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Class 438/486 - And subsequent crystallization


Subclass of Class 438 - Semiconductor device manufacturing: process
Definition: Process having a step of depositing an amorphous semiconductor
No. of patents: 782
Last issue date: 05/29/2012


1                      
NumberTitleIssue Date
8187956Method for manufacturing microcrystalline semiconductor film, thin film transistor having microcrystalline semiconductor film, and photoelectric conversion device having microcrystalline semiconductor film
A method for forming a microcrystalline semiconductor film over a base formed of a different material, which has high crystallinity in the entire film and at an interface with the base, is proposed. Further, a method for manufacturing a thin film transistor includin...
05/29/2012
8158497Planar nonpolar m-plane group III nitride films grown on miscut substrates
A nonpolar III-nitride film grown on a miscut angle of a substrate, in order to suppress the surface undulations, is provided. The surface morphology of the film is improved with a miscut angle towards an a-axis direction comprising a 0.15° or greater miscut angle ...
04/17/2012
8158498P-channel MOS transistor and fabrication process thereof
A p-channel MOS transistor includes a gate electrode formed on a silicon substrate in correspondence to a channel region therein via a gate insulation film, the gate electrode carrying sidewall insulation films on respective sidewall surfaces thereof, and source and...
04/17/2012
8101509Semiconductor integrated circuit device
A method of fabricating a semiconductor integrated circuit includes forming a first dielectric layer on a semiconductor substrate, patterning the first dielectric layer to form a first patterned dielectric layer, forming a non-single crystal seed layer on the first ...
01/24/2012
8088676Metal-induced crystallization of amorphous silicon, polycrystalline silicon thin films produced thereby and thin film transistors produced therefrom
Crystallization-inducing metal elements are introduced onto an amorphous silicon thin film. A first, low-temperature, heat-treatment induces nucleation of metal-induced crystallization (MIC), resulting in the formation of small polycrystalline silicon “islands”....
01/03/2012
8048783Method of forming polycrystalline silicon layer and atomic layer deposition apparatus used for the same
A method of forming a polycrystalline silicon layer and an atomic layer deposition apparatus used for the same. The method includes forming an amorphous silicon layer on a substrate, exposing the substrate having the amorphous silicon layer to a hydrophilic or hydro...
11/01/2011
8043943Low-temperature formation of polycrystalline semiconductor films via enhanced metal-induced crystallization
A method for forming polycrystalline semiconductor film from amorphous semiconductor film at reduced temperatures and/or accelerated rates. The inclusion of a small percentage of semiconductor material, such as 2% within the metal layer, reduces the temperatures req...
10/25/2011
8030189Method for maintaining a smooth surface of crystallizable material
A method for maintaining a smooth surface of crystallizable material is disclosed. First, a substrate is provided. A target material layer is then formed on the substrate, with the target material being a crystallizable material. A protecting layer is subsequently f...
10/04/2011
8017506Semiconductor device and method for forming the same
A thin film transistor device reduced substantially in resistance between the source and the drain by incorporating a silicide film, which is fabricated by a process comprising forming a gate insulator film and a gate contact on a silicon substrate, anodically oxidi...
09/13/2011
8008171Method of fabricating polycrystalline semiconductor
Disclosed is a method of providing a poly-Si layer used in fabricating poly-Si TFT's or devices containing poly-Si layers. Particularly, a method utilizing at least one metal plate covering the amorphous silicon layer or the substrate, and applying RTA (Rapid Therma...
08/30/2011
8003498Particle beam assisted modification of thin film materials
Several examples of a method for processing a substrate are disclosed. In a particular embodiment, the method may include: introducing a plurality of first particles to a first region of the substrate so as to form at least one crystal having a grain boundary in the...
08/23/2011
7998844Method for manufacturing a semiconductor device
A process for fabricating a highly stable and reliable semiconductor, comprising: coating the surface of an amorphous silicon film with a solution containing a catalyst element capable of accelerating the crystallization of the amorphous silicon film, and heat treat...
