Did You Know...
...that the Eveready Battery began as an invention called the "electric flowerpot," which was a tube with a battery and light bulb inside? The idea was to fasten this gizmo to the side of a flowerpot so it would illuminate the flowers from the bottom. The idea died on the vine and the businessman who licensed the flower pot, Conrad Huber, was left with a pile of useless tubes -- until he found a way to market them as batteries to light the world!
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| Number | Title | Issue Date |
| 8158494 | Method for processing a substrate, method for manufacturing a semiconductor chip, and method for manufacturing a semiconductor chip having a resin adhesive layer A mask used when a semiconductor wafer is diced into individual semiconductor chips by plasma etching is formed as follows. First, a pattern of a liquid-repellent film is formed by printing a liquid-repellent liquid on the area to be etched on the rear surface of th... | 04/17/2012 |
| 8114759 | Dicing method using a die attach film on an adhesive sheet With the invented dicing method, by increasing the cohesive strength while decreasing the adhesive strength of an ultraviolet-curing adhesive in advance, mixing of the ultraviolet-curing adhesive layer of an adhesive sheet with a die attach film on a dicing line can... | 02/14/2012 |
| 7955955 | Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structures A semiconductor product comprises a semiconductor substrate having a top surface and a bottom surface including a semiconductor chip. The semiconductor substrate has a top surface and a perimeter. A barrier is formed in the chip within the perimeter. An Ultra Deep I... | 06/07/2011 |
| 7811904 | Method of fabricating a semiconductor device employing electroless plating A method of fabricating a semiconductor device employing electroless plating including wafer backside protection during wet processing is disclosed. The method includes the steps of laminating a wafer back side and a frame with a protective tape, applying a protecti... | 10/12/2010 |
| 7790578 | Dicing method using volatile protective agent Prior to dicing, a volatile protective agent is applied to at least the face of the substrate in which the devices are fabricated. Then the devices are separated by dicing. After dicing, the surface of the volatile protective agent is cleaned, and then the volatile ... | 09/07/2010 |
| 7767557 | Chilled wafer dicing A method for dicing a wafer is disclosed. One illustrative method includes forming a layer of frozen material above a plurality of integrated circuit dies on a substrate and performing a cutting process to cut through the layer of frozen material and the substrate t... | 08/03/2010 |
| 7763528 | Method for manufacturing semiconductor device A method for manufacturing a semiconductor device includes forming protruded electrodes on a plurality of chip areas of a semiconductor wafer having the chip areas and boundary regions both being provided in a surface of the semiconductor wafer; forming a surface-si... | 07/27/2010 |
| 7413931 | Semiconductor device manufacturing method The invention is directed to improvement of reliability of a chip size package type semiconductor device in a manufacturing method thereof. A support body is formed on a front surface of a semiconductor substrate with a first insulation film therebetween. Then, a pa... | 08/19/2008 |
| 7413927 | Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages An apparatus and method for enhancing the formation of fillets around the periphery of assembled wafer-level chip scale packages when mounted onto substrates. The method includes fabricating a plurality of integrated circuit die on a first surface of a semiconductor... | 08/19/2008 |
| 7399682 | Wafer processing method A wafer processing method for carrying out processing by applying a laser beam along streets formed on a wafer, comprising a step of applying a laser beam at an incident angle of a predetermined inclination angle to the normal line of a processing surface of the waf... | 07/15/2008 |
| 7399683 | Manufacturing method of semiconductor device A manufacturing method of a semiconductor device of this invention includes forming metal pads on a Si substrate through a first oxide film, bonding the Si substrate and a holding substrate which bolsters the Si substrate through a bonding film, forming an opening b... | 07/15/2008 |
| 7371664 | Process for wafer thinning The present invention relates to a process for thinning a semiconductor wafer. Two surfaces of the wafer separately form a surface-bond glue (layer) and a surface protective glue (layer). The thinning process is applied to the wafer before forming the surface protec... | 05/13/2008 |
