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| Number | Title | Issue Date |
| 8183144 | Method of manufacturing semiconductor device A method of manufacturing a semiconductor device having a back surface electrode, including: a step of preparing a semiconductor wafer having a front surface and a back surface; a thermal processing step of forming a first metal layer on the back surface of the semi... | 05/22/2012 |
| 8168527 | Semiconductor chip and method for fabricating the same A semiconductor chip includes a silicon substrate, a first dielectric layer over said silicon substrate, a metallization structure over said first dielectric layer, wherein said metallization structure comprises a first metal layer and a second metal layer over said... | 05/01/2012 |
| 8158508 | Structure and manufacturing method of a chip scale package A new method and package is provided for the mounting of semiconductor devices that have been provided with small-pitch Input/Output interconnect bumps. Fine pitch solder bumps, consisting of pillar metal and a solder bump, are applied directly to the I/O pads of th... | 04/17/2012 |
| 8148256 | Copper bonding method A copper bonding compatible bond pad structure and associated method is disclosed. The device bond pad structure includes a buffering structure formed of regions of interconnect metal and regions of non-conductive passivation material, the buffering structure provid... | 04/03/2012 |
| 8148257 | Semiconductor structure and method for making same One or more embodiments relate to a method of forming an electronic device, comprising: providing a workpiece; forming a first barrier layer over the workpiece; forming an intermediate conductive layer over the first barrier layer; forming a second barrier layer ove... | 04/03/2012 |
| 8138079 | Method of wire bonding over active area of a semiconductor circuit A method and structure are provided to enable wire bond connections over active and/or passive devices and/or low-k dielectrics, formed on an Integrated Circuit die. A semiconductor substrate having active and/or passive devices is provided, with interconnect metall... | 03/20/2012 |
| 8124520 | Integrated circuit mount system with solder mask pad An integrated circuit mount system includes an integrated circuit, a solder mask for the integrated circuit, and a solder mask pad on the substrate with the solder mask. ... | 02/28/2012 |
| 8097533 | Method of manufacturing semiconductor device A method of manufacturing a semiconductor device having a back surface electrode, including: a step of preparing a semiconductor wafer having a front surface and a back surface; a thermal processing step of forming a first metal layer on the back surface of the semi... | 01/17/2012 |
| 8093148 | Method for manufacturing semiconductor device having electrode for external connection A method for manufacturing semiconductor device which includes forming a first metal film over an electrode pad disposed on a substrate, forming a second metal film on the first metal film, forming a first oxide film on a surface of the first metal film and a second... | 01/10/2012 |
| 8071471 | Packaging conductive structure and method for manufacturing the same A packaging conductive structure for a semiconductor substrate and a method for manufacturing the structure are provided. The structure comprises an under bump metal (UBM) that overlays a pad of the semiconductor substrate. At least one auxiliary component is dispos... | 12/06/2011 |
| 8071470 | Wafer level package using stud bump coated with solder A method of fabricated a wafer level package is described. In one embodiment, the method includes fabricating at least one active device on a semiconductor wafer that has not been singulated, with the active device having a plurality of bonding pads exposed at an up... | 12/06/2011 |
| 8030201 | Semiconductor device and method of manufacturing the same A first electronic circuit component and a second electronic circuit component are electrically connected to an electro-conductive member via a first solder and a second solder, respectively. The electro-conductive member is formed in a resin film. The electro-condu... | 10/04/2011 |
| 7968446 | Metallic bump structure without under bump metallurgy and manufacturing method thereof The metallic bump is directly formed on a semiconductor wafer's I/O pad without UBM. First, a zinc layer is formed on the I/O pad or an anti-oxidation layer of the I/O pad is selectively etched off. Then, an isolative layer and a copper foil are arranged sequentiall... | 06/28/2011 |
| 7960273 | Metal interconnection of a semiconductor device and method of manufacturing the same A method of manufacturing a metal interconnection of a semiconductor device includes forming a base layer with at least one groove, the at least one groove having an open upper portion, forming a first metal layer in the at least one groove, forming a seed metal lay... | 06/14/2011 |
