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| Number | Title | Issue Date |
| 7884006 | Method to build a wirebond probe card in a many at a time fashion Resilient spring contacts for use in wafer test probing are provided that can be manufactured with a very fine pitch spacing and precisely located on a support substrate. The resilient contact structures are adapted for wire bonding to an electrical circuit on a spa... | 02/08/2011 |
| 7659191 | Gold/silicon eutectic die bonding method A direct gold/silicon eutectic die bonding method is disclosed. The method includes the steps of gold plating a die bonding pad, grinding a wafer to a desired thickness, dicing the wafer after the grinding step, picking a die, and attaching the die to the die bondin... | 02/09/2010 |
| 7514350 | Electronic device and method of manufacturing the same, circuit board, and electronic instrument An electronic device includes: a substrate on which an interconnect pattern is formed; a chip component having a first surface on which a pad is formed and a second surface opposite to the first surface, the chip component being mounted in such a manner that the sec... | 04/07/2009 |
| 7443019 | Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same The invention relates to a semiconductor device with conductor tracks between a semiconductor chip and a circuit carrier, and to a method for producing the same. The conductor tracks extend from contact areas on the top side of the semiconductor chip to contact pads... | 10/28/2008 |
| 7432213 | Electrical connection pattern in an electronic panel A connector layout for arranging a plurality of parallel electrical connectors between two electronic devices. Each connector has a strip connected to a bump pad. Each strip has a certain required strip width and each bump pad has a certain required pad width. Each ... | 10/07/2008 |
| 7400041 | Compliant multi-composition interconnects A compliant interconnect with two or more layers of metal of two or more compositions with internal stresses is described herein. ... | 07/15/2008 |
| 7389581 | Method of forming compliant contact structures A compliant contact structure and contactor card for operably coupling with a semiconductor device to be tested includes a substantially planar substrate with a compliant contact formed therein. The compliant contact structure includes a portion fixed within the sub... | 06/24/2008 |
| 7390733 | Method of manufacturing a semiconductor device including a protruding electrode bonded to a lead electrode To enhance bonding accuracy of a bump electrode, while coping with narrowing pitch of the bump electrodes, a protruding electrode, whose leading end is sharpened, is provided to a semiconductor chip, and the protruding electrode is bonded to a lead electrode, while ... | 06/24/2008 |
| 7368325 | Semiconductor package A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can. ... | 05/06/2008 |
| 7365436 | Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same A disclosed substrate includes a base member having a through-hole, and a conductive metal filling in the through-hole so as to form a penetrating via. The penetrating via contains a conductive core member that is substantially at the central axis of the through-hol... | 04/29/2008 |
| 7363705 | Method of making a contact Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b... | 04/29/2008 |
| 7363694 | Method of testing using compliant contact structures, contactor cards and test system A compliant contact structure and contactor card for operably coupling with a semiconductor device to be tested includes a substantially planar substrate with a compliant contact formed therein. The compliant contact structure includes a portion fixed within the sub... | 04/29/2008 |
| 7364998 | Method for forming high reliability bump structure Methods for forming a bump on a semiconductor substrate, the substrate having a contact pad thereon, is provided. In one embodiment, the method comprises depositing a passivation layer over the substrate and the contact pad. The passivation layer is patterned and et... | 04/29/2008 |
| 7353712 | Integrated circuitry and method for manufacturing the same The integrated circuitry on a semiconductor substrate includes an integrated circuit arranged in a circuit area of the semiconductor substrate and a stress-sensitive structure on the semiconductor substrate for detecting a mechanical stress component in the semicond... | 04/08/2008 |
| 7344968 | Semiconductor chip having pads with plural junctions for different assembly methods Development efficiency and mass production efficiency of a semiconductor chip (LSI) is improved, whereby the LSI on which an integrated circuit is formed has plural pad parts connecting the integrated circuit with an external circuit. The pad part is provided with a... | 03/18/2008 |
| 7338896 | Formation of deep via airgaps for three dimensional wafer to wafer interconnect A method for forming deep via airgaps in a semiconductor substrate is disclosed comprising the steps of patterning a hole in the substrate, partly fill said hole with a sacrificial material (e.g. poly-Si), forming spacers on the sidewalls of the unfilled part of the... | 03/04/2008 |
| 7338831 | Method of fabricating semiconductor probe with resistive tip Provided is a method of fabricating a semiconductor probe with a resistive tip. The method includes steps of forming a mask layer on a substrate doped with first impurities and forming first and second semiconductor electrode regions heavily doped with the second im... | 03/04/2008 |
| 7335517 | Multichip semiconductor device, chip therefor and method of formation thereof A multichip semiconductor device is disclosed in which chips are stacked each of which comprises a semiconductor substrate formed on top with circuit components and an interlayer insulating film formed on the top of the semiconductor substrate. At least one of the c... | 02/26/2008 |
| 7329597 | Semiconductor chip and tab package having the same A semiconductor chip, having an active surface including a peripheral area and a central area, presents a connection area formed on a portion of the peripheral area. The semiconductor chip includes output pads formed in the peripheral area of the active surface and ... | 02/12/2008 |
