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| Number | Title | Issue Date |
| 8148258 | Method for fabricating electrical bonding pads on a wafer A method for fabricating electrical bonding pads on the electrical contact areas of a wafer includes producing first blocks made of a solder material, producing second blocks made of a solder material on these first blocks, and passing the blocks through an oven so ... | 04/03/2012 |
| 8088684 | Apparatus and method for semiconductor wafer bumping via injection molded solder An improved apparatus and a method for semiconductor wafer bumping, that utilizes the injection molded solder process. The apparatus is designed for high volume manufacturing and includes equipment for filling patterned mold cavities formed on a first surface of a m... | 01/03/2012 |
| 8071472 | Semiconductor device with solder balls having high reliability A semiconductor device includes a substrate, a metal layer, an alloy layer and a Sn—Ag—Cu-based solder ball. The metal layer is configured to be formed on the substrate. The alloy layer is configured to be formed on the metal layer. The Sn—Ag—Cu-based solder... | 12/06/2011 |
| 8012865 | High temperature, stable SiC device interconnects and packages having low thermal resistance A method of forming packages containing SiC or other semiconductor devices bonded to other components or conductive surfaces utilizing transient liquid phase (TLP) bonding to create high temperature melting point bonds using in situ formed ternary or quaternary mixt... | 09/06/2011 |
| 7829453 | Method for forming solder balls with a stable oxide layer by controlling the reflow ambient By controlling the cooling rate during the oxidation process for forming an oxide layer on solder balls and by selecting an elevated temperature as an initial temperature of the oxidation process, a reliable yet easily removable oxide layer may be obtained. Conseque... | 11/09/2010 |
| 7732320 | Apparatus and method for semiconductor wafer bumping via injection molded solder An improved apparatus for semiconductor wafer bumping utilizes the injection molded solder process and is designed for high volume manufacturing. The apparatus includes equipment for filling patterned mold cavities on a mold structure with solder, equipment for posi... | 06/08/2010 |
| 7700476 | Solder joint reliability in microelectronic packaging A microelectronic assembly and method for fabricating the same are described. In an example, a microelectronic assembly includes a microelectronic device having a surface with one or more areas to receive one or more solder balls, the one or more areas having a surf... | 04/20/2010 |
| 7682961 | Methods of forming solder connections and structure thereof In a first aspect, a method comprises depositing a first metal containing layer into a trench structure, which contacts a metalized area of a semiconductor structure. The method further includes patterning at least one opening in a resist to the first metal containi... | 03/23/2010 |
| 7678681 | Electronic component built-in substrate and method of manufacturing the same In an electronic component built-in substrate of the present invention, an electronic component is mounted on a mounted body having a first wiring layer, the electronic component is embedded in an insulating layer, a conductive ball is arranged to pass through the i... | 03/16/2010 |
| 7655553 | Microstructure sealing tool and methods of using the same A method of packing electronic devices and an apparatus thereof are disclosed herein. The method allows for usage of solder materials with a melting temperature of 180° C. or higher, such as from 210° C. to 300° C., and from 230° C. to 260° C., so as to provide... | 02/02/2010 |
| 7651938 | Void reduction in indium thermal interface material Thermal interface materials and method of using the same in packaging are provided. In one aspect, a thermal interface material is provided that includes an indium preform that has a first surface and a second surface opposite to the first surface, an interior porti... | 01/26/2010 |
| 7575994 | Semiconductor device and manufacturing method of the same The invention provides a CSP type semiconductor device with high reliability. The semiconductor device includes a pad electrode formed on a semiconductor substrate, a first passivation film covering an end portion of the pad electrode and having a first opening on t... | 08/18/2009 |
| 7569473 | Methods of forming semiconductor assemblies Apparatus and methods are disclosed relating to semiconductor assemblies. A semiconductor assembly includes an interposer which may be constructed from a flexible material, such as a polyimide tape. A pattern of conductive traces disposed on a first surface of the i... | 08/04/2009 |
