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| Number | Title | Issue Date |
| 8119502 | Method for packaging components The invention relates to a method for the manufacture of packaged components. The invention is based here on the problem of facilitating the application of covers with lateral dimensions that are smaller than the lateral dimensions of the functional substrate. For t... | 02/21/2012 |
| 8097526 | Accessing or interconnecting integrated circuits Multiple integrated circuits (ICs) die, from different wafers, can be picked-and-placed, front-side planarized using a vacuum applied to a planarizing disk, and attached to each other or a substrate. The streets between the IC die can be filled, and certain techniqu... | 01/17/2012 |
| 8084335 | Method of thinning a semiconductor wafer using a film frame A method for manufacturing a thin semiconductor wafer. A semiconductor wafer is thinned from its backside followed by the formation of a cavity in a central region of the backside of the semiconductor wafer. Forming the cavity also forms a ring support structure in ... | 12/27/2011 |
| 8076216 | Methods and apparatus for thinning, testing and singulating a semiconductor wafer A wafer translator is provided with a patterned layer of wafer bonding thermoset plastic and is removably attached with a wafer so as to form a wafer/wafer translator pair. The wafer translator acts as a mechanical support during a thinning process as well as during... | 12/13/2011 |
| 8071465 | Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device A method for producing a semiconductor chip with an adhesive film, which includes: preparing a laminate in which a semiconductor wafer, an adhesive film and a dicing tape are laminated in that order, the adhesive film having a thickness in the range of 1 to 15 μm a... | 12/06/2011 |
| 8058152 | Method for manufacturing integrated circuit A method for separating an integrated circuit formed by a thin film having a novel structure or a method for transferring the integrated circuit to another substrate, that is, so-called transposing method, has not been proposed. According to the present invention, i... | 11/15/2011 |
| 8048781 | Methods and systems for packaging integrated circuits Methods of packaging integrated circuits are described. One method relates to attaching a singulated device wafer to a substrate. The singulated device wafer includes a multiplicity of integrated circuit dice arranged in a first configuration. The method also involv... | 11/01/2011 |
| 8003496 | Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die A semiconductor device is made by forming a heat spreader over a temporary carrier. A semiconductor die is mounted to the heat spreader. A first polymer layer is formed over the semiconductor die and heat spreader. A first conductive layer is formed over the first p... | 08/23/2011 |
| 7994026 | Plasma dicing apparatus and method of manufacturing semiconductor chips A plasma dicing apparatus in which a semiconductor wafer with a protective sheet stuck thereonto covering the entire circuit-forming surface and with an etching-resistant mask member stuck on the back surface opposite to the circuit-forming surface is mounted on a m... | 08/09/2011 |
| 7985663 | Method for manufacturing a semiconductor device A resin layer made of thermoplastic resin is formed on a supporting substrate, and then, an insulating layer is formed on the first resin layer. Then, an interlayer connector is formed through the insulating layer and then, a wiring layer is formed on the first resi... | 07/26/2011 |
| 7985662 | Method for manufacturing dies formed with a dielectric layer A method of manufacturing dies formed with a dielectric layer is revealed. A liquid dielectric layer is formed on the dicing tape. The liquid dielectric layer is heated to be sticky. Then, a wafer is attached to the dielectric layer on the dicing tape. The wafer is ... | 07/26/2011 |
| 7977215 | Method of processing optical device wafer A method of dividing an optical device wafer includes: a laser beam processing step of performing laser beam processing to provide an optical device wafer with breakage starting points along streets on the face side of the optical device wafer; a protective plate bo... | 07/12/2011 |
| 7955953 | Method of forming stacked die package A method of packaging semiconductor integrated circuits, including the steps of providing a transfer film and forming a patterned, conductive layer on a surface of the transfer film. A first semiconductor integrated circuit (IC) then is attached to the transfer film... | 06/07/2011 |
| 7955954 | Method of making semiconductor devices employing first and second carriers A semiconductor device and method. One embodiment provides an integral array of first carriers and an integral array of second carries connected to the integral array of first carriers. First semiconductor chips are arranged on the integral array of first carriers. ... | 06/07/2011 |
| 7939430 | Laser processing method A laser processing method is provided, which, when cutting an object to be processed comprising a substrate and a multilayer part, formed on a front face of the substrate, including a functional device, can cut the multilayer part with a high precision in particular... | 05/10/2011 |
| 7932165 | Method of making a semiconductor chip assembly with a laterally aligned filler and insulative base A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a filler, wherein the routing line contacts the bumped terminal and the filler, then mechanically attaching a semiconductor chip to the metal base... | 04/26/2011 |
| 7910460 | Metallic electrode forming method and semiconductor device having metallic electrode A metallic electrode forming method includes: forming a bed electrode on a substrate; forming a protective film with an opening on the bed electrode to expose the bed electrode from the opening; forming a metallic film covering the protective film and the opening; m... | 03/22/2011 |
| 7892950 | Methodology for processing a panel during semiconductor device fabrication A method (20, 104) for processing a panel (26, 128) during semiconductor device (52) fabrication entails forming grooves (72, 142) in a surface (34, 132) of the panel (26, 128) coincident with a dicing pattern (54) fo... | 02/22/2011 |
| 7888239 | Semiconductor device manufacturing method In a semiconductor device manufacturing method in which a wafer formed with devices in a plurality of areas sectioned by a plurality of streets formed in a lattice-like pattern on the front surface is divided into the individual devices along the streets, when the w... | 02/15/2011 |
| 7883993 | Semiconductor device with semiconductor chip and rewiring layer and method for producing the same The invention relates to a semiconductor device with a semiconductor chip and a rewiring layer, the semiconductor chip being embedded in a housing plastics composition by its rear side contact. The active top side of the semiconductor chip forms a coplanar overall t... | 02/08/2011 |
