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| Number | Title | Issue Date |
| 8178420 | Dicing/die-bonding film, method of fixing chipped work and semiconductor device A dicing/die-bonding film including a pressure-sensitive adhesive layer (2) on a supporting base material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein a releasability in an interface betwe... | 05/15/2012 |
| 8173522 | Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer A process and an apparatus are described for the treatment of wafers, in particular for the thinning of wafers. A wafer with a carrier layer and an interlayer arranged between the carrier layer and the wafer is also described, in which the interlayer is a plasmapoly... | 05/08/2012 |
| 8153510 | Semiconductor bond pad patterns and method of formation In a semiconductor wafer, the polyimide film underneath a power metal structure is partially etched to create corresponding surface depressions of the conformal top power metal. The depressions at the surface of power metal are visible under optical microscopy. Arra... | 04/10/2012 |
| 8129258 | Method for dicing a semiconductor wafer, a chip diced from a semiconductor wafer, and an array of chips diced from a semiconductor wafer A method for dicing a semiconductor wafer, including: cutting a reference slot in a back main surface of the wafer; cutting a back slot in the back main surface, the back slot positioned with respect to the reference slot; determining a desired location for a chip e... | 03/06/2012 |
| 8124499 | Method and structure for thick layer transfer using a linear accelerator Free standing thickness of materials are fabricated using one or more semiconductor substrates, e.g., single crystal silicon, polysilicon, silicon germanium, germanium, group III/IV materials, and others. A semiconductor substrate is provided having a surface region... | 02/28/2012 |
| 8114758 | Method for avoiding die cracking Methods directed to avoiding die cracking resulting from die separation are described herein. A method may include providing a substrate including a first die, a second die, and a monitor structure in an area between the first die and the second die, the monitor str... | 02/14/2012 |
| 8097524 | Lightly doped silicon carbide wafer and use thereof in high power devices A method for manufacturing a silicon carbide single crystal. A silicon carbide single crystal is grown. The crystal has a boron concentration less than 5×1014 cm−3, and a concentration of transition metals impurities less than 5×1014 | 01/17/2012 |
| 8084333 | Object cutting method An object cutting method which can reliably remove particles remaining on cut sections of chips is provided. An expandable tape 23 is electrically charged in a state where a plurality of semiconductor chips 25 obtained by cutting a planar object to be ... | 12/27/2011 |
| 8067296 | Method of manufacturing semiconductor device The present invention provides a method of manufacturing a semiconductor device in which a thinned substrate of a semiconductor or semiconductor device is handled without cracks in the substrate and treated with heat to improve a contact between semiconductor back s... | 11/29/2011 |
| 8067295 | Manufacturing method of solar cell module, and solar cell and solar cell module A double-side light receiving solar cell in a planer regular hexagon shape and having first electrodes on both surfaces are divided into four pieces by a line A-A′ connecting two opposing apexes and by a line B-B′ perpendicular to the line A-A′ and connecting ... | 11/29/2011 |
| 8062959 | Method of manufacturing semiconductor element A step of forming a first auxiliary groove in a semiconductor element structure provided on a semiconductor substrate, a step of forming a second auxiliary groove in the semiconductor element structure, and a step of dividing the semiconductor substrate and the semi... | 11/22/2011 |
| 8058151 | Methods of die sawing A structure includes a substrate having a plurality of scribe line areas surrounding a plurality of die areas. Each of the die areas includes at least one first conductive structure formed over the substrate. Each of the scribe line areas includes at least one activ... | 11/15/2011 |
| 8058150 | Particle free wafer separation A method for singulating semiconductor wafers is disclosed. A preferred embodiment comprises forming scrub lines on one side of the wafer and filling the scrub lines with a temporary fill material. The wafer is then thinned by removing material from the opposite sid... | 11/15/2011 |
| 8048777 | Method for manufacturing semiconductor device An object is to suppress discharge due to static electricity generated by peeling, when an element formation layer including a semiconductor element is peeled from a substrate. Over the substrate, the release layer and the element formation layer are formed. The sup... | 11/01/2011 |
| 8043940 | Method for manufacturing semiconductor chip and semiconductor device An improved yield of chips is realized by reducing the width of dicing streets on the front surface side of a semiconductor wafer. A method for semiconductor chip, divided a semiconductor wafer 10 having a plurality of circuit patterns formed on one surface | 10/25/2011 |
| 8039363 | Small chips with fan-out leads A method of expanding the contact pitch for un-diced chips in an array by pre-slicing the array in a first direction, attaching a lead frame to the chips' contacts, and then slicing the array and attached lead frame in the second direction. The lead frame has leads ... | 10/18/2011 |
| 8039364 | Manufacturing method of semiconductor device An adhesive layer of which thickness is over 25 μm and a dicing tape are laminated on a rear surface of a semiconductor wafer. The semiconductor wafer is cut together with a part of the adhesive layer by using a first blade of which cutting depth reaches the adhesi... | 10/18/2011 |
| 8030179 | Semiconductor device and method of manufacturing the same The present invention provides a semiconductor device that includes: stacked semiconductor chips, each semiconductor chip including a semiconductor substrate and a first insulating layer that is provided on side faces of the semiconductor substrate and has concaviti... | 10/04/2011 |
| 8021964 | Method of producing segmented chips To provide a method of producing segmented chips preventing the chips from being damaged by the chip jumping or by the contact of the neighboring chips while the back surfaces thereof are being ground. A method of producing segmented chips by grinding the back surfa... | 09/20/2011 |
| 8017501 | Semiconductor package having through-hole vias on saw streets formed with partial saw A method of forming through-hole vias in a semiconductor wafer involves forming a semiconductor wafer having a plurality of die with contact pads disposed on a surface of each die. The semiconductor wafer has a saw street between each die. A trench is cut in the saw... | 09/13/2011 |
