Did You Know...
...that power steering was invented by independent inventor Francis W. Davis? As chief engineer in the 1920s of the truck division of the Pierce Arrow Motor Car Company, he saw how hard it was to steer heavy vehicles. So that he would be able to keep the profits from his future invention, Davis left his job, rented a small engineering shop in Waltham, Mass., and developed a hydraulic power steering system that led to power steering.
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| Number | Title | Issue Date |
| 7820528 | Method of forming a leaded molded array package In one embodiment, a method for forming a leaded molded array package includes placing a lead frame assembly into a molding apparatus having lead cavities. The method further includes forming seals between conductive leads within the lead frame assembly and the lead... | 10/26/2010 |
| 7713843 | Method for fabricating optical semiconductor device In the method of fabricating an optical semiconductor device, a semiconductor layer is formed on an InP region, and includes semiconductor films. A first etching mask is formed on the semiconductor layer. The semiconductor layer is etched through the first etching m... | 05/11/2010 |
| 7588999 | Method of forming a leaded molded array package In one embodiment, a method for forming a leaded molded array package includes placing a lead frame assembly into a molding apparatus having lead cavities. The method further includes forming seals between conductive leads within the lead frame assembly and the lead... | 09/15/2009 |
| 7459376 | Dissociated fabrication of packages and chips of integrated circuits A method of fabricating a semiconductor component includes providing a prefabricated frame that includes metal traces and lead-through contacts. A semiconductor chip is mounted into the prefabricated frame such that the semiconductor chip is embedded within a rim of... | 12/02/2008 |
| 7416963 | Manufacturing method of semiconductor device This invention offers a manufacturing method to reduce a manufacturing cost of a semiconductor device having a through-hole electrode by simplifying a manufacturing process and to enhance yield of the semiconductor device. A first insulation film is formed on a top ... | 08/26/2008 |
| 7399683 | Manufacturing method of semiconductor device A manufacturing method of a semiconductor device of this invention includes forming metal pads on a Si substrate through a first oxide film, bonding the Si substrate and a holding substrate which bolsters the Si substrate through a bonding film, forming an opening b... | 07/15/2008 |
| 7371663 | Three dimensional IC device and alignment methods of IC device substrates Alignment methods of IC device substrates. A first IC device substrate has a first front side for defining a plurality of first IC features, a first backside opposite the first front side, and a first alignment pattern formed on the first front side or the first bac... | 05/13/2008 |
| 7351641 | Structure and method of forming capped chips As disclosed herein, structures and methods are provided for forming capped chips. As provided by the disclosed method, a metal base pattern is formed on a chip insulated from wiring of the chip, and a cap is formed including a metal. The cap is joined to the metal ... | 04/01/2008 |
| 7335517 | Multichip semiconductor device, chip therefor and method of formation thereof A multichip semiconductor device is disclosed in which chips are stacked each of which comprises a semiconductor substrate formed on top with circuit components and an interlayer insulating film formed on the top of the semiconductor substrate. At least one of the c... | 02/26/2008 |
| 7329943 | Microelectronic devices and methods for forming interconnects in microelectronic devices Microelectronic devices, methods for packaging microelectronic devices, and methods for forming interconnects in microelectronic devices are disclosed herein. In one embodiment, a method comprises providing a microelectronic substrate having a front side and a backs... | 02/12/2008 |
| 7316940 | Chip dicing A semiconductor structure and method for chip dicing. The method includes (a) providing a semiconductor substrate and (b) forming first and second device regions in and at top of the substrate. The first and second device regions are separated by a semiconductor bor... | 01/08/2008 |
| 7316939 | Semiconductor device manufacturing method and manufacturing apparatus A method for manufacturing a semiconductor device is provided including: providing a reinforcing member on one surface of a wiring substrate that has a first region where a semiconductor chip is mounted and a second region around the first region, and has terminals ... | 01/08/2008 |
