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| Number | Title | Issue Date |
| 8148237 | Pressurized treatment of substrates to enhance cleaving process A method of cleaving a substrate is disclosed. A species, such as hydrogen or helium, is implanted into a substrate to form a layer of microbubbles. The substrate is then annealed a pressure greater than atmosphere. This annealing may be performed in the presence of... | 04/03/2012 |
| 8129257 | Vertical outgassing channels InP epitaxial material is directly bonded onto a Silicon-On-Insulator (SOI) wafer having Vertical Outgassing Channels (VOCs) between the bonding surface and the insulator (buried oxide, or BOX) layer. H2O and other molecules near the bonding surface migra... | 03/06/2012 |
| 8119498 | Wafer bonding method and wafer stack formed thereby A wafer bonding process that compensates for curvatures in wafer surfaces, and a wafer stack produced by the bonding process. The process entails forming a groove in a surface of a first wafer, depositing a bonding stack on a surface of a second wafer, aligning and ... | 02/21/2012 |
| 8084332 | Method of fabrication of AI/GE bonding in a wafer packaging environment and a product produced therefrom A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used ... | 12/27/2011 |
| 8058145 | Micro-electro-mechanical device and manufacturing method for the same It is an object of the present invention to provide a micro-electro-mechanical-device having a microstructure and a semiconductor element over one surface. In particular, it is an object of the present invention to provide a method for simplifying the process of for... | 11/15/2011 |
| 8058144 | Method for capping a MEMS wafer A method for capping a MEMS wafer to form a hermetically sealed device. The method includes applying a glass bonding agent to the cap wafer and burning off organic material in the glass bonding agent. The cap wafer/glass bonding agent combination is then cleaned to ... | 11/15/2011 |
| 8058143 | Substrate bonding with metal germanium silicon material A method that in one embodiment is useful in bonding a first substrate to a second substrate includes forming a layer including metal over the first substrate. The layer including metal in one embodiment surrounds a semiconductor device, which can be a micro electro... | 11/15/2011 |
| 8021961 | Process of fabricating microfluidic device chips and chips formed thereby A process for fabricating multiple microfluidic device chips. The process includes fabricating multiple micromachined tubes in a semiconductor device wafer. The tubes are fabricated so that each tube has an internal fluidic passage and an inlet and outlet thereto de... | 09/20/2011 |
| 8017498 | Multiple die structure and method of forming a connection between first and second dies in same A multiple die structure includes a first die (110), a second die (120), a carbon nanotube (130) having a first end (131) in physical contact with the first die and having a second end (132) in physical contact with the second die,... | 09/13/2011 |
| 7985659 | Semiconductor device with a controlled cavity and method of formation A method for forming a semiconductor device includes providing a first cap wafer having a first opening extending through the first cap wafer, and a second cap wafer bonded to the first cap wafer, wherein the second cap wafer has a second opening extending through t... | 07/26/2011 |
| 7977208 | Method and apparatus for packaging circuit devices A hermetically sealed package includes a lid (14) hermetically bonded to a wafer or substrate (12), with a chamber therebetween defined by a recess (16) in the lid. A circuit device (26) such as MEMS device is provided within the chamber ... | 07/12/2011 |
| 7972936 | Method of fabrication of heterogeneous integrated circuits and devices thereof A heterogeneous integrated circuit and method of making the same. An integrated circuit includes a surrogate substrate including a material selected from the group consisting of Group II, Group III, Group IV, Group V, and Group VI materials and their combinations; a... | 07/05/2011 |
| 7867874 | Method and apparatus for packaging circuit devices A hermetically sealed package includes a lid (14) hermetically bonded to a wafer or substrate (12), with a chamber therebetween defined by a recess (16) in the lid. A circuit device (26) such as MEMS device is provided within the chamber ... | 01/11/2011 |