08/16/2011
7989326Thin film transistor and method of fabricating the same
A thin film transistor and method of fabricating the same are provided. The thin film transistor includes: a metal catalyst layer formed on a substrate, and a first capping layer and a second capping layer pattern sequentially formed on the metal catalyst layer. The...
08/02/2011
7981778Directional solid phase crystallization of thin amorphous silicon for solar cell applications
Embodiments of the present invention provide a method for converting a doped amorphous silicon layer deposited onto a crystalline silicon substrate into crystalline silicon having the same grain structure and crystal orientation as the underlying crystalline silicon...
07/19/2011
7977217Method of crystallizing silicon
A method of crystallizing silicon including preparing a substrate having an amorphous silicon film formed thereon, aligning a mask having a first energy region and a second energy region over a first region of the amorphous silicon film formed on the substrate, irra...
07/12/2011
7955958Method for fabrication of polycrystalline diodes for resistive memories
The present invention, in one embodiment, provides a method of producing a PN junction the method including at least the steps of providing a Si-containing substrate; forming an insulating layer on the Si-containing substrate; forming a via through the insulating la...
06/07/2011
7923357Method for forming poly-silicon film
A poly-silicon film formation method for forming a poly-silicon film doped with phosphorous or boron includes heating a target substrate placed in a vacuum atmosphere inside a reaction container, and supplying into the reaction container a silicon film formation gas...
04/12/2011
7919398Microcrystalline silicon deposition for thin film solar applications
Embodiments of the invention as recited in the claims relate to thin film multi-junction solar cells and methods and apparatuses for forming the same. In one embodiment a method of forming a thin film multi-junction solar cell over a substrate is provided. The metho...
04/05/2011
7906413Abrupt “delta-like” doping in Si and SiGe films by UHV-CVD
A structure and method of forming an abrupt doping profile is described incorporating a substrate, a first epitaxial layer of Ge less than the critical thickness having a P or As concentration greater than 5×1019 atoms/cc, and a second epitaxial layer ha...
03/15/2011
7897494Formation of single crystal semiconductor nanowires
A method is provided for growing mono-crystalline nanostructures onto a substrate. The method comprises at least the steps of first providing a pattern onto a main surface of the substrate wherein said pattern has openings extending to the surface of the substrate, ...
03/01/2011
7897493Inducement of strain in a semiconductor layer
Strain is induced in a semiconductor layer. Embodiments include inducing strain by, for example, creation of free surfaces. ...
03/01/2011
7888246Semiconductor integrated circuit device and a method of fabricating the same
A method of fabricating a semiconductor integrated circuit includes forming a first dielectric layer on a semiconductor substrate, patterning the first dielectric layer to form a first patterned dielectric layer, forming a non-single crystal seed layer on the first ...
02/15/2011
7863166Method of manufacturing semiconductor storage device
A method of manufacturing a semiconductor storage device includes providing an opening portion in a plurality of positions in an insulating film formed on a silicon substrate, and thereafter forming an amorphous silicon film on the insulating film, in which the open...
01/04/2011
7842588Group-III metal nitride and preparation thereof
A method for forming a group-III metal nitride material film attached to a substrate including subjecting the substrate to an ambient pressure of no greater than 0.01 Pa, and heating the substrate to a temperature of between approximately 500° C.-800° C. The metho...
11/30/2010
7811909Production of a hexagonal boron nitride crystal body capable of emitting out ultraviolet radiation
The invention has for its object to provide a process of synthesizing high-purity hBN crystal bodies on a robust substrate even under normal pressure. The inventive process of producing hexagonal boron nitride crystal bodies is characterized by comprising a p...
10/12/2010
7803700Crystal imprinting methods for fabricating substrates with thin active silicon layers
Methods of forming semiconductor structures characterized by a thin active silicon layer on an insulating substrate by a crystal imprinting or damascene approach. The methods include patterning an insulating layer to define a plurality of apertures, filling the aper...
09/28/2010
7803699Polysilicon thin film transistor and method of fabricating the same
A polysilicon thin film transistor (TFT) may include a substrate, at least one insulating layer, a semiconductor layer, a gate electrode, a source electrode, a drain electrode, and a heat retaining layer formed to contact the semiconductor layer. The heat retaining ...