| 7947593 | Method of manufacturing a semiconductor device having an intermetallic terminal pad and solder junction structure A method for manufacturing a semiconductor device includes providing a Zn system material directly on a copper terminal pad formed over an underlying base; disposing a Pb-free solder ball over the Zn system material; and performing a heating process for reflowing th... | 05/24/2011 |
| 7947592 | Thick metal interconnect with metal pad caps at selective sites and process for making the same The present invention relates to a high power IC (Integrated Circuit) semiconductor device and process for making same. More particularly, the invention encompasses a high conductivity or low resistance metal stack to reduce the device R-on which is stable at high t... | 05/24/2011 |
| 7906425 | Fluxless bumping process A process including providing a semiconductor device including a bond pad, and an under bump metallurgy overlying the bond pad. Forming a solder structure over the under bump metallurgy, and wherein the solder structure includes an outer layer including tin oxide. P... | 03/15/2011 |
| 7902060 | Attachment using magnetic particle based solder composites Electronic devices and methods for fabricating electronic devices are described. One method includes providing a first body with a plurality of composite bumps thereon, the composite bumps comprising a solder and magnetic particles. The method also includes applying... | 03/08/2011 |
| 7897502 | Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers A method of making a semiconductor device comprises forming a first conductive layer recessed below a surface of a substrate. The method further comprises forming a second conductive layer raised above the surface of the substrate to create a vertical offset between... | 03/01/2011 |
| 7884009 | Semiconductor device with an improved solder joint A semiconductor device with an improved solder joint system is described. The solder system includes two copper contact pads connected by a body of solder and the solder is an alloy including tin, silver, and at least one metal from the transition groups IIIA, IVA, ... | 02/08/2011 |
| 7884008 | Semiconductor device fabrication method A method of forming a semiconductor device including a semiconductor substrate with circuit elements and electrode pads formed on one surface. This surface is covered by a dielectric layer with openings above the electrode pads. A metal layer is deposited on the die... | 02/08/2011 |
| 7879715 | Methods of forming electronic structures including conductive shunt layers and related structures Methods of forming an electronic structure may include forming a seed layer on an electronic substrate, and forming a conductive shunt layer on portions of the seed layer wherein portions of the seed layer are free of the conductive shunt layer. A conductive barrier... | 02/01/2011 |
| 7871920 | Semiconductor chips with reduced stress from underfill at edge of chip Structures and methods for forming the same. A semiconductor chip includes a semiconductor substrate and a transistor on the semiconductor substrate. The chip further includes N interconnect layers on top of the semiconductor substrate and being electrically coupled... | 01/18/2011 |
| 7871919 | Structures and methods for improving solder bump connections in semiconductor devices Structures with improved solder bump connections and methods of fabricating such structures are provided herein. The method includes forming a plurality of trenches in a dielectric layer extending to an underlying metal layer. The method further includes depositing ... | 01/18/2011 |
| 7846830 | Semiconductor device and method for manufacturing same The objects of the present invention is to improve the impact resistance of the semiconductor device against the impact from the top surface direction, to improve the corrosion resistance of the surface of the top layer interconnect, to inhibit the crack occurred in... | 12/07/2010 |
| 7816252 | Method for forming bumps on under bump metallurgy A method for forming a bump on under bump metallurgy according to the present invention is provided. A bonding pad is first formed on the active surface of a wafer. Subsequently, a passivation layer is formed on the active surface of the wafer and exposes the bondin... | 10/19/2010 |
| 7811922 | Method for manufacturing semiconductor device A method for manufacturing a semiconductor device includes: preparing a wiring board having a base substrate and wiring that is plated on surface with a plating metal; pressing a bump that is formed on the active side of the semiconductor chip against an end part of... | 10/12/2010 |