| 7371663 | Three dimensional IC device and alignment methods of IC device substrates Alignment methods of IC device substrates. A first IC device substrate has a first front side for defining a plurality of first IC features, a first backside opposite the first front side, and a first alignment pattern formed on the first front side or the first bac... | 05/13/2008 |
| 7368380 | Method of manufacturing semiconductor device A method of manufacturing a semiconductor device is disclosed in which a metallic deposit is stably formed on the anode side with small variation in film thickness, and plating is prevented on the cathode side without carrying out any additional processing on the ca... | 05/06/2008 |
| 7361575 | Semiconductor device and method for manufacturing the same Embodiments relate to a semiconductor device and a method for manufacturing a semiconductor device that may be capable of improving a step coverage of main chip and scribe lane regions during a formation of an interlayer dielectric are provided. In embodiments, the ... | 04/22/2008 |
| 7354790 | Method and apparatus for avoiding dicing chip-outs in integrated circuit die A method and apparatus for avoiding dicing chip-outs in integrated circuit die comprises: (a) providing a wafer for forming a plurality of integrated circuit die thereon; (b) forming the plurality of integrated circuit die on the wafer; and (c) forming a saw street ... | 04/08/2008 |
| 7351645 | Pressure sensitive adhesive sheet for use in semiconductor working and method for producing semiconductor chip A pressure sensitive adhesive sheet to be used in producing an extremely thin semiconductor chip which is free of breakage and discoloration by a predicing process and a method of use thereof are provided. The pressure sensitive adhesive sheet is used in a method fo... | 04/01/2008 |
| 7350446 | Wafer dividing apparatus A wafer dividing apparatus for dividing along dividing lines a wafer whose strength is reduced, along the dividing lines, comprising a tape holding means for holding a protective tape affixed to one surface side of the wafer; and a wafer dividing means comprising a ... | 04/01/2008 |
| 7342296 | Wafer street buffer layer The present invention provides a separating process of a semiconductor device package of wafer level package. The method comprises a step of etching a substrate to form recesses. Then a buffer layer is formed on the first surface of the substrate, wherein the buffer... | 03/11/2008 |
| 7335605 | Protective tape applying and separating method In a protective tape applying and separating method according to this invention, a protective tape applied by a tape applying mechanism to a surface of a wafer suction-supported by a chuck table is cut to a wafer configuration by a cutter unit. Subsequently, a prote... | 02/26/2008 |
| 7335577 | Crack stop for low K dielectrics A crack stop for low K dielectric materials of an integrated circuit (IC) formed on an IC chip using metal interconnects which do not form a self-passivating oxide layer, such as copper or silver interconnects, in a low-K dielectric material to prevent damage to the... | 02/26/2008 |
| 7335517 | Multichip semiconductor device, chip therefor and method of formation thereof A multichip semiconductor device is disclosed in which chips are stacked each of which comprises a semiconductor substrate formed on top with circuit components and an interlayer insulating film formed on the top of the semiconductor substrate. At least one of the c... | 02/26/2008 |
| 7314779 | Semiconductor device, manufacturing method for semiconductor device and mounting method for the same A semiconductor device in accordance with the present invention reduces cracks occurring in a junction between a semiconductor device and a mounting substrate due to a heat stress when the semiconductor device is mounted on a printed circuit board or the like. The s... | 01/01/2008 |
| 7314377 | Electrical power connector A pair of mating connectors includes a receptacle having an insulative housing and at least one conductive receptacle contact with a pair of spaced walls forming a plug contact receiving space. The plug connector has an insulative housing and at least one conductive... | 01/01/2008 |
| 7312125 | Fully depleted strained semiconductor on insulator transistor and method of making the same An integrated circuit includes multiple layers. A semiconductor-on-insulator (SOI) wafer can be used to house transistors. Two substrates or wafers can be bonded to form the multiple layers. A strained semiconductor layer can be between a silicon germanium layer and... | 12/25/2007 |
| 7309242 | Power connector A pair of mating connectors includes a receptacle having an insulative housing and at least one conductive receptacle contact with a pair of spaced walls forming a plug contact receiving space. The plug connector has an insulative housing and at least one conductive... | 12/18/2007 |
