Class 438/613 - Bump electrode

Subclass of Class 438 - Semiconductor device manufacturing: process
Definition: Processes wherein the electrical contact is in the shape
No. of patents: 1561
Last issue date: 05/22/2012

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Number	Title	Issue Date
5585282	Process for forming a raised portion on a projecting contact for electrical testing of a semiconductor A process for forming die contacting substrate for establishing ohmic contact with the die is formed with raised portions on contact members. The raised portions are dimensioned so that a compression force applied to the die against the substrate results ...	12/17/1996
5578526	Method for forming a multi chip module (MCM) A method for forming a multi chip module for singulated semiconductor dice or dice contained on a wafer is provided. The method includes forming an interconnect adapted to support and establish an electrical connection with the dice. The interconnect incl...	11/26/1996
5545589	Method of forming a bump having a rugged side, a semiconductor device having the bump, and a method of mounting a semiconductor unit and a semiconductor device According to the present invention, a method for forming bumps for electrically connecting electrode pads of a semiconductor device to terminal electrodes formed on a surface of a circuit board respectively, the semiconductor device being mounted facedown...	08/13/1996
5541135	Method of fabricating a flip chip semiconductor device having an inductor Flip chip bumps (24, 26, and 27) and an inductor (17) are simultaneously fabricated on a semiconductor substrate (10). The fabrication process includes two electroplating steps. The first step electroplates copper (18) onto a seed layer (13) to form the i...	07/30/1996
5536677	Method of forming conductive bumps on a semiconductor device using a double mask structure A method for forming conductive bumps (60, 62) on a semiconductor device (50) using a mask structure (20) employs two masks (22, 24) individually fabricated and positioned in a back-to-back relationship. Each mask is patterned and isotropically etched to ...	07/16/1996
5527734	Method of manufacturing a semiconductor device by forming pyramid shaped bumps using a stabilizer By using an electroless metallization bath to which a stabilizer is added which suppresses the cathodic partial reaction, pyramid-shaped bumps (53) can be grown on the bond pads of semiconductor devices without lateral overgrowth of the coating layer 3. T...	06/18/1996
5517754	Fabrication processes for monolithic electronic modules This invention comprises various high production methods for simultaneously forming surface metallizations on a plurality of monolithic electronic modules. Each monolithic electronic module may comprise a single semiconductor chip or multiple semiconducto...	05/21/1996
5508230	Method for making a semiconductor device with diamond heat dissipation layer A semiconductor device having improved heat dissipating capability is provided. The preferred device in accordance with the invention includes an electronic device (12) formed in a surface (14) of a semiconductor die (10). The surface (14) is covered with...	04/16/1996
5496770	Method for manufacturing a semiconductor chip bump having improved contact characteristics A connection bump of a semiconductor chip is formed by a photoresist pattern. The photoresist pattern is obtained through an exposure process by which photolithography solution layers of positive and/or negative type are repeatedly exposed and thereafter ...	03/05/1996
5492863	Method for forming conductive bumps on a semiconductor device Conductive bumps (24) are formed on a semiconductor device (10) by applying or depositing an imageable conductive layer (18) over the device and in contact with I/O pads of a final metallization layer (14). The imageable conductive material is formed of a...	02/20/1996
5487999	Method for fabricating a penetration limited contact having a rough textured surface A method for forming contacts for establishing an electrical connection with contact locations on a semiconductor die is provided. The contacts are formed as raised members mounted on a compliant substrate. Each contact includes a rough textured surface h...	01/30/1996
5476815	Manufacturing method of semiconductor device A method of manufacturing a semiconductor device having a bonding pad portion. A wiring is formed on a substrate and an insulative protective film is formed onto the wiring. An opening portion is exposed and serves as the bonding pad portion in which a su...	12/19/1995
5457879	Method of shaping inter-substrate plug and receptacles interconnects A method electrically and mechanically interconnects two surfaces of high density first and second semiconductor devices. The first semiconductor device (10) is formed with plug members (22) connected to nodes (18) of its circuit elements (14) and protrud...	10/17/1995
5455196	Method of forming an array of electron emitters A method of forming an array of electron field emitters at a face of a semiconductor layer is disclosed. The method includes the steps of: providing a semiconductor workpiece having a plurality of field emitter sites on a face thereof; for each site, form...	10/03/1995
5436198	Method of manufacturing semiconductor device having straight wall bump A remaining layer obtained by etching away a half of a resist layer along its depth direction which functions as a mask when a straight wall type bump is formed, is employed as a protection layer for a semiconductor element, so that the surface protection...	07/25/1995
5426072	Process of manufacturing a three dimensional integrated circuit from stacked SOI wafers using a temporary silicon substrate A method of providing a first and a second Silicon-on-Insulator (SOI) wafer, wherein each SOI wafer includes a silicon layer separated from a bulk silicon substrate by a layer of dielectric material, typically SiO2. Next, at least one electrical feedthrou...	06/20/1995
5424245	Method of forming vias through two-sided substrate An integrated circuit substrate (26) is formed with active circuit elements (24, 32) on first and second surfaces of the substrate. The active circuit elements are interconnected with though-substrate vias (28) to minimize signal routing and reduce propag...	06/13/1995
5393697	Composite bump structure and methods of fabrication A composite bump structure and methods of forming the composite bump structure. The composite bump structure comprises a polymer body of relatively low Young's Modulus compared to metals covered by a conductive metal coating formed at the input/output pad...	02/28/1995
5393696	Method for forming multilayer indium bump contacts A method for forming multilayer bump contacts for use in flip-chip bump bonding and the like. The method comprises applying a base layer to a substrate and then applying a malleable conductive layer to the base layer. In a first embodiment, individual bum...	02/28/1995