| 7883994 | Process for the transfer of a thin film A process for transferring a thin film includes forming a layer of inclusions to create traps for gaseous compounds. The inclusions can be in the form of one or more implanted regions that function as confinement layers configured to trap implanted species. Further,... | 02/08/2011 |
| 7879691 | Low cost die placement Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, using a release member having a phase change material. Specifically, IC elements/components can be selectively received, stored, inspected, re... | 02/01/2011 |
| 7863161 | Method of cutting a wafer In a method of cutting a wafer, a supporting member is attached to an upper surface of the wafer on which semiconductor chips are formed. An opening is formed at a lower surface of the wafer along a scribe lane of the wafer. The lower surface of the wafer may be pla... | 01/04/2011 |
| 7858499 | Dicing tape and die attach adhesive with patterned backing Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device f... | 12/28/2010 |
| 7851335 | Adhesive composition, adhesive sheet and production method of semiconductor device The object of the present invention is to provide an adhesive composition that enables to produce conforming products with a high manufacturing yield and without breaking or chipping of the chips in the picking-up step and that enables to stably connect a wire witho... | 12/14/2010 |
| 7851333 | Apparatus comprising a device and method for producing it An apparatus comprises a device layer structure, a device integrated into the device layer structure, an insulating carrier substrate and an insulating layer being continuously positioned between the device layer structure and the insulating carrier substrate, the i... | 12/14/2010 |
| 7851334 | Apparatus and method for producing semiconductor modules An apparatus and method for producing semiconductor modules is disclosed. One embodiment provides for bonding at least one semiconductor die onto a carrier including a support film strip, the support film having applied an adhesive layer to one of its surfaces to at... | 12/14/2010 |
| 7829441 | Thermosetting die-bonding film A thermosetting die-bonding film having excellent adhesion to an adherent and preferable pickup properties and a dicing die-bonding film having the thermosetting die-bonding film are provided. The thermosetting die-bonding film of the present invention is a thermose... | 11/09/2010 |
| 7829440 | Method of separating semiconductor dies A method for the separation of multiple dies during semiconductor fabrication is described. On an upper surface of a semiconductor wafer containing multiple dies, a seed metal layer may be used to grow hard metal layers above it for handling. Metal may be plated abo... | 11/09/2010 |
| 7825010 | Die singulation methods Some embodiments include methods in which a front side region of a semiconductor substrate is placed against a surface. While the front side region is against the surface, the semiconductor substrate is thinned, and then cut into a plurality of dice. The surface may... | 11/02/2010 |
| 7820529 | Method for manufacturing integrated circuit A method for separating an integrated circuit formed by a thin film having a novel structure or a method for transferring the integrated circuit to another substrate, that is, so-called transposing method, has not been proposed. According to the present invention, i... | 10/26/2010 |
| 7759224 | Fabrication method of semiconductor integrated circuit device A technique capable of stably releasing chips from a dicing tape, includes grinding a back surface of a semiconductor wafer, while adhering a pressure sensitive adhesive tape to a circuit forming surface of the semiconductor wafer formed with an integrated circuit, ... | 07/20/2010 |
| 7737003 | Method and structure for optimizing yield of 3-D chip manufacture The process begins with separate device wafers having complimentary chips. Thin metal capture pads, having a preferred thickness of about 10 microns so that substantial pressure may be applied during processing without damaging capture pads, are deposited on both de... | 06/15/2010 |
| 7727862 | Semiconductor device including semiconductor constituent and manufacturing method thereof A semiconductor device includes a semiconductor constituent having a semiconductor substrate and a plurality of electrodes for external connection provided under the semiconductor substrate. An under-layer insulating film is provided under and around the semiconduct... | 06/01/2010 |
| 7723213 | Manufacturing method of semiconductor chips and semiconductor device having the semiconductor chips A method for manufacturing a semiconductor chip having through electrodes includes forming, in a semiconductor wafer, a plurality of electrode forming holes for forming through electrodes, superimposing bump forming masks formed with a plurality of bump holes over t... | 05/25/2010 |
| 7713846 | Process applied to semiconductor A process applied to grinding, dicing, and/or stacking semiconductors is disclosed. One of its features is that after transparent material is stuck on its active surface, a semiconductor is ground from another surface thereof to become thinner, then take advantage o... | 05/11/2010 |
| 7700458 | Integrated circuit package system employing wafer level chip scale packaging An integrated circuit package system that includes: providing a substrate with a protective coating; attaching a labeling film to a support member in a separate process; joining the protective coating and the labeling film; and dicing the substrate, the protective c... | 04/20/2010 |
| 7691727 | Method for manufacturing an integrated circuit with fully depleted and partially depleted transistors A method for manufacturing an integrated circuit containing fully and partially depleted MOS transistors, including the steps of forming similar MOS transistors on a thin silicon layer formed on a silicon-germanium layer resting on a silicon substrate; attaching the... | 04/06/2010 |
| 7666760 | Method of dividing wafer A method of dividing a wafer includes: a denatured layer forming step of forming a denatured layer in the inside of the wafer along streets; a first feeding step in which the whole area of the wafer's back-side surface is suction held, and the wafer is mounted on a ... | 02/23/2010 |
| 7651925 | Vacuum expansion of integrated circuits at sort A frame and vacuum expansion chuck are used in combination for stretching a tape carrying a plurality of singulated devices to facilitate removal of the devices with reduced risk of contact between a device being removed from the tape and an adjacent device on the t... | 01/26/2010 |
