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...When G.G. Hubbard learned of his future son-in-law's invention, he called it "only a toy." His daughter was engaged to a young man named Alexander Graham Bell.
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| Number | Title | Issue Date |
| 7160796 | Method for manufacturing wiring board and semiconductor device Pads to be used for flip chip bonding and wire bonding are pattern-formed on a surface of a substrate. The pads to be used for flip chip bonding are shielded. Plating is applied to each of the pads to be used for wire bonding. Bonding pads for wire bonding is shield... | 01/09/2007 |
| 7159758 | Circuit board processing techniques using solder fusing A circuit board processing system has a circuit board fabrication stage configured to fabricate a circuit board having a set of circuit board pads, and a solder fusing stage coupled to the circuit board fabrication stage. The solder fusing stage is configured to (i)... | 01/09/2007 |
| 7160760 | Semiconductor device and a method of manufacturing the same A semiconductor device and method having high output and having reduced external resistance is reduced and improved radiating performance. A MOSFET (70) has a connecting portion for electrically connecting a surface electrode of a semiconductor pellet and a p... | 01/09/2007 |
| 7160797 | Method of bumping die pads for wafer testing A method of processing a semiconductor wafer including a plurality of semiconductor dies is provided. The method includes providing a semiconductor wafer including a plurality of semiconductor dies, at least a portion of the semiconductor dies including contact pads... | 01/09/2007 |
| 7161250 | Projected contact structures for engaging bumped semiconductor devices and methods of making the same A bumped semiconductor device contact structure is disclosed including at least one non-planar contact pad having a plurality of projections extending therefrom for contacting at least one solder ball of a bumped integrated circuit (IC) device, such as a bumped die ... | 01/09/2007 |
| 7159308 | Method of making a circuit board Provided is a method of forming a circuit board including (a) providing a first conductive sheet; (b) selectively removing one or more portions of the first conductive sheet to form a first panel having a first circuit board that is coupled to a disposable part of t... | 01/09/2007 |
| 7160820 | Method of preparing oxide crystal film/substrate composite and solution for use therein There is provided a process for preparing a composite material of an oxide crystal film and a substrate by forming a Y123 type oxide crystal film from a solution phase on a substrate using a liquid phase method, wherein problems such as cracking of the oxide crystal... | 01/09/2007 |
| 7159292 | Recovery processing method of an electrode While a transfer surface 10a of a transfer plate 10 having a predetermined surface roughness is brought into contact with a plurality of bumps 44B on a contact sheet 44 formed on a substrate 44M having the coefficient of lin... | 01/09/2007 |
| 7157310 | Methods for packaging microfeature devices and microfeature devices formed by such methods Methods for packaging microfeature devices on and/or in microfeature workpieces at the wafer level and microfeature devices that are formed using such methods are disclosed herein. In one embodiment, a method comprises providing a workpiece including a substrate hav... | 01/02/2007 |
| 7157361 | Methods for processing integrated circuit packages formed using electroplating and apparatus made therefrom An integrated circuit package is processed by electroplating the integrated circuit package. The electroplating is performed without forming plating traces on a conductive surface of a pad side of the integrated circuit package. Pad areas of the integrated circuit p... | 01/02/2007 |
| 7157308 | Circuit substrates, semiconductor devices, semiconductor manufacturing apparatus methods for manufacturing circuit substrates, and methods for manufacturing semiconductor devices A method is provided to control the height of bump electrodes and increase a clearance between edge sections of a semiconductor chip and lead terminals of a tape substrate. By applying suction to a tape substrate through a suction groove, boundary portions of a semi... | 01/02/2007 |
| 7157363 | Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is for... | 01/02/2007 |
| 7153765 | Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particles A nano-sized solder suspension flows by selective wetting onto a bond pad and away from a bond-pad resist area. A microelectronic package is also disclosed that uses the nano-sized solder suspension. A method of assembling a microelectronic package is also disclosed... | 12/26/2006 |
| 7154176 | Conductive bumps with non-conductive juxtaposed sidewalls A microelectronic structure having a substrate of multiple conductive bumps for contact with bond pads on an electronic substrate in the fabrication of a flip chip electronic assembly. Each of the conductive bumps includes a conductive layer which is absent from at ... | 12/26/2006 |
| 7153764 | Method of manufacturing a semiconductor device including a bump forming process A method of manufacturing a semiconductor device includes an improved bump forming process. The bump forming process includes a bump forming step for forming a bump on the pad by feeding a gold wire from a capillary while moving the capillary; a sliding step of slig... | 12/26/2006 |
| 7151050 | Method for fabricating electrical connection structure of circuit board A method for fabricating an electrical connection structure of a circuit board is proposed. A patterned resist layer is formed on the circuit board having a plurality of conductive pads, and a plurality of openings is formed in the resist layer to expose the conduct... | 12/19/2006 |
| 7151012 | Redistribution layer of wafer and the fabricating method thereof A wafer comprises a wafer, a conductor, a first passivation layer, a second passivation layer, a redistribution layer, and a third passivation layer. The conductor is disposed on the wafer. The first passivation layer covers the wafer, and exposes the surface of the... | 12/19/2006 |
| 7151317 | Multi-chip package structure A multi-chip package structure comprising a first chip, a patterned lamination layer, a plurality of first bumps, a second chip and second bumps is provided. The first chip has a first active surface. The patterned lamination layer is disposed on a portion area of t... | 12/19/2006 |
| 7151049 | Electroplating compositions and methods Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, an acid, a thiourea derivative, and an additive selected from alkanol amines, polyethylene imines, a... | 12/19/2006 |
