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| Number | Title | Issue Date |
| 8012866 | Method of bonding semiconductor devices utilizing solder balls A method for bonding a semiconductor device onto a substrate is provided which comprises the steps of picking up a solder ball with a pick head, placing the solder ball onto the substrate and melting the solder ball on the substrate and placing the semiconductor dev... | 09/06/2011 |
| 7955966 | Injection molded solder ball method Methods for making solder balls, which can be used to bump semiconductor wafers are disclosed. Methods for bumping semiconductor wafers with the solder balls are also disclosed. The solder balls can be made using an injection molded soldering (IMS) process. ... | 06/07/2011 |
| 7842599 | Bumping electronic components using transfer substrates A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic compo... | 11/30/2010 |
| 7666780 | Alignment verification for C4NP solder transfer A method is provided for the making of interconnect solder bumps on a wafer or other electronic device. The method is particularly useful for the well-known C4NP interconnect technology and determines if any off-set resulted between the solder mold array and the waf... | 02/23/2010 |
| 7569474 | Method and apparatus for soldering modules to substrates A method and apparatus for attaching a module such as a semiconductor device, having an array of contacts arranged thereon in a given pattern to a substrate such as a printed circuit board comprises applying an array of solder blocks to the array of contacts on the ... | 08/04/2009 |
| 7414313 | Polymeric conductor donor and transfer method The present invention relates to a donor laminate for transfer of a conductive layer comprising at least one electronically conductive polymer on to a receiver, wherein the receiver is a component of a device. The present invention also relates to methods pertinent ... | 08/19/2008 |
| 7375429 | Integrated circuit component and mounting method thereof Disclosed are an integrated circuit component capable of simply mounting at low cost a chip part which adjusts impedance of wiring patterns as well as capable of effectively reducing switching noise from an integrated circuit, and a method for mounting the chip part... | 05/20/2008 |
| 7368819 | Multilayer printed wiring board and multilayer printed circuit board In a multilayer printed wiring board having a plurality of laminated resin layers, a plurality of wiring patterns formed on the interfacial surface of the resin layers, and a plurality of lands formed on the outermost layer of the resin layers and on which the solde... | 05/06/2008 |
| 7368809 | Pillar grid array package A pillar grid array package (PGA) includes a substrate, a chip disposed on top of the substrate, and a plurality of stud bumps disposed on bottom of the substrate. The stud bumps are formed in an array and each has a flattened top to electrically connect to a printe... | 05/06/2008 |
| 7364949 | Semiconductor device package A semiconductor package that includes two circuit boards and at least one semiconductor device which is disposed between the two circuit boards and connected to external connectors disposed on at least one of the circuit boards. ... | 04/29/2008 |
| 7361994 | System to control signal line capacitance A system may include a conductive plane defining a non-conductive antipad area and a second non-conductive area extending from the antipad area in at least a first direction, a dielectric plane coupled to the conductive plane, a conductive via passing through the di... | 04/22/2008 |
| 7358114 | Semiconductor device substrate, semiconductor device, and manufacturing method thereof A method of manufacturing a semiconductor device substrate includes the steps of: arranging on a base a temporary fixing member for temporarily fixing an electronic component; temporarily fixing the electronic component on the base by the temporary fixing member; fo... | 04/15/2008 |
| 7354797 | Method for producing a plurality of electronic devices An electronic device has external contact elements projecting from at least one external contact side of a plastic housing. The external contact elements have an internal section and an external section. The external section has an external contact region tapering a... | 04/08/2008 |
| 7352071 | Method of fabricating anti-warp package An anti-warp package comprising a packaging substrate, a chip and a stiffening member is provided. The chip is disposed on a top surface of the packaging substrate. The stiffening member is disposed on a bottom surface of the packaging substrate in a location undern... | 04/01/2008 |
| 7338889 | Method of improving copper interconnects of semiconductor devices for bonding An improved wire bond is provided with the bond pads of semiconductor devices and the lead fingers of lead frames or an improved conductive lead of a TAB tape bond with the bond pad of a semiconductor device. More specifically, an improved wire bond is described whe... | 03/04/2008 |
| 7331500 | Solder bumps formation using solder paste with shape retaining attribute Method of forming solder bumps of an integrated circuit package is described. A solder paste is formed from a material having a characteristic that the deposited instances thereof substantially retain their geometric shape upon exposure to electromagnetic radiation.... | 02/19/2008 |
| 7332424 | Fluxless solder transfer and reflow process Disclosed is a new process that permits the transfer and reflow of solder features produced by Injection Molded Solder (IMS) from a mold plate to a solder receiving substrate without the use of flux. Several embodiments produce solder transfer and reflow separately ... | 02/19/2008 |
| 7326639 | Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device with electroless plating A method is provided including, after joining a wiring substrate and an element substrate, separating a second substrate of the element substrate from a semiconductor element, and electrically coupling an element-side terminal that has been exposed by the separation... | 02/05/2008 |
| 7293354 | Apparatus for mounting columns for grid array electronic packages A vacuum controlled fixture is provided for positioning columns on sites of an electronic substrate. The fixture includes an internal chamber having spaced apart first and second surfaces extending beneath its principal face. A regular array of column receiving hole... | 11/13/2007 |
