is supported on the stage, a modified connection lead structure that supports the ... | 04/28/2009 |
| 7521279 | Image projection at different image planes An image projection module within a housing is operative for causing selected pixels in a raster pattern to be illuminated to produce an image at different image planes of VGA quality. A movable component on the housing causes the image to be formed at a selected im... | 04/21/2009 |
| 7510902 | Image sensor chip package and method of fabricating the same The present invention relates to an image sensor chip package and a method for fabricating the same. In one embodiment of an image sensor chip package, chip pads on a first surface of an image sensor chip are attached to electrode pads of a glass substrate with cond... | 03/31/2009 |
| 7491570 | Die package having an adhesive flow restriction area A die package having an adhesive flow restriction area. In a first embodiment, the adhesive flow restriction area is formed as a trench in a transparent element. A second embodiment has a transparent element with an adhesive flow restriction area formed as a plurali... | 02/17/2009 |
| 7465603 | Wafer level package structure of optical-electronic device and method for making the same A wafer level package structure of optical-electronic device and method for making the same are disclosed. The wafer level package structure of optical-electronic device is provided by employing a substrate whose surfaces have several optical sensitive areas and div... | 12/16/2008 |
| 7425750 | Snap lid camera module An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the moldin... | 09/16/2008 |
| 7422929 | Wafer-level packaging of optoelectronic devices In an embodiment, the invention provides a method for forming a wafer-level package. A bonding pad is formed on a first wafer. After forming the bonding pad, an optoelectronic device is located on the first wafer. A gasket is formed on a second wafer. After a gasket... | 09/09/2008 |
| 7419854 | Methods for packaging image sensitive electronic devices The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a ... | 09/02/2008 |