| 7146722 | Method of forming a bond pad structure A bond pad structure comprising two bond pads, methods of forming the bond pad structure, an integrated circuit die incorporating the bond pad structure, and methods of using the bond pad structure are provided. Each of the bond pads comprise stacked metal layers, a... | 12/12/2006 |
| 7145236 | Semiconductor device having solder bumps reliably reflow solderable A semiconductor module solder bonding of high reliability in which the heat resisting properties of the circuit substrate and electronic parts are taken into consideration. In order to achieve this, there are provided semiconductor devices each having solder bumps a... | 12/05/2006 |
| 7140102 | Electrode sandwich separation Materials bonded together are separated using electrical current, thermal stresses, mechanical force, any combination of the above methods, or any other application or removal of energy until the bonds disappear and the materials are separated. In one embodiment the... | 11/28/2006 |
| 7141878 | Semiconductor device and manufacturing method thereof A semiconductor device is comprised of a semiconductor element having a low dielectric constant insulating film, first electrode pads and barrier metal layers; and a substrate having second electrode pads corresponding to the first electrode pads. The first electrod... | 11/28/2006 |
| 7141879 | Semiconductor device There is described an improved semiconductor device of chip-scale package (CSP) comprising posts provided on respective electrode pads of a semiconductor chip, and solder balls which are provided on the respective posts as external terminals after the semiconductor ... | 11/28/2006 |
| 7138326 | Wafer integrated rigid support ring A shadow mask for depositing solder bumps includes additional dummy holes located adjacent holes corresponding to most of the perimeter chips of the wafer. The additional dummy provide more uniform plasma etching of contacts of the wafer, improve etching of contacts... | 11/21/2006 |
| 7138583 | Method and apparatus for maintaining a separation between contacts Methods and apparatus for controlling the distance between contact pads or leads which are to be interfaced are disclosed. According to one aspect of the present invention, an electrical package includes a body and a contact. The body includes electrical circuitry s... | 11/21/2006 |
| 7135771 | Self alignment features for an electronic assembly Some embodiments of the present invention relate to an electronic assembly that includes a substrate and a die. The electronic assembly further includes an alignment bump on one of the die and the substrate and a group of mating bumps on the other of the die and the... | 11/14/2006 |
| 7135758 | Surface mount solder method and apparatus for decoupling capacitance and process of making A system to package high performance microelectronic devices, such as processors, responds to component transients. In one embodiment, the system includes a decoupling capacitor that is disposed between a Vcc electrical bump and a Vss electrical bump. The decoupling... | 11/14/2006 |
| 7135355 | Stencil mask design method and under bump metallurgy for C4 solder bump A method for the fine-pitch stencil mask design for stencil printing bumping technology for eutectic Sn/Pb and lead-free solder material is described. In the method, a reflowing enhancement layer is introduced to improve the solder quality and reduce the pitch of so... | 11/14/2006 |
| 7135397 | Method and system for packaging ball grid arrays According to one embodiment of the invention, a method of packaging ball grid arrays includes providing a substrate having a plurality of holes formed therein. Each hole is associated with a respective one of a plurality of contact pads formed on a first surface of ... | 11/14/2006 |
| 7135770 | Semiconductor element with conductive columnar projection and a semiconductor device with conductive columnar projection A columnar bump formed of copper etc. is formed on a wiring film of a semiconductor chip through an interconnected film and an adhesive film in a wafer unit by electrolytic plating in which package formation is possible. An oxidation prevention film is formed of suc... | 11/14/2006 |
| 7132744 | Enhanced die-up ball grid array packages and method for making the same An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second surface is provided. An IC die is mounted to the first substrate surf... | 11/07/2006 |
| 7132741 | Semiconductor chip assembly with carved bumped terminal A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a metal filler, a connection joint that electrically connects the routing line and the pad, and an enca... | 11/07/2006 |
| 7132357 | Method for shielding printed circuit board circuits A method for shielding one or more circuits (21, 21′) of a printed circuit board includes depositing a layer of dielectric material (43) over a printed circuit board substrate (22) and the printed circuits (21, 21′), creating a trench... | 11/07/2006 |
| 7132356 | Interconnection method A method of forming bumped substrates with protuberances for inverted or flip-connection bonding of electronic devices including semiconductor devices, integrated circuits, and/or application specific integrated circuits and electromechanical devices. The substrates... | 11/07/2006 |
| 7131195 | Method for forming metal contacts on a substrate Solder bump pads are formed on a semiconductor substrate by way of a semiconductor template that has been micromachined to receive solder paste material. The solder paste material is then formed into precisely controlled ball shapes and geometries. ... | 11/07/2006 |
| 7132359 | Tolerance bondwire inductors for analog circuitry Disclosed are wirebonding methods wherein bondwires are positioned using dynamically determined variations in die placement. Preferred methods of the invention include steps for placing a die on the prepared substrate using selected ideal placement coordinates. Devi... | 11/07/2006 |
| 7129585 | Semiconductor device and method of packaging the same Embodiments of the invention provide a semiconductor-chip mounting body, a semiconductor device including the mounting body, and a method of packaging the semiconductor device. According to some embodiments, when a semiconductor chip is mounted on the mounting body ... | 10/31/2006 |
| 7129584 | Elimination of RDL using tape base flip chip on flex for die stacking A flexible film interposer for stacking a flip chip semiconductor die onto a second (bottom) semiconductor die, semiconductor devices and stacked die assemblies that incorporate the flexible film interposer, and methods of fabricating the devices and assemblies are ... | 10/31/2006 |
| 7129575 | Semiconductor chip assembly with bumped metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an enca... | 10/31/2006 |