| 7560374 | Mold for forming conductive bump, method of fabricating the mold, and method of forming bump on wafer using the mold A mold for forming a conductive bump, a method of fabricating the mold, and a method of forming a bump on a wafer using the mold are provided. The bump can be formed by employing various materials, the mold can be repeatedly used several times because the mold is no... | 07/14/2009 |
| 7514351 | Solder ball mounting method and solder ball mounting substrate manufacturing method A solder resist having first opening portions on positions corresponding to electrodes and a second opening portion on a mask providing position is formed on the substrate. A flux mask whose thickness is substantially same as the solder resist is arranged in the sec... | 04/07/2009 |
| 7452800 | Bonding a non-metal body to a metal surface using inductive heating A bonding technique suitable for bonding a non-metal body, such as a silicon MEMS sensor, to a metal surface, such a steel mechanical component is rapid enough to be compatible with typical manufacturing processes, and avoids any detrimental change in material prope... | 11/18/2008 |
| 7416969 | Void free solder arrangement for screen printing semiconductor wafers A process for the production of a void-free semiconductor wafer for the electronics industry, comprising the steps of: applying a coating of a solder paste to a semiconductor wafer through a photoresist film; heating and applying a vacuum to the wafer in a reflow fu... | 08/26/2008 |
| 7390735 | High temperature, stable SiC device interconnects and packages having low thermal resistance A method of forming packages containing SiC or other semiconductor devices bonded to other components or conductive surfaces utilizing transient liquid phase (TLP) bonding to create high temperature melting point bonds using in situ formed ternary or quaternary mixt... | 06/24/2008 |
| 7375429 | Integrated circuit component and mounting method thereof Disclosed are an integrated circuit component capable of simply mounting at low cost a chip part which adjusts impedance of wiring patterns as well as capable of effectively reducing switching noise from an integrated circuit, and a method for mounting the chip part... | 05/20/2008 |
| 7344971 | Manufacturing method of semiconductor device A manufacturing method of a semiconductor device comprises: (a) setting up a paste including a resin on an electrical connection part which is electrically connected to a semiconductor substrate; (b) setting up a soldering material above the electrical connection pa... | 03/18/2008 |
| 7338889 | Method of improving copper interconnects of semiconductor devices for bonding An improved wire bond is provided with the bond pads of semiconductor devices and the lead fingers of lead frames or an improved conductive lead of a TAB tape bond with the bond pad of a semiconductor device. More specifically, an improved wire bond is described whe... | 03/04/2008 |
| 7332423 | Soldering a die to a substrate One example electronic assembly includes a substrate that has a plurality of contacts which become bonded to a plurality of contacts on a die. The electronic assembly further includes a male member that extends from at least one of the substrate and the die and a fe... | 02/19/2008 |
| 7330037 | Electrical characteristic measuring probe and method of manufacturing the same In an electrical characteristic measuring probe of the present invention constructed by assembling a plurality of probe parts, each comprising a base portion, a plurality of terminal portions extended outward from one end of the base portion, wiring patterns extende... | 02/12/2008 |
| 7325716 | Dense intermetallic compound layer Apparatus and methods of fabricating a bump limiting metallization structure including a two-step bump reflow process that reduces intermetallic compound porosity, increases bump strength, improve die yield, and device reliability. The first step comprises annealing... | 02/05/2008 |
| 7321140 | Magnetron sputtered metallization of a nickel silicon alloy, especially useful as solder bump barrier A nickel silicon alloy barrier layer formed between a metal bonding pad on an integrated circuit and a tin-based solder ball, for example, a lead-free solder. The nickel silicon alloy contains at least 2 wt % silicon and preferably less than 20 wt %. An adhesion lay... | 01/22/2008 |
| 7303941 | Methods and apparatus for providing a power signal to an area array package An area array device has a grid array of primary electrical contacts coupled to a coupling surface of the device and configured to carry data signals between the area array package and a circuit board. The area array device also has an additional series of secondary... | 12/04/2007 |
