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| Number | Title | Issue Date |
| 8187965 | Wirebond pad for semiconductor chip or wafer In the present invention, copper interconnection with metal caps is extended to the post-passivation interconnection process. Metal caps may be aluminum. A gold pad may be formed on the metal caps to allow wire bonding and testing applications. Various post-passivat... | 05/29/2012 |
| 8143155 | Wire bonding method and semiconductor device After forming a pressure-bonded ball and a ball neck by bonding an initial ball to a pad, a capillary is moved upward, away from a lead, and then downward, thereby the ball neck is trodden on by a face portion that is on the lead side of the capillary. Subsequently,... | 03/27/2012 |
| 8138081 | Aluminum bump bonding for fine aluminum wire The invention includes a packaged semiconductor device in which the bond wires are bonded to the leads with an aluminum bump bond. The semiconductor device is mounted on a leadframe having leads with a nickel plating. To form the bump bond between a fine aluminum wi... | 03/20/2012 |
| 8138080 | Integrated circuit package system having interconnect stack and external interconnect An integrated circuit package system is provided forming an integrated circuit die having a first bond pad provided thereon, forming an interconnect stack on a first external interconnect, and connecting the interconnect stack to the first bond pad. ... | 03/20/2012 |
| 8129263 | Wire bond interconnection and method of manufacture thereof A method of manufacture of a semiconductor package includes: providing a substrate; mounting a semiconductor die on the substrate, the semiconductor die having a die pad; mounting a lead finger on the substrate; attaching a support pedestal on sides of the lead fing... | 03/06/2012 |
| 8110492 | Method for connecting a die attach pad to a lead frame and product thereof Disclosed in this specification is a semiconductor package with a die attach pad and a lead frame which are electrically and mechanically connected to one another through a conductive wire ribbon. Such a configuration reduces the package footprint and also permits d... | 02/07/2012 |
| 8067307 | Integrated circuit package system for stackable devices An integrated circuit package system comprising: providing a package die; and connecting a connector lead having a first connector end with a protruded connection surface and a lowered structure over the package die. ... | 11/29/2011 |
| 8053351 | Method of forming at least one bonding structure A method of forming at least one bonding structure may be provided. A ball may be formed on the front end of a wire outside a capillary. The capillary may be moved downwardly to form a preliminary compressed ball on a first pad using the ball. The capillary may be m... | 11/08/2011 |
| 8043956 | Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protective layer In semiconductor devices having a copper-based metallization system, bond pads for wire bonding may be formed directly on copper surfaces, which may be covered by an appropriately designed protection layer to avoid unpredictable copper corrosion during the wire bond... | 10/25/2011 |
| 8021973 | System and method to reduce the bondwire/trace inductance A method and system for reducing the inductance on an integrated circuit. The method and system comprises providing a first differential line, including a first input and a first output, the first differential line including at least two bondwire traces which are co... | 09/20/2011 |
| 8012869 | Bonded structure and bonding method An aluminum wire is bonded to a silicon electrode by a wedge tool pressing the aluminum wire against the silicon electrode. In this way, a firmly bonded structure is obtained by sequentially stacking aluminum, aluminum oxide, silicon oxide, and silicon. ... | 09/06/2011 |
| 8012868 | Semiconductor device having EMI shielding and method therefor A semiconductor device has a substrate having a plurality of metal layers. A die coupled to the substrate. A first wire fence structure is formed on the substrate. A second wire fence structure is formed on the substrate. A mold compound is used for encapsulating th... | 09/06/2011 |
| 8012867 | Wafer level chip scale package system A wafer level chip scale package system is provided including placing a first integrated circuit over a semiconductor wafer having a second integrated circuit; connecting a second electrical interconnect between the first integrated circuit and the second integrated... | 09/06/2011 |