| 7795129 | Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment A semiconductor device is provided with a plurality of protrusions which are made of a resin and which protrude higher than electrodes, and conductive layers which are electrically connected to the electrodes and which cover the top surfaces of the protrusions. A me... | 09/14/2010 |
| 7795128 | Method of manufacturing a semiconductor device having an enhanced electrode pad structure There are included a semiconductor substrate provided with a desirable element region, an electrode pad formed to come in contact with a surface of the semiconductor substrate or a wiring layer provided on the surface of the semiconductor substrate, a bump formed on... | 09/14/2010 |
| 7795130 | Active area bonding compatible high current structures A method of forming a semiconductor structure is provided. One method comprises forming a device region between a substrate and a bond pad. Patterning a conductor between the bond pad and the device region with gaps. Filling the gaps with insulation material that is... | 09/14/2010 |
| 7772106 | Method of forming an inductor on a semiconductor wafer A semiconductor device has a substrate with an inductor formed on its surface. First and second contact pads are formed on the substrate. A passivation layer is formed over the substrate and first and second contact pads. An insulating layer is formed over the passi... | 08/10/2010 |
| 7767575 | Forming robust solder interconnect structures by reducing effects of seed layer underetching A method for forming an interconnect structure for a semiconductor device includes defining a via in a passivation layer so as expose a top metal layer in the semiconductor device. A seed layer is formed over the passivation layer, sidewalls of the via, and the top ... | 08/03/2010 |
| 7763536 | Method of manufacturing a semiconductor device A method of manufacturing a semiconductor device includes preparing a semiconductor substrate having an electrode pad, a passivation film having an opening overlapping the electrode pad and an oxidized film formed in the opening, forming a resin projection on the pa... | 07/27/2010 |
| 7759240 | Use of palladium in IC manufacturing with conductive polymer bump An apparatus and a method for forming a substrate having a palladium metal layer over at least one contact point of the substrate and having a flexible conductive polymer bump, preferably a two-stage epoxy, on the palladium plated contact point, are provided. The pr... | 07/20/2010 |
| 7741207 | Semiconductor device with multilayered metal pattern A semiconductor device comprises a first insulating film formed on a semiconductor substrate, a first metal pattern formed on the first insulating film, a second insulating film formed on the first metal pattern, a second metal pattern formed on the second insulatin... | 06/22/2010 |
| 7727876 | Semiconductor device and method of protecting passivation layer in a solder bump process A flip chip semiconductor device has a substrate with a plurality of active devices formed thereon. A contact pad is formed on the substrate in electrical contact with the plurality of active devices. A passivation layer is formed over the substrate and intermediate... | 06/01/2010 |
| 7727877 | Method of manufacturing a wafer level package that uses the same seed layer for selectively electroplating a rewiring pattern and a conductive pillar A method of manufacturing a wafer level package is disclosed, which may include: coating an insulation layer over one side of a semiconductor chip, on one side of which an electrode pad is formed, such that the electrode pad is open; forming a seed layer by depositi... | 06/01/2010 |
| RE41355 | Method for placing active circuits beneath active bonding pads The present invention provides a bonding pad structure for integrated circuit devices which allows the active circuits to be placed under bonding pads of the device without affecting the performance of the active circuits. The bonding pad structure is composed of at... | 05/25/2010 |
| 7713861 | Method of forming metallic bump and seal for semiconductor device The method mainly contains the following steps. First, an UBM is formed on a top side of a semiconductor's I/O pad. An isolative layer and a metallic foil are sequentially arranged in this order on the UBM. Then, a via is formed to expose the top surface of the UBM.... | 05/11/2010 |
| 7678680 | Semiconductor device with reduced contact resistance A semiconductor device that includes an electrode of one material and a conductive material of lower resistivity formed over the electrode and a process for fabricating the semiconductor device. ... | 03/16/2010 |