| 7288467 | Wafer processing method To divide into individual devices efficiently in dicing a wafer without causing quality of the devices to lower, a wafer processing method includes steps of coating a rear surface of the wafer with a resist film, exposing and sensitizing portions of the resist film ... | 10/30/2007 |
| 7285495 | Methods for thermally treating a semiconductor layer A method for thermally treating a semiconductor layer is described. An embodiment of the technique includes implanting atomic species into a first surface of a donor wafer to form a zone of weakness at a predetermined depth that defines the thickness of a transfer l... | 10/23/2007 |
| 7282449 | Thermal treatment of a semiconductor layer A method for thermally treating a silicon germanium semiconductor layer from a donor wafer is described. An embodiment of the technique includes co-implanting atomic species into a first surface of the donor wafer to form a zone of weakness at a predetermined depth ... | 10/16/2007 |
| 7279404 | Process for fabricating strained layers of silicon or of a silicon/germanium alloy A process for fabricating a strained layer of silicon or of a silicon/germanium alloy, includes: a) the formation of a layer (2) of silicon or of a silicon/germanium alloy on a layer (1) of a material having a modifiable lattice parameter; and | 10/09/2007 |
| 7273768 | Wafer-level package and IC module assembly method for the wafer-level package A wafer-level package and an IC module assembly method for a wafer-level package are provided in the present invention. The method comprises forming a metal bump on a wafer, applying a high polymer resin coating to the wafer, grinding a surface of the resin coating,... | 09/25/2007 |
| 7265032 | Protective layer during scribing A method including forming a chemically soluble coating on a plurality exposed contacts on a surface of a circuit substrate; scribing the surface of the substrate along scribe areas; and after scribing, removing a portion of the coating. A method including forming a... | 09/04/2007 |
| 7262610 | Method for manufacturing and testing semiconductor devices on a resin-coated wafer A semiconductor device test apparatus according to the present invention includes a circuit board 103 and a film 105. A plurality of electrodes 103c are formed at the circuit board 103 at positions that face opposite a plurality of... | 08/28/2007 |
| 7256473 | Composite structure with high heat dissipation A composite structure is disclosed that includes a support wafer and a layered structure on the support wafer. The layered structure includes at least one layer of a monocrystalline material and at least one layer of a dielectric material. In addition, the layered s... | 08/14/2007 |
| 7256101 | Methods for preparing a semiconductor assembly Methods for preparing a semiconductor assembly are disclosed. In an implementation, the technique includes providing a support substrate and a bonding surface thereon, providing a donor substrate having a weakened zone that defines a useful layer and a bonding surfa... | 08/14/2007 |
| 7256106 | Method of dividing a substrate into a plurality of individual chip parts The present invention relates to a method for dividing a substrate into a number of individual chip parts, comprising the steps of: forming a number of chip parts in the substrate, comprising, for each chip part, of arranging recesses in the substrate for containing... | 08/14/2007 |
| 7256075 | Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer The invention relates to a method of transferring useful layers from a donor wafer which includes a multi-layer structure on the surface of the donor wafer that has a thickness sufficient to form multiple useful layers for subsequent detachment. The layers may be fo... | 08/14/2007 |
| 7253520 | CSP semiconductor device having signal and radiation bump groups A semiconductor device comprises a semiconductor chip which has a first surface, a pad which is formed directly on the first surface, an oxide film which is formed on the first surface, an insulating film which is formed on the oxide film and a part of the pad, a co... | 08/07/2007 |
| 7250352 | Methods for manufacturing a hybrid integrated circuit device In preferred embodiments, a method of manufacturing a hybrid integrated circuit device is provided, in which a plurality of circuit substrates 10 are manufactured from a single metal substrate 10A′ by dicing. In some embodiments, the method includes:... | 07/31/2007 |
| 7250330 | Method of making an electronic package A method of making an electronic package is described, wherein a substrate is provided with a pattern of conductive pads and a portion of solder positioned on selected ones of the pattern of copper pads. The solder is then reflowed to form partial hemispherically sh... | 07/31/2007 |