| 8008183 | Dual capillary IC wirebonding The invention discloses apparatus and methods for the formation of bond wires in integrated circuit assemblies by attaching two separate wires using a dual capillary bond head. The separate wires are preferably non-identical, for example, being of different gauges a... | 08/30/2011 |
| 7981788 | Semiconductor device and a manufacturing method of the same The degree of freedom of the chip layout in a semiconductor device is improved, and improvement in packaging density is aimed at. Since it becomes possible to form the wire of two directions on the pad of a memory chip by performing the over-bonding of revers... | 07/19/2011 |
| 7951702 | Methods for fabricating semiconductor components with conductive interconnects having planar surfaces A backside method for fabricating a semiconductor component with a conductive interconnect includes the step of providing a semiconductor substrate having a circuit side, a backside, and a substrate contact on the circuit side. The method also includes the steps of ... | 05/31/2011 |
| 7932171 | Dual metal stud bumping for flip chip applications A method for forming a stud bumped semiconductor die is disclosed. The method includes forming a ball at the tip of a coated wire passing through a hole in a capillary, where the coated wire has a core and an oxidation-resistant coating. The formed ball is pressed t... | 04/26/2011 |
| 7910472 | Method of manufacturing semiconductor device A semiconductor device with improved bondability between a wire and a bump and cutting property of the wire to improve the bonding quality. In the semiconductor device, a wire is stacked on a pad as a second bonding point to form a bump having a sloped wedge and a f... | 03/22/2011 |
| 7851347 | Wire bonding method and semiconductor device Wire bonding method for reducing height of a wire loop in a semiconductor device, including a first bonding step of bonding an initial ball formed at a tip end of a wire onto a first bonding point using a capillary, thereby forming a pressure-bonded ball; a wire pus... | 12/14/2010 |
| 7807561 | Method for forming side wirings After plural semiconductor elements are stacked to form a stacked body P, side wirings are formed on the side surface of the stacked body P, thereby manufacturing a semiconductor apparatus in which the respective semiconductor elements are electrically connected to ... | 10/05/2010 |
| 7772107 | Methods of forming a single layer substrate for high capacity memory cards Methods of forming a semiconductor package including a single-sided substrate are disclosed. In a first embodiment of the present invention, a substrate may include a conductive layer on a top surface of the substrate, i.e., on the same side of the substrate as wher... | 08/10/2010 |
| 7749889 | Manufacturing method of semiconductor device The present invention relates to a manufacturing method of a semiconductor device having a size approximately same as the size of a semiconductor chip when viewed in a plan view, in which the semiconductor chip is flip-chip bonded to a wiring pattern, and an object ... | 07/06/2010 |
| 7745322 | Wire bond interconnection A wire bond interconnection between a die pad and a bond finger includes a support pedestal at a bond site of the lead finger, a ball bond on the die pad, and a stitch bond on the support pedestal, in which a width of the lead finger at the bond site is less than a ... | 06/29/2010 |
| 7741208 | Method for making a wedge wedge wire loop A wedge wedge wire loop is formed with the steps: a) lowering the capillary onto the first connection point and applying a predefined bond force and ultrasound for producing a wedge connection on the first connection point, b) raising the c... | 06/22/2010 |
| 7682962 | Method for fabricating stacked semiconductor components with through wire interconnects A method for fabricating a semiconductor component with a through wire interconnect includes the step of providing a substrate having a circuit side, a back side, and a through via. The method also includes the steps of: threading a wire through the via, forming a c... | 03/23/2010 |
| 7601628 | Wire and solder bond forming methods Methods of forming wire and solder bonds are disclosed. In one embodiment, a method includes providing a structure including a wire bond metal region for the wire bond and a solder bond metal region for the solder bond, both regions covered by a silicon nitride laye... | 10/13/2009 |
| 7582553 | Method of bonding flying leads The method of bonding flying leads is capable of efficiently supersonic-bonding the flying leads to pads of a board and improving bonding reliability therebetween. The method comprises the steps of: mechanically processing the board so as to form projections, which ... | 09/01/2009 |