| 7294587 | Component built-in module and method for producing the same A component built-in module includes an insulating layer, wirings integrated with both surfaces of the insulating layer, a via connecting the wirings, and one or more components selected from an electronic component and a semiconductor, which is embedded inside of t... | 11/13/2007 |
| 7285486 | Ball transferring method and apparatus Balls are sucked onto a carrier board so as to be temporarily arranged in a ball arrangement region of the board, and then the balls are transferred and bonded onto an objective substance with their positions being adjusted. Gas blow is applied to the temporarily ar... | 10/23/2007 |
| 7279917 | Stacked tip cantilever electrical connector A probe for a probe card assembly is provided. The probe includes a beam element having a tip end portion. The probe also includes a tip structure on the tip end portion of the beam element. The tip structure includes a plurality of conductive bumps arranged in a st... | 10/09/2007 |
| 7279360 | Semiconductor device and method of packaging the same Embodiments of the invention provide a semiconductor-chip mounting body, a semiconductor device including the mounting body, and a method of packaging the semiconductor device. According to some embodiments, when a semiconductor chip is mounted on the mounting body ... | 10/09/2007 |
| 7278564 | Method of mounting electronic component, structure for mounting electronic component, electronic component module, and electronic apparatus The invention provides a method of mounting an electronic component where an electronic component can be reliably electrically-connected to a substrate. A substrate defines a through-hole that extends through the substrate, from connection electrodes formed on the l... | 10/09/2007 |
| 7256069 | Wafer-level package and methods of fabricating A carrier for use in a chip-scale package, including a polymeric film with apertures defined therethrough. The apertures, which are alignable with corresponding bond pads of a semiconductor device, each include a quantity of conductive material extending substantial... | 08/14/2007 |
| 7252891 | Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same A wiring transfer sheet including a carrier base and a wiring layer formed thereon is produced so that an exposed area of a surface of the carrier base on which the wiring layer is formed has a plurality of concavities. By transferring the wiring layer to an electri... | 08/07/2007 |
| 7250101 | Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In so... | 07/31/2007 |
| 7241675 | Attachment of integrated circuit structures and other substrates to substrates with vias Vias (210, 210B) are formed in a surface of a substrate. At least portions of contact pads (139, 350) are located in the vias. Contact pads (150, 340) of an integrated circuit structure are inserted into the vias and attached to the contact pads... | 07/10/2007 |
| 7237606 | Wafer supporter A wafer supporting unit (10) includes a base (12) and a thermally conductive member (14). The base is formed by nickel material. The thermally conductive member is formed in the shape of a lamina, includes silicone rubber (16) serving as ... | 07/03/2007 |
| 7223633 | Method for solder crack deflection An apparatus that includes a first component defining an interior of the apparatus; a first solder composition exterior to the first component; a second solder composition exterior to the first solder composition and the first component; and a second component exter... | 05/29/2007 |
| 7222420 | Method for making a front and back conductive substrate A front-and-back electrically conductive substrate includes a plurality of posts composed of a material that can be anisotropically etched and having an electrically conductive portion that has at least a first surface and a second surface that communicate with each... | 05/29/2007 |
| 7222412 | System for locating conductive sphere utilizing screen and hopper of solder balls System for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop throug... | 05/29/2007 |
| 7223921 | Composite comprised of flat conductor elements A composite of at least two flat elements that includes a first support substrate having a first solder pad, and a second support substrate having a second solder pad that is soldered together with the first solder pad. Strip conductor structures are applied to the ... | 05/29/2007 |
| 7221053 | Integrated device and electronic system The present invention relates to an integrated device comprising an electronic circuit chip, a solder contact structure to provide contact to the electronic circuit chip and an elastic contact structure to provide contact to the electronic circuit chip, wherein the ... | 05/22/2007 |
| 7215022 | Multi-die module A multi-die module is electrically connected to both an unpackaged die and a packaged die as disclosed herein. The multi-die module has a footprint that is the same as conventional multi-die packages, which do not include packaged die, thereby allowing the multi-die... | 05/08/2007 |
| 7200927 | Method for producing a wiring transfer sheet A wiring transfer sheet including a carrier base and a wiring layer formed thereon is produced so that an exposed area of a surface of the carrier base on which the wiring layer is formed has a plurality of concavities. By transferring the wiring layer to an electri... | 04/10/2007 |
| 7199037 | Microfeature devices and methods for manufacturing microfeature devices Microfeature devices, microfeature workpieces, and methods for manufacturing microfeature devices and microfeature workpieces are disclosed herein. The microfeature workpieces have an integrated circuit, a surface, and a plurality of interconnect elements projecting... | 04/03/2007 |
| 7183494 | Bonding structure with buffer layer and method of forming the same A bonding structure with a buffer layer, and a method of forming the same are provided. The bonding structure comprises a first substrate with metal pads thereon, a protection layer covered on the surface of the substrate, a first adhesive metal layer formed on the ... | 02/27/2007 |
| 7166507 | Semiconductor device and method for forming same using multi-layered hard mask According to some embodiments of the invention, bit lines are formed using a multi-layered hard mask and BC nodes are separated by forming line-type BCs in the same direction of gate lines. Thus, a narrowing of shoulders between the bit lines and the BCs can be prev... | 01/23/2007 |
| 7161370 | Semiconductor testing device A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the sp... | 01/09/2007 |