| 7301977 | Tuneable unipolar lasers A unipolar semiconductor laser is provided in which an active region is sandwiched in a guiding structure between an upper and lower cladding layer, the lower cladding layer being situated on a semiconducting substrate. The unipolar semiconductor laser comprises a r... | 11/27/2007 |
| 7291549 | Method and structure to reduce risk of gold embrittlement in solder joints A method for reducing gold embrittlement in solder joints, and a copper-bearing solder according to the method, are disclosed. Embodiments of the invention comprise adding copper to non-copper based solder, such as tin-lead solder. The embodiments may further compri... | 11/06/2007 |
| 7288472 | Method and system for performing die attach using a flame Embodiments of a method for attaching a die to a substrate using a flame or other heat source are disclosed. The flame may be produced by combustible gas. Also disclosed are embodiments of a system for performing die attach using a flame. Other embodiments are descr... | 10/30/2007 |
| 7285486 | Ball transferring method and apparatus Balls are sucked onto a carrier board so as to be temporarily arranged in a ball arrangement region of the board, and then the balls are transferred and bonded onto an objective substance with their positions being adjusted. Gas blow is applied to the temporarily ar... | 10/23/2007 |
| 7282432 | Semiconductor device, manufacturing method and apparatus for the same A highly reliable semiconductor chip electrode structure allowing control of interface reaction of bonding sections even in the case of using two- or three-element solder used conventionally is disclosed. A solder alloy making layer for preventing dissolving and dif... | 10/16/2007 |
| 7279720 | Large bumps for optical flip chips The invention provides bumps between a die and a substrate with a height greater than or equal to a height of a waveguide between the die and the substrate. The bumps may be formed on a die prior to that die being singulated from a wafer. ... | 10/09/2007 |
| 7276790 | Methods of forming a multi-chip module having discrete spacers An assembly method that includes providing a first semiconductor device and positioning a second semiconductor device at least partially over the first semiconductor device is disclosed. Spacers space the active surface of the first semiconductor device substantiall... | 10/02/2007 |
| 7273806 | Forming of high aspect ratio conductive structure using injection molded solder Methods of forming a conductive structure on a substrate prior to packaging, and a test probe structure generated according to the method, are disclosed. The conductive structure includes a high aspect ratio structure formed by injected molded solder. The invention ... | 09/25/2007 |
| 7265046 | Method of making a solder ball A solder ball 50 according to the present invention includes a spherical core 2 and a solder layer 4, which includes Sn and Ag and which is provided so as to wrap the core 2 up. The amount of water contained in the solder layer 4 i... | 09/04/2007 |
| 7256069 | Wafer-level package and methods of fabricating A carrier for use in a chip-scale package, including a polymeric film with apertures defined therethrough. The apertures, which are alignable with corresponding bond pads of a semiconductor device, each include a quantity of conductive material extending substantial... | 08/14/2007 |
| 7256117 | Method for evaluating and modifying solder attach design for integrated circuit packaging assembly A method of reducing a likelihood that a die pad will be delaminated from a die in an integrated circuit die package for a structure design during an attachment of a heat sink member to the die pad using solder, is provided. A sample structure of the structure desig... | 08/14/2007 |
| 7250330 | Method of making an electronic package A method of making an electronic package is described, wherein a substrate is provided with a pattern of conductive pads and a portion of solder positioned on selected ones of the pattern of copper pads. The solder is then reflowed to form partial hemispherically sh... | 07/31/2007 |
| 7241675 | Attachment of integrated circuit structures and other substrates to substrates with vias Vias (210, 210B) are formed in a surface of a substrate. At least portions of contact pads (139, 350) are located in the vias. Contact pads (150, 340) of an integrated circuit structure are inserted into the vias and attached to the contact pads... | 07/10/2007 |
| 7242209 | System and method for testing integrated circuits A module (236, 236′) containing an integrated testing system (108) that includes one or more measurement engines (200, 202) tightly coupled with a compute engine (208). The one or more measurement engines include at least one stimulus i... | 07/10/2007 |