| 8012856 | Method of producing semiconductor components A method is provided for producing a semiconductor component (1) comprising at least one semiconductor body (2) and one connection carrier region (5). A semiconductor layer sequence (20) with an active region (23) intended for gene... | 09/06/2011 |
| 8003495 | Manufacturing method for semiconductor integrated device In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo... | 08/23/2011 |
| 7998837 | Method for fabricating semiconductor device using spacer patterning technique A method for fabricating a semiconductor device using optical proximity correction to form high integrated cell patterns that are less prone to bridge defects. The method includes: obtaining a target layout of cell patterns, which form rows in a cell region, and per... | 08/16/2011 |
| 7998838 | Method and apparatus for scribing a line in a thin film using a series of laser pulses A series of laser pulses in a pulse train, each pulse with a predetermined temporal power shape, scribes a line in a thin film of material on a substrate. The predetermined temporal pulse shape has a fast risetime and fast falltime and a pulse length between 10% pow... | 08/16/2011 |
| 7994025 | Wafer processing method without occurrence of damage to device area A wafer processing method of processing a wafer having on a front surface a device area where a plurality of devices are formed by being sectioned by predetermined dividing lines, and an outer circumferential redundant area surrounding the device area, includes the ... | 08/09/2011 |
| 7994024 | Object cutting method An object cutting method which can reliably remove particles remaining on cut sections of chips is provided. An expandable tape 23 is electrically charged in a state where a plurality of semiconductor chips 25 obtained by cutting a planar object to be ... | 08/09/2011 |
| 7968430 | Compound semiconductor device and method for manufacturing same A compound semiconductor device includes a laminated body including a crystal substrate and a compound semiconductor multilayer film. The laminated body has a major surface, a first side face, a second side face, a third side face, and a fourth side face. The first ... | 06/28/2011 |
| 7947574 | Laser processing method and semiconductor chip A laser processing method is provided, which, even when a substrate formed with a laminate part including a plurality of functional devices is thick, can cut the substrate and laminate part with a high precision. This laser processing method irradiates a subs... | 05/24/2011 |
| 7943489 | Bonded wafer assembly system and method A system and method for the removal of superfluous material in a bonded wafer assembly. The method includes cutting a plurality of parallel cuts in a top wafer, the plurality of cuts defining a segment of the top wafer attached to another portion of the top wafer vi... | 05/17/2011 |
| 7923349 | Wafer level surface passivation of stackable integrated circuit chips An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sid... | 04/12/2011 |
| 7904855 | Methods for partially removing circuit patterns from a multi-project wafer Disclosed are a method and a system for partially removing circuit patterns from a multi-project wafer. This method and this system can be used to provide a multi-project-wafer to a user without disclosing proprietary circuit information of other customers. At least... | 03/08/2011 |
| 7863159 | Semiconductor die separation method According to the invention, die shift is reduced or substantially eliminated, by cutting the wafer in two stages. In some embodiments a first wafer cutting procedure is carried out prior to thinning the wafer to the prescribed die thickness; and in other embodiments... | 01/04/2011 |
| 7855130 | Corrosion inhibitor additives to prevent semiconductor device bond-pad corrosion during wafer dicing operations An improved method of dicing a semiconductor wafer which substantially reduces or eliminates corrosion of copper-containing, aluminum bonding pads. The method involves continuously contacting the bonding pads with deionized water and an effective amount of a copper ... | 12/21/2010 |
| 7842585 | Method to form a photovoltaic cell comprising a thin lamina A very thin photovoltaic cell is formed by implanting gas ions below the surface of a donor body such as a semiconductor wafer. Ion implantation defines a cleave plane, and a subsequent step exfoliates a thin lamina from the wafer at the cleave plane. A photovoltaic... | 11/30/2010 |
| 7838394 | Method of manufacturing semiconductor device A semiconductor substrate in a wafer state having one surface provided thereon a plurality of external connection electrodes is stacked onto a support film. The wafer-state semiconductor substrate stuck on the support film is cut into a plurality of chip size semico... | 11/23/2010 |
| 7833881 | Methods for fabricating semiconductor components and packaged semiconductor components Packaged semiconductor components and methods for manufacturing packaged semiconductor components. In one embodiment a semiconductor component comprises a die having a semiconductor substrate and an integrated circuit. The substrate has a first side, a second side, ... | 11/16/2010 |
| 7825008 | Method of fabricating light emitting device and thus-fabricated light emitting device Aiming at providing a method of fabricating a light emitting device having an AlGaInP light emitting section, less causative of crack by cleavage, on the edge portions on the back surface of the device chip in process of dicing or breaking, a light emitting device w... | 11/02/2010 |
| 7816235 | Semiconductor package and method for producing the same A semiconductor package includes a rewiring substrate and a semiconductor chip. The semiconductor chip includes: a first face with an active surface including integrated circuit devices and chip contact pads, a second face lying in a plane essentially parallel to th... | 10/19/2010 |
| 7799659 | Singulating semiconductor wafers to form semiconductor chips One aspect relates to a method for singulating semiconductor wafers to form semiconductor chips. A semiconductor wafer is provided with semiconductor chip positions arranged in rows and columns, rectilinear separating tracks being arranged between the positions. Cry... | 09/21/2010 |
| 7795115 | Method of manufacturing semiconductor device The invention is directed to enhancement of reliability and a yield of a semiconductor device by a method of manufacturing the semiconductor device with a supporting body without making the process complex. A second insulation film, a semiconductor substrate, a firs... | 09/14/2010 |
