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| Number | Title | Issue Date |
| 7226296 | Ball grid array contacts with spring action An electrical contact for a ball grid array connector is disclosed for providing improved solder ball connection with a substrate. The contacts may be compressed, enabling solder balls of the connector to abut with the substrate prior to reflow. During reflow, the c... | 06/05/2007 |
| 7222737 | Die sorter with reduced mean time to convert An adapter frame has channels that hold multiple die carriers in each channel. The die carriers, such as 2″×2″ or 4″×4″ waffle packs or GEL-PAK die carriers, slide into the channels and are secured by a spring clip retention mechanism. In other embodiments... | 05/29/2007 |
| 7223633 | Method for solder crack deflection An apparatus that includes a first component defining an interior of the apparatus; a first solder composition exterior to the first component; a second solder composition exterior to the first solder composition and the first component; and a second component exter... | 05/29/2007 |
| 7223681 | Interconnection pattern design An interconnection pattern design, which has an improved reliability under mechanical shock and thermal cycling loads. A semiconductor component comprises a plurality of interconnections aligned into rows and columns to form an interconnection pattern, wherein the i... | 05/29/2007 |
| 7223683 | Wafer level bumping process A bumping process mainly comprises the following steps. Initially, a wafer having a plurality of bonding pads and a passivation layer with passivation openings exposing the bonding pads is provided. Next, a first dielectric layer with first openings and second openi... | 05/29/2007 |
| 7223682 | Method of making a semiconductor device using bump material including a liquid A method of making a semiconductor device by forming bumps on pads of a test piece. The method includes a fastening process of pouring a bump material including a liquid and a plurality of individual pump materials toward a target face of a mask substrate, the mask ... | 05/29/2007 |
| 7224076 | Electronic component package An electronic component package and method of fabrication is provided. The electronic component package includes a ceramic substrate and a plurality of bonding pads formed on the substrate, each pad forming an interface with the ceramic. Formed on the bonding pads i... | 05/29/2007 |
| 7222412 | System for locating conductive sphere utilizing screen and hopper of solder balls System for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop throug... | 05/29/2007 |
| 7221053 | Integrated device and electronic system The present invention relates to an integrated device comprising an electronic circuit chip, a solder contact structure to provide contact to the electronic circuit chip and an elastic contact structure to provide contact to the electronic circuit chip, wherein the ... | 05/22/2007 |
| 7220657 | Semiconductor wafer and semiconductor device provided with columnar electrodes and methods of producing the wafer and device A semiconductor wafer provided with columnar electrodes which have plated nickel, palladium, and gold films successively formed at the top thereof, or have a plated solder film at their top. The semiconductor wafer can be preferably used for producing a chip-sized s... | 05/22/2007 |
| 7217645 | Method for manufacturing semiconductor device and electronic device and method for calculating connection condition Solder is connected to the electrodes of the circuit board by using a temperature profile with a constant fusion temperature, a connection interface strength evaluation test is carried out on the soldered joints to obtain an appropriate reflow range free of decrease... | 05/15/2007 |
| 7219242 | Direct plane access power delivery According to one embodiment of the present invention, a method for low impedance power delivery is disclosed. The method includes: providing a module, the module having a plurality of layers including a top layer; removing the top layer of the module to expose a pow... | 05/15/2007 |
| 7217888 | Electronic parts packaging structure and method of manufacturing the same There is provided a electronic parts packaging structure that includes a mounted body on which an electronic parts is mounted, the electronic parts having a connection pad, which has an etching stopper film (a copper film, a gold film, a silver film, or a conductive... | 05/15/2007 |
| 7218003 | Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods Methods for packaging microelectronic devices, microelectronic workpieces having packaged dies, and microelectronic devices. One aspect of the invention is directed toward a microelectronic workpiece comprising a substrate having a device side and a backside. In one... | 05/15/2007 |
| 7217646 | Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement The present invention provides a method for connecting an integrated circuit (C1), in particular a chip or a wafer or a hybrid, to a substrate (C2),... | 05/15/2007 |
| 7214104 | Ball grid array connector An electrical connector having a leadframe assembly and a connector housing is disclosed. The leadframe may include a lead frame and an electrical contact extending at least partially through the lead frame. The connector housing contains the leadframe assembly in e... | 05/08/2007 |
| 7213329 | Method of forming a solder ball on a board and the board In the method, a conductive pad of the board is etched to a depth that is greater than 50% and less than 100% of a thickness of the conductive pad. Subsequently, a solder ball may be formed on the etched conductive pad. For example, the conductive pad may be copper.... | 05/08/2007 |
| 7215026 | Semiconductor module and method of forming a semiconductor module In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the boar... | 05/08/2007 |
| 7214569 | Apparatus incorporating small-feature-size and large-feature-size components and method for making same An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The fi... | 05/08/2007 |
| 7216324 | Method for designing chip package by re-using existing mask designs A method is disclosed for completing a flip chip package design by re-using mask designs in a tool library. The method comprises analyzing one or more input/out bump locations of a chip, analyzing one or more solder ball locations of a package hosting the chip with ... | 05/08/2007 |
| 7214604 | Method of fabricating ultra thin flip-chip package Provided is a method of fabricating an ultra thin flip-chip package. In the above method, an under barrier metal film is formed on a bond pad of a semiconductor chip. Three-dimensional structured solder bumps are formed on the under barrier metal film, each of the s... | 05/08/2007 |