| 7846815 | Eutectic flow containment in a semiconductor fabrication process A disclosed semiconductor fabrication process includes forming a first bonding structure on a first surface of a cap wafer, forming a second bonding structure on a first surface of a device wafer, and forming a device structure on the device wafer. One or more eutec... | 12/07/2010 |
| 7833880 | Process for manufacturing micromechanical devices containing a getter material and devices so manufactured A process is provided for manufacturing micromechanical devices formed by joining two parts together by direct bonding. One of the parts (12) is made of silicon and the other one is made of a material chosen between silicon and a semiconductor ceramic or oxid... | 11/16/2010 |
| 7807550 | Method of making MEMS wafers A wafer level package for a MEMS device is made by bonding a MEMS wafer and a lid wafer together to form a hermetically sealed cavity. One or more vias filled with conductive or semiconductive material is etched one of the wafers to form one or more rods extending t... | 10/05/2010 |
| 7799656 | Microchannels for BioMEMS devices A method is disclosed for making a MEMS device wherein anhydrous HF exposed silicon nitride is used as a temporary adhesion layer allowing the transfer of a layer from a Carrier Wafer to a Device Wafer. ... | 09/21/2010 |
| 7785987 | Isolating chip-to-chip contact An apparatus has two slabs of substrate material joined to each other, the two slabs including a pair of contacts joined to each other having a shape separating a first area from a second area. ... | 08/31/2010 |
| 7767544 | Semiconductor fabrication method and system Embodiments of the present invention are generally directed to a method for manufacturing a semiconductor device. In one embodiment, the method includes providing a substrate that includes a via or interconnect. In this embodiment, the method also includes forming a... | 08/03/2010 |
| 7767543 | Method for manufacturing a micro-electro-mechanical device with a folded substrate It is an object of the present invention to provide a micro-electro-mechanical-device having a microstructure and a semiconductor element over one surface. In particular, it is an object of the present invention to provide a method for simplifying the process of for... | 08/03/2010 |
| 7759218 | Indented lid for encapsulated devices and method of manufacture A method for providing improved gettering in a vacuum encapsulated device is described. The method includes forming a plurality of small indentation features in a device cavity formed in a lid wafer. The gettering material is then deposited over the indentation feat... | 07/20/2010 |
| 7732302 | Integrated sensor and circuitry and process therefor A micromachined sensor and a process for fabrication and vertical integration of a sensor and circuitry at wafer-level. The process entails processing a first wafer to incompletely define a sensing structure in a first surface thereof, processing a second wafer to d... | 06/08/2010 |
| 7723208 | Integrated re-combiner for electroosmotic pumps using porous frits Trenches may be formed in the upper surfaces of a pair of wafers. Each trench may be coated with a catalyst that is capable of removing oxygen or hydrogen from a fluid used for cooling in a system making use of the electroosmotic effect for pumping. Channels may be ... | 05/25/2010 |
| 7700457 | Method and zone for sealing between two microstructure substrates The invention concerns a sealing zone between two microstructure substrates. Said sealing zone comprises at least the following parts: on a first wafer level (20), a lower edging (22A) made of an adhesive material capable of causing the first substrate... | 04/20/2010 |
| 7696064 | Methods for forming a through via A through via is constructed in a two-stage process. A void in a portion of the depth of the substrate is filled from a first surface of the semiconductor substrate creating an enclosed volume within the substrate. Thereafter, the enclosed volume is exposed and the ... | 04/13/2010 |
| 7632739 | Fabrication of hybrid substrate with defect trapping zone A process for fabricating a hybrid substrate that has a defect trapping zone. The process includes the steps of forming or depositing a first insulator layer on a first substrate of semiconductor material; increasing roughness of the first insulator layer surface; d... | 12/15/2009 |
| 7625809 | Semiconductor device and method of manufacturing the same A semiconductor device includes a substrate, and a semiconductor thin film bonded to the substrate, wherein the semiconductor thin film includes a plurality of discrete operating regions and an element isolating region which isolates the plurality of discrete operat... | 12/01/2009 |