09/28/2010
7767558Method of crystallizing amorphous silicon and device fabricated using the same
A method of crystallizing amorphous silicon includes forming an amorphous silicon film over a substrate, crystallizing the amorphous silicon film to form a polycrystalline silicon film using a sequential lateral solidification crystallization method, and performing ...
08/03/2010
7759230System for providing a continuous motion sequential lateral solidification for reducing or eliminating artifacts in overlap regions, and a mask for facilitating such artifact reduction/elimination
An arrangement, process and mask for implementing single-scan continuous motion sequential lateral solidification of a thin film provided on a sample such that artifacts formed at the edges of the beamlets irradiating the thin film are significantly reduced. Accordi...
07/20/2010
7749873Polycrystalline silicon layer, flat panel display using the same, and methods of fabricating the same
A polycrystalline silicon layer, a flat panel display using the polycrystalline silicon layer, and methods of fabricating the same are provided. An amorphous silicon layer is formed on a substrate. A first pattern layer, a second pattern layer, and a metal catalyst ...
07/06/2010
7709359Integrated circuit with dielectric layer
A method of fabricating an integrated circuit with a dielectric layer on a substrate is disclosed. One embodiment provides forming the dielectric layer in an amorphous state on the substrate, the dielectric layer having a crystallization temperature; a doping the di...
05/04/2010
7709360Method for manufacturing a crystalline silicon layer
A method of forming a crystalline silicon layer on a microrough face of a substrate by reducing the microroughness of the face and then performing a metal induced crystallization process on the face is disclosed. The method further comprises, after metal induced cry...
05/04/2010
7700461Methods of laterally forming single crystalline thin film regions from seed layers
In a method of manufacturing a semiconductor device, a string structure including a selection transistor and a memory cell on a substrate. An insulation layer pattern is formed on the substrate to cover the string structure. The insulation layer pattern includes at ...
04/20/2010
7691733Laser processing method for trench-edge-defect-free solid phase epitaxy in confined geometrics
The present invention provides an improved amorphization/templated recrystallization (ATR) method for fabricating low-defect-density hybrid orientation substrates. ATR methods for hybrid orientation substrate fabrication generally start with a Si layer having a firs...
04/06/2010
7670935Manufacturing method of semiconductor device
Island-like semiconductor films and markers are formed prior to laser irradiation. Markers are used as positional references so as not to perform laser irradiation all over the semiconductor within a substrate surface, but to perform a minimum crystallization on at ...
03/02/2010
7662702Method for manufacturing a crystalline silicon layer
A method of forming a crystalline silicon layer on a microrough face of a substrate by reducing the microroughness of the face and then performing a metal induced crystallization process on the face is disclosed. ...
02/16/2010
7659185Method for forming silicon thin-film on flexible metal substrate
Disclosed are a method for forming a silicon thin-film on a substrate, and more particularly a method for forming a polycrystalline silicon thin-film of good quality on a flexible metal substrate. A metal substrate (110) is prepared and a surface of the metal...
02/09/2010
7651928Method for crystallizing a semiconductor thin film
A method for crystallizing a semiconductor thin film is provided. The method includes continuously irradiating an energy beam on a semiconductor thin film while scanning at a given speed. The energy beam is scanned in parallel lines while keeping pitches of not larg...
01/26/2010
7651929Hybrid oriented substrates and crystal imprinting methods for forming such hybrid oriented substrates
A semiconductor structure with an insulating layer on a silicon substrate, a plurality of electrically-isolated silicon-on-insulator (SOI) regions separated from the substrate by the insulating layer, and a plurality of electrically-isolated silicon bulk regions ext...
01/26/2010
7651930Method of manufacturing semiconductor storage device
A method of manufacturing a semiconductor storage device includes providing an opening portion in a plurality of positions in an insulating film formed on a silicon substrate, and thereafter forming an amorphous silicon film on the insulating film, in which the open...
01/26/2010
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