| 7211901 | Self-coplanarity bumping shape for flip chip A stud bump structure for electrical interconnection between a pair of members includes a base portion, and a stem portion. The base portion is affixed to a pad or trace in one of the pair of members to be interconnected (such as an integrated circuit chip), and the... | 05/01/2007 |
| 7211899 | Circuit substrate and method for fabricating the same A circuit substrate comprises a glass substrate 16, through-holes 18 formed through the glass substrate 16 and via electrodes 20 buried in the through-holes 18. An opening width of the through-holes 18 is minimum inside the ... | 05/01/2007 |
| 7211469 | Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same A semiconductor wafer includes a plurality of passive device units, which are electrically connected across scribe lines. Passive device chips in the wafer that are adjacent to one another in a first direction are electrically connected in parallel, while passive de... | 05/01/2007 |
| 7208834 | Bonding structure with pillar and cap A cylindrical bonding structure and its method of manufacture. The cylindrical bonding structure is formed over the bonding pad of a silicon chip and the chip is flipped over to connect with a substrate board in the process of forming a flip-chip package. The cylind... | 04/24/2007 |
| 7208843 | Routing design to minimize electromigration damage to solder bumps A novel pad structure for an integrated circuit component that utilizes a bump interconnect for connection to other integrated circuit components that produces a relatively uniform current distribution within the bump of the bump interconnect is presented. The pad s... | 04/24/2007 |
| 7207096 | Method of manufacturing high performance copper inductors with bond pads A method for manufacturing high performance copper inductors includes providing a tall, Cu laminate spiral inductor is formed at the last metal level, and at the last metal +1 level, with the metal levels being interconnected by a bar via having the same spiral shap... | 04/24/2007 |
| 7208344 | Wafer level mounting frame for ball grid array packaging, and method of making and using the same A method of forming a semiconductor package including placing a semiconductor chip in cavities of a semiconductor chip carrier substrate. ... | 04/24/2007 |
| 7207107 | Method and device for through-hole plating of substrates and printed circuit boards A method and apparatus for through-contacting flexible substrates 1, in particular circuit boards, having electrically conductive contact zones 4, 41 present on two opposing surfaces 1a, 1b of the substrate provides that a c... | 04/24/2007 |
| 7208402 | Method and apparatus for improved power routing An apparatus comprising: a die having a top metal layer, the top metal layer comprised of at least a first metal line and a second metal line; a passivation layer covering the top metal layer; a C4 bump on the passivation layer; and a first passivation opening and a... | 04/24/2007 |
| 7205673 | Reduce or eliminate IMC cracking in post wire bonded dies by doping aluminum used in bond pads during Cu/Low-k BEOL processing A bond pad structure which includes an aluminum bond pad which include one or more dopants that effectively control the growth of IMC to a nominal level in spite of high tensile stresses in the wafer. For example, aluminum can be doped with 1–2 atomic % of Mg. Alt... | 04/17/2007 |
| 7205222 | Method of fabricating a semiconductor integrated circuit that includes patterning a semiconductor substrate with a first photomask that uses metal for blocking light and patterning the same substrate with a second photomask that uses organic resin for blocking light Productivity of a semiconductor integrated circuit device is improved. According to how many times the photomask is used, a photomask having an opaque pattern made of metal and a photomask having an opaque pattern made of a resist film are properly used, and thereby... | 04/17/2007 |
| 7204427 | Method for making contactless cards A method for producing contact-free chip card includes embedding metallized bumps of the chip into an antenna as the chip is mounted on the antenna. ... | 04/17/2007 |
| 7205660 | Wafer level chip scale package having a gap and method for manufacturing the same A wafer level chip scale package may have a gap provided between a solder bump and a bump land. The gap may be filled with a gas. A method of manufacturing a wafer level chip scale package may involve forming a redistribution line having a first opening, forming a s... | 04/17/2007 |
| 7205177 | Methods of bonding two semiconductor devices A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface of a first element a first solder ball, producing on a first main su... | 04/17/2007 |
| 7205221 | Under bump metallization pad and solder bump connections The present invention relates to an improved method of forming and structure for under bump metallurgy (“UBM”) pads for a flip chip which reduces the number of metal layers and requires the use of only a single passivation layer to form, thus eliminating a maski... | 04/17/2007 |
| 7202113 | Wafer level bumpless method of making a flip chip mounted semiconductor device package A wafer level bumpless method of making flip chip mounted semiconductor device packages is disclosed. The method includes the steps of solder mask coating a semiconductor die wafer frontside, processing the solder mask coating to reveal a plurality of gate contact a... | 04/10/2007 |
| 7203394 | Micro mirror arrays and microstructures with solderable connection sites A micro mirror array including an upper wafer portion having a plurality of movable reflective surfaces located thereon, the upper wafer portion defining a coverage area in top view. The array further includes a lower wafer portion located generally below and couple... | 04/10/2007 |
| 7202556 | Semiconductor package having substrate with multi-layer metal bumps A semiconductor package includes a substrate formed of a board material, a semiconductor die bonded to the substrate, and an encapsulant on the die. The package also includes an array of external contacts formed as multi layered metal bumps that include a base layer... | 04/10/2007 |
| 7202552 | MEMS package using flexible substrates, and method thereof A MEMS package and a method for its forming are described. The MEMS package has at least one MEMS device located on a flexible substrate. A metal structure surrounds the at least one MEMS device wherein a bottom surface of the metal structure is attached to the flex... | 04/10/2007 |