| 7579267 | Methods and systems for fabricating semiconductor components with through wire interconnects (TWI) A semiconductor component includes a semiconductor substrate having a substrate contact, and a through wire interconnect (TWI) bonded to the substrate contact. The through wire interconnect (TWI) includes a via through the substrate contact and the substrate, a wire... | 08/25/2009 |
| 7579268 | Method of manufacturing an integrated circuit A method of manufacturing an integrated circuit including a first isolated chip electrically and mechanically connected via wafer bonding to a second isolated chip, wherein the active faces of the chips face one another, includes: forming metallic contact zones on a... | 08/25/2009 |
| 7572726 | Method of forming a bond pad on an I/C chip and resulting structure A method of forming wire bonds in (I/C) chips comprising: providing an I/C chip having a conductive pad for a wire bond with at least one layer of dielectric material overlying the pad; forming an opening through the dielectric material exposing a portion of said pa... | 08/11/2009 |
| 7547626 | Semiconductor package and method of forming wire loop of semiconductor package Provided are a semiconductor package and a method of forming a wire loop of the semiconductor package. The semiconductor package includes: at least one semiconductor chip; a lead frame including a plurality of leads; and a plurality of wire loops, the wire loops con... | 06/16/2009 |
| 7517790 | Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification A method is disclosed of repairing wire bond damage on semiconductor chips such as high speed semiconductor microprocessors, application specific integrated circuits (ASICs), and other high speed integrated circuit devices, particularly devices using low-K dielectri... | 04/14/2009 |
| 7485565 | Nickel bonding cap over copper metalized bondpads A method for forming a nickel cap layer over copper metalized bond pad is disclosed in which the phosphorous content of the nickel cap, and particularly the surface of the nickel cap, may be controlled. The phosphorous content of the surface of the nickel cap is sui... | 02/03/2009 |
| 7482260 | System and method for increasing the strength of a bond made by a small diameter wire in ball bonding A system and method is disclosed for increasing the strength of a bond made by a small diameter wire in ball bonding. In one embodiment of the invention a structure for receiving a ball bond comprises substrate material that has portions that form a substrate cavity... | 01/27/2009 |
| 7476608 | Electrically connecting substrate with electrical device A substrate is electrically connected with an electrical device mounted on the substrate. A ball bond is formed between a first end of a wire and a bonding pad of the substrate. A reverse-motion loop is formed within the wire. A bond is formed between a second end o... | 01/13/2009 |
| 7465655 | Integrated circuit with substantially perpendicular wire bonds A method for performing a wire-bonding operation in an integrated circuit utilizes a bonding tool. A wire is bonded to a first bond site in the integrated circuit, and terminated at a second bond site in the integrated circuit. The bonding and terminating steps are ... | 12/16/2008 |
| 7462557 | Semiconductor component and method for contracting said semiconductor component The semiconductor component has several regularly arranged active cells (1), each comprising at least one main defining line (8). A bonding wire (18, 20) is fixed to at least one bonding surface (14, 16) by bonding with a bonding tool, os... | 12/09/2008 |
| 7456091 | Semiconductor device and method of manufacturing the same A semiconductor device of the present invention includes a chip which has a pad; a bump electrode formed on the pad; and a wire whose stitch bonding is made on the bump electrode. The wire satisfies a condition: (modulus-of-elasticity/breaking strength per unit area... | 11/25/2008 |
| 7429787 | Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides Semiconductor assemblies include a first package, each having at least one die affixed to, and electrically interconnected with, a die attach side of the first package substrate, and a second substrate having a first side and a second (“land”) side, mounted over... | 09/30/2008 |
| 7427558 | Method of forming solder ball, and fabricating method and structure of semiconductor package using the same A method of forming solder balls may involve forming bumps through wire boding on land patterns of a circuit substrate. Solder cream may be applied to the bumps through screen printing. The solder cream may be melted via reflow to form solder balls in which the bump... | 09/23/2008 |