| 7320932 | Semiconductor device and manufacturing method thereof A semiconductor device of the present invention is furnished with (a) a first protection film, formed on a substrate, having an opening section on an electrode pad, (b) a protrusion electrode, connected on the electrode pad at the opening section, whose peripheral p... | 01/22/2008 |
| 7319265 | Semiconductor chip assembly with precision-formed metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The metal ... | 01/15/2008 |
| 7312103 | Method for making an integrated circuit substrate having laser-embedded conductive patterns A method for making an integrated circuit substrate having laser-embedded conductive patterns provides a high-density mounting and interconnect structure for integrated circuits. A dielectric material is injection-molded or laminated over a metal layer that is punch... | 12/25/2007 |
| 7309915 | Semiconductor chip having pads with plural junctions for different assembly methods Development efficiency and mass production efficiency of a semiconductor chip (LSI) is improved, whereby the LSI on which an integrated circuit is formed has plural pad parts connecting the integrated circuit with an external circuit. The pad part is provided with a... | 12/18/2007 |
| 7288424 | Integrated driver process flow An integrated device includes one or more device drivers and a micro-electro-mechanical system (MEMS) structure monolithically coupled to the one or more device drivers. The one or more device drivers are configured to process received control signals and to transmi... | 10/30/2007 |
| 7288437 | Conductive pattern producing method and its applications An improved method of forming an electrode pattern on a substrate is described. The substrate is coated with a first conductive film and subjected to baking. On the first conductive film is then overlied a second conductive film which mends possible fissures of the ... | 10/30/2007 |
| 7282396 | Method of manufacturing a semiconductor device including using a sealing resin to form a sealing body The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural lea... | 10/16/2007 |
| 7278564 | Method of mounting electronic component, structure for mounting electronic component, electronic component module, and electronic apparatus The invention provides a method of mounting an electronic component where an electronic component can be reliably electrically-connected to a substrate. A substrate defines a through-hole that extends through the substrate, from connection electrodes formed on the l... | 10/09/2007 |
| 7279391 | Integrated inductors and compliant interconnects for semiconductor packaging Some embodiments of the present invention include integrated inductors and compliant interconnects for semiconductor packaging. ... | 10/09/2007 |
| 7273812 | Microprobe tips and methods for making Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b... | 09/25/2007 |
| 7268021 | Lead frame and method of manufacturing the same A lead frame having a structure that can discharge hydrogen adsorbed during deposition and can reduce a galvanic potential difference between plating layers and a method of manufacturing the same are provided. The method includes forming a Ni plating layer formed of... | 09/11/2007 |
| 7256592 | Probe with trapezoidal contractor and device based on application thereof, and method of producing them A probe is disclosed, comprising a beam, which has a front end, an intermediate portion and a base end. The leading end is a portion for contacting a test subject through a contactor, the base end being a portion for fixing the probe. The probe includes a substantia... | 08/14/2007 |
| 7256591 | Probe card, having cantilever-type probe and method A probe card is used to test an electronic device. The probe card includes a base plate and a cantilever-type probe arranged on the base plate. The cantilever-type probe has an end that contacts the contacted body and moves when contacting the contacted body. A stop... | 08/14/2007 |
| 7256504 | Circuit support for a semiconductor chip and component A circuit support for a semiconductor chip with a substrate made of an insulating material has a chip mounting area and a plurality of bonding pads surrounding the chip mounting area. The chip can be applied in a central area of the chip mounting area. A peripheral ... | 08/14/2007 |
| 7255010 | Integrated circuitry and method for manufacturing the same The integrated circuitry on a semiconductor substrate includes an integrated circuit arranged in a circuit area of the semiconductor substrate and a stress-sensitive structure on the semiconductor substrate for detecting a mechanical stress component in the semicond... | 08/14/2007 |
| 7256069 | Wafer-level package and methods of fabricating A carrier for use in a chip-scale package, including a polymeric film with apertures defined therethrough. The apertures, which are alignable with corresponding bond pads of a semiconductor device, each include a quantity of conductive material extending substantial... | 08/14/2007 |
| 7245023 | Semiconductor chip assembly with solder-attached ground plane A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a pillar and a routing line, a solder joint and a ground plane. The pillar extends into an opening in the ground plane, the solder joint cont... | 07/17/2007 |
| 7241640 | Solder ball assembly for a semiconductor device and method of fabricating same Solder ball assembly for a semiconductor device and method of fabricating the same is described. In one example, a solder mask is formed on a substrate having an aperture exposing at least a portion of a conductive pad of the substrate. A solder pillar is formed in ... | 07/10/2007 |
| 7233057 | Integrated circuit package with optimized mold shape The invention relates to an integrated circuit package, in particular an integrated chip size package or an integrated chip scale package, comprising a substrate carrying a die, and connection elements, interconnection elements, connecting pins of said die with said... | 06/19/2007 |
| 7232706 | Method of making a semiconductor chip assembly with a precision-formed metal pillar A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects... | 06/19/2007 |
| 7232707 | Method of making a semiconductor chip assembly with an interlocked contact terminal A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects... | 06/19/2007 |