| 7285479 | Semiconductor device and method for manufacturing multilayered substrate for semiconductor device A method for manufacturing a multilayered substrate for a semiconductor device, as well as a semiconductor device, is provided, the multilayered substrate exhibiting an excellent thermal conduction property and an excellent heat spreading effect without occurrence o... | 10/23/2007 |
| 7256106 | Method of dividing a substrate into a plurality of individual chip parts The present invention relates to a method for dividing a substrate into a number of individual chip parts, comprising the steps of: forming a number of chip parts in the substrate, comprising, for each chip part, of arranging recesses in the substrate for containing... | 08/14/2007 |
| 7235463 | Method for fabricating an electrical insulator An electrode insulator and method for fabricating the same, wherein a T-shape electrode insulator made of inorganic dielectric material is fabricated perpendicular to the first electrode formed on the substrate, and insulating the second electrode from the first ele... | 06/26/2007 |
| 7232741 | Wafer dividing method A method of dividing a wafer along predetermined dividing lines, comprising the steps of a deteriorated layer forming step for applying a pulse laser beam capable of passing through the wafer along the dividing lines to form deteriorated layers in the inside of the ... | 06/19/2007 |
| 7232754 | Microelectronic devices and methods for forming interconnects in microelectronic devices Microelectronic devices, methods for packaging microelectronic devices, and methods for forming interconnects in microelectronic devices are disclosed herein. In one embodiment, a method comprises providing a microelectronic substrate having a front side and a backs... | 06/19/2007 |
| 7211471 | Exposed lead QFP package fabricated through the use of a partial saw process A QFP exposed pad package which includes leads exposed within the bottom surface of the package body of the package in addition to those gull-wing leads protruding from the sides of the package body. Those leads exposed within the bottom surface of the package body ... | 05/01/2007 |
| 7198969 | Semiconductor chip assemblies, methods of making same and components for same Semiconductor chip assemblies incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals on the sheet-like element are movable with respect to the chip, so as to compensa... | 04/03/2007 |
| 7156159 | Multi-level microchannel heat exchangers An apparatus and method of circulating a heat-absorbing material within a heat exchanger. The apparatus comprises a manifold layer coupled to an interface layer. The manifold layer comprises an inlet manifold and an outlet manifold. The interface layer comprises a p... | 01/02/2007 |
| 7141443 | Semiconductor wafer dividing method utilizing laser beam A method which can divide a semiconductor wafer sufficiently precisely along a street by use of a laser beam, while fully avoiding or suppressing contamination of circuits formed in rectangular regions on the face of the semiconductor water, and without causing chip... | 11/28/2006 |
| 7127811 | Methods of fabricating and using shaped springs A method of fabricating and using an interconnection element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a shape of the... | 10/31/2006 |
| 7125744 | High-frequency module and method for manufacturing the same In the high-frequency module of the present invention, an insulating resin is formed so as to seal a high-frequency semiconductor element mounted on a surface of a substrate and further to seal electronic components. Furthermore, a metal thin film is formed on the s... | 10/24/2006 |
| 7118935 | Bump style MEMS switch A microelectromechanical system switch may be formed with a protrusion defined on the substrate which makes contact with a deflectable member arranged over the substrate. The deflectable member may, for example, be a cantilevered arm or a deflectable beam. The protr... | 10/10/2006 |
| 7112470 | Chip dicing A semiconductor structure and method for chip dicing. The method comprises the steps of (a) providing a semiconductor substrate; (b) forming first and second device regions of first and second chips, respectively, in and at top of the semiconductor substrate, wherei... | 09/26/2006 |
| 7094677 | Method of forming a penetration electrode and substrate having a penetration electrode A method of forming a penetration electrode in which an electroconductive substance is inserted into a micropore that has one end blocked off only by wiring and a pad formed by an electroconductive substance without the wiring and pad being broken. In this method of... | 08/22/2006 |