5278083	Method for making reliable connections to small features of integrated circuits Generally, and in one form of the invention, a method is disclosed for contacting a feature on an integrated circuit comprising: depositing a removable planarizing material 14 around the feature 10 so that a portion of the feature 10 extends above the rem...	01/11/1994
5249450	Probehead for ultrasonic forging A wirebond probe head is modified for use in forming raised portions from material. The modified head includes a main portion and a sleeve, with the sleeve functioning as a shroud to reduce the tendency of forged material to exude from the periphery of th...	10/05/1993
5246880	Method for creating substrate electrodes for flip chip and other applications A method and apparatus for forming a conductive bump on a metal or other conductive surface or layer. A substrate is provided which includes the metal surface, a passivation layer next to the metal surface and an etch stop layer next to the passivation la...	09/21/1993
5214308	Substrate for packaging a semiconductor device A substrate for packaging a semiconductor device having a bump thereon according to the present invention is characterized by that the substrate has an electrode terminal to which the bump is to be connected, and a recess for receiving at least a top of t...	05/25/1993
5162257	Solder bump fabrication method The base of solder bumps is preserved by converting the under-bump metallurgy between the solder bump and contact pad into an intermetallic of the solder and the solderable component of the under-bump metallurgy prior to etching the under-bump metallurgy....	11/10/1992
5139610	Method of making a surface etched shadow mask A scratch reducing shadow mask for providing vapor deposition patterns of bonding metals onto a surface of a die. The shadow mask comprises a top surface and a bottom surface which define a plurality of vias for permitting vaporized bonding metals to pass...	08/18/1992
5139969	Method of making resin molded semiconductor device A resin molded semiconductor device includes external electrodes provided on and connected to the electrodes of a semiconductor element. The semiconductor device is produced by coating the electrodes of the semiconductor element with a coating resin encap...	08/18/1992
5034345	Method of fabricating a bump electrode for an integrated circuit device A bump electrode for connecting a semiconductor device with an external lead is disclosed. The bump electrode is designed to eliminate mechanical stress caused by molten metal flowing onto the semiconductor chip during manufacture. The bump electrode meta...	07/23/1991
4997791	IC card and method of manufacturing the same An IC card comprises a thermoplastic resin core sheet and an IC chip bearing a conductive projection formed on an electrode of the IC chip, the IC chip being embedded in the core sheet in such a manner that the exposed top surface of the conductive projec...	03/05/1991
4954458	Method of forming a three dimensional integrated circuit structure A semiconductor circuit apparatus including several semiconductor substrates interconnected by having elevated portions of one substrate contacting the surface of the second substrate where both substrates include at least one electrical circuit. Also inc...	09/04/1990
4948754	Method for making a semiconductor device According to the invention a method for making a semiconductor device comprising a step of preparing a semiconductor device having at least one semiconductor element formed in a semiconductor substrate, a plurality of electrode pads electrically connected...	08/14/1990
4931410	Process for producing semiconductor integrated circuit device having copper interconnections and/or wirings, and device produced Disclosed is a process for forming a patterned copper layer on a substrate, using a patterned photoresist layer for forming the patterned copper layer. Etching mask and anti-oxidizing layers are formed on a copper layer (from which the patterned copper la...	06/05/1990
4818728	Method of making a hybrid semiconductor device A method for making a semiconductor device of a type comprising at least first and second semiconductor circuit units, which method comprises the step of forming a plurality of connecting electrodes on an upper surface of each of at least first and second...	04/04/1989
4764804	Semiconductor device and process for producing the same A semiconductor device having improved heat-dissipating characteristics employs a thin insulator film made of diamond, which has excellent thermal conductivity, as an insulator film which is formed on a chip immediately below a heat-dissipating bump elect...	08/16/1988
4716049	Compressive pedestal for microminiature connections Apparatus is disclosed for providing microelectronic, intra-chip and chip-to-chip interconnections in an ultra-dense integrated circuit configuration. Compressive pedestals 20 are used to form spring-loaded electrical and mechanical interconnections to co...	12/29/1987
4585991	Solid state multiprobe testing apparatus A high density multiprobe including a multiprobe on a semiconductor substrate with contact pads selectively positioned in relation to the contacts of a device to be tested. Each of the selectively positioned contacts on the multiprobe semiconductor substr...	04/29/1986
4334349	Method of producing semiconductor device Disclosed is a method of producing a semiconductor device, comprising the steps of (a) forming a first insulating layer consisting of a lower silicon oxide film and an upper slicon nitride film on the surface of a semiconductor substrate, (b) forming a se...	06/15/1982
4172907	Method of protecting bumped semiconductor chips A method of protecting from physical damage the upper surface of medium and large scale integrated IC circuit chips. Certain types of IC chips are provided with a plurality of input/output terminals, or bumps, which project above the upper surface of the ...	10/30/1979
4152172	Method for cleaning raised terminal pads of semiconductor elements Method and apparatus for cleaning the top surfaces of raised input/output (I/O) terminals of semiconductor elements of a semiconductor wafer prior to electronic leads being reflow bonded to such terminals. The top surfaces of the I/O terminals substantial...	05/01/1979
3935635	Method of producing a semiconductor arrangement A method of producing a semiconductor arrangement comprises electrolytically depositing a thickening onto a metal layer, at the contact points for the semiconductor arrangement, which metal layer is intended to eventually form conducting paths for the sem...	02/03/1976

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Class 438/613 - Bump electrode