| 7605054 | Method of forming a device wafer with recyclable support A method for forming a device wafer with a recyclable support by providing a wafer having first and second surfaces, with at least the first surface of the wafer comprising a semiconductor material that is suitable for receiving or forming electronic devices thereon... | 10/20/2009 |
| 7563692 | Microelectromechanical system pressure sensor and method for making and using According to some embodiments, a conducting layer is formed on a first wafer. An insulating layer is formed on a second wafer. The insulating layer includes a cavity and a conducting area may be formed in the second wafer proximate to the cavity. The side of the con... | 07/21/2009 |
| 7510947 | Method for wafer level packaging and fabricating cap structures A cap wafer with patterned film formed thereon is etched through areas not covered by the patterned film to form a plurality of openings. Then, the cap wafer is bonded to a transparent wafer, and the cap wafer around the pattern film is segmented to form a plurality... | 03/31/2009 |
| 7439092 | Thin film splitting method A method of fabricating thin films of semiconductor materials by implanting ions in a substrate composed of at least two different elements at least one of which can form a gaseous phase on bonding with itself and/or with impurities includes the following steps: | 10/21/2008 |
| 7429495 | System and method of fabricating micro cavities A system and method for manufacturing micro cavities at the wafer level using a unique, innovative MEMS (MicroElectroMechanical Systems) process, wherein micro cavities are formed, with epoxy bonded single-crystalline silicon membrane as cap and deposited and/or ele... | 09/30/2008 |
| 7422928 | Process for fabricating a micro-electro-mechanical system with movable components A process for fabricating a micro-electro-mechanical system (MEMS) composed of fixed components fixedly supported on a lower substrate and movable components movably supported on the lower substrate. The process utilizes an upper substrate separate from the lower su... | 09/09/2008 |
| 7422962 | Method of singulating electronic devices A method of singulating electronic devices, including aligning a saw blade over a lid street disposed on a lid substrate that is disposed over a device substrate. An electronic device that includes a bond pad is disposed on the device substrate, wherein the lid stre... | 09/09/2008 |
| 7410828 | Method of creating a predefined internal pressure within a cavity of a semiconductor device A method of creating a predefined internal pressure within a cavity of a semiconductor device, the method including providing the semiconductor device, the semiconductor device including a semiconductor oxide area which is continuously arranged between the cavity of... | 08/12/2008 |
| 7410886 | Method for fabricating protective caps for protecting elements on a wafer surface A method of fabricating protective caps for protecting devices on wafer surface includes: (a) providing a non-metal cap substrate and forming a metal layer on the non-metal cap substrate; (b) forming a plurality of cavities on a surface of the metal layer, wherein t... | 08/12/2008 |
| 7402501 | Method of manufacturing a coaxial trace in a surrounding material, coaxial trace formed thereby, and semiconducting material containing same A method of manufacturing a coaxial trace (100) within a surrounding material (190) includes: providing a first substrate (191, 410) and a second substrate (192, 1010) composed of the surrounding material; forming a first portion (101,... | 07/22/2008 |
| 7402799 | MEMS mass spectrometer A MEMS mass spectrometer having metal walls connected between a lid and base, with the walls defining a plurality of interior chambers including sample gas input chambers, an ionizer chamber, a plurality of ion optics chambers and a ion separation chamber. A detecto... | 07/22/2008 |
| 7399652 | Method for manufacturing a micro-electro-mechanical device, in particular an optical microswitch, and micro-electro-mechanical device thus obtained A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top ... | 07/15/2008 |
| 7396740 | Method of producing a device with a movable portion A method of producing a device with a movable portion spaced apart from a support wafer comprises a step of providing the support wafer having a structured surface and a further step of providing a device wafer with a backing layer and a device layer disposed thereo... | 07/08/2008 |