| 7087501 | Manufacture of probe unit having lead probes extending beyond edge of substrate A sacrificial layer is formed in a recess of a substrate, and leads extending from the substrate into an area of the sacrificial layer are formed. A cut is formed from the bottom surface of the substrate, the cut extending from the bottom surface to the area of the ... | 08/08/2006 |
| 7087462 | Method for forming leadless semiconductor packages The present invention includes providing a leadframe including a metal layer formed on an upper surface of the leadframe and a plurality of units in an array arrangement, in which each unit includes a die pad, a plurality of leads, and a plurality of outer dambars, ... | 08/08/2006 |
| 7074710 | Method of wafer patterning for reducing edge exclusion zone A method includes steps of: (a) providing a wafer on which a film has been deposited; (b) exposing an annular area in an edge exclusion zone of the wafer to radiation having a wavelength suitable for patterning the film in the annular area; and (c) modulating the ra... | 07/11/2006 |
| 7071031 | Three-dimensional integrated CMOS-MEMS device and process for making the same A vertically integrated structure includes a micro-electromechanical system (MEMS) and a chip for delivering signals to the MEMS. The structure includes a metal stud connecting a surface of the chip and the MEMS; the MEMS has an anchor portion having a conducting pa... | 07/04/2006 |
| 7071028 | Semiconductor device and its manufacturing method A semiconductor device in which a semiconductor chip (3) is mounted on a substrate (2), comprising a substrate having electrodes (7, 8) for substrate-to-substrate connection disposed on both sides of the substrate and connected via a through hol... | 07/04/2006 |
| 6973722 | Release height adjustment of stressy metal devices by annealing before and after release Spring structures are subjected to pre-release and post-release annealing to tune their tip height to match a specified target. Post-release annealing increases tip height, and pre-release annealing decreases tip height. The amount of tuning is related to the anneal... | 12/13/2005 |
| 6972243 | Fabrication of semiconductor dies with micro-pins and structures produced therewith A method for forming a semiconductor die, comprising forming a trench in a surface of the die; filing the trench with a sacrificial material; patterning the die to form a series of channels extending substantially perpendicularly to the trench; depositing a conducti... | 12/06/2005 |
| 6965158 | Multi-layer substrates and fabrication processes Multi-layer components such as circuit panels are fabricated by connecting conductive features such as traces one two or more superposed substrates using leads extending through an intermediate dielectric layer. The leads can be closely spaced to provide a high dens... | 11/15/2005 |
| 6906422 | Microelectronic elements with deformable leads An element such as a semiconductor wafer or other body is provided with flexible leads, the tip ends of which project over the front surface of the element. The tips of the flexible leads are spaced apart from the front surface and are independently moveable with re... | 06/14/2005 |
| 6900110 | Chip scale package with compliant leads A wafer level fabricated chip scale integrated circuit package having an air gap formed between the integrated circuit die of the package and compliant leads located over and conductively attached to the die is described. Contact bumps offset on the compliant leads ... | 05/31/2005 |
| 6897127 | Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument A wiring pattern is formed over a semiconductor wafer, and an external terminal is formed on the wiring pattern. The wiring pattern extends from a pad which is part of an interconnect to an integrated circuit formed in the semiconductor wafer. A non-resin layer of a... | 05/24/2005 |
| 6897571 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions A semiconductor wafer saw and method of using the same for dicing semiconductor wafers including a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a ... | 05/24/2005 |
| 6852608 | Production method for semiconductor chip A semiconductor wafer is applied to a support disk via an intervening adhesive layer with the front side of the semiconductor wafer facing the adhesive layer, which is sensitive to a certain exterior factor for reducing its adhesive force; the semiconductor wafer is... | 02/08/2005 |
| 6846696 | Method for manufacturing solar battery The invention is aimed to prevent that fall of characteristic of a solar battery and producing yield caused by particles of powder condition generating from working part at laser beam process in the method producing the solar battery by laser beam process. The const... | 01/25/2005 |
