Quotables
"That the automobile has practically reached the limit of its development is suggested by the fact that during the past year no improvements of a radical nature have been introduced."
Scientific American ; Jan. 2 edition, 1909
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 5904486 | Method for performing a circuit edit through the back side of an integrated circuit die A method and an apparatus for performing circuit edits through the back side of a flip-chip packaged integrated circuit die. In one embodiment, a circuit edit is achieved by exposing first and second circuit edit connection targets through a semiconductor... | 05/18/1999 |
| 5897334 | Method for reproducing printed circuit boards for semiconductor packages including poor quality printed circuit board units and method for fabricating semiconductor packages using the reproduced printed circuit boards A method for reproducing a PCB strip for semiconductor packages, wherein a poor quality PCB unit included in the PCB strip is replaced with a normal quality one, thereby achieving a reduction in the amount of package materials used and an improvement in t... | 04/27/1999 |
| 5895230 | Integrated circuit chip package having configurable contacts and method for making the same An integrated circuit chip package having an electrical contact configurable for either signal or power/ground and a method for constructing the integrated circuit chip package are disclosed. The integrated circuit chip package includes a substrate for su... | 04/20/1999 |
| 5895222 | Encapsulant dam standoff for shell-enclosed die assemblies An electronic device includes at least one chip connected to a circuit board. The chip includes a die and an encapsulant which is applied in a liquid phase and dries to a solid phase. A shell may be positioned over the chip and in some embodiments of the ... | 04/20/1999 |
| 5888836 | Process for the repair of floating-gate non-volatile memories damaged by plasma treatment The process described requires the formation of floating-gate non-volatile memory cells entirely similar in structure to those produced by known processes. The process comprises an annealing treatment at relatively low temperature (430° C.) to repair dam... | 03/30/1999 |
| 5863598 | Method of forming doped silicon in high aspect ratio openings A method of forming a doped silicon film on a substrate. According to the present invention, a substrate is placed in a reaction chamber and heated. Next, a silicon containing gas is fed into the reaction chamber to produce a silicon containing gas partia... | 01/26/1999 |
| 5841171 | SOI Semiconductor devices In forming an element isolating region in a silicon semiconductor layer of an SOI substrate, a silicon nitride film of a predetermined thickness is deposited over an oxide film formed on a SOI layer. The silicon nitride film is patterned in a design size ... | 11/24/1998 |
| 5837556 | Method of removing a component from a substrate A method of removing a component bonded to a substrate utilizes a fixture having a bore therethrough which is aligned with a bore in the substrate. A screw is advanced in the bore in the fixture to cause a push pin to contact the component and force the c... | 11/17/1998 |
| 5834321 | Low noise address line repair method for thin film imager devices A method of repairing an open circuit defect in a damaged address line in a thin film electronic imager array is provided that includes the steps of forming a repair area exposing the open circuit defect and portions of the damaged address line adjoining ... | 11/10/1998 |
| 5817533 | High-yield methods of fabricating large substrate capacitors Described are methods of manufacturing large substrate capacitors for multi-chip module applications and the like using procedures compatible with common semiconductor fabrication procedures. A capacitor is formed where the top electrode thereof is divide... | 10/06/1998 |
| 5795797 | Method of making memory chips using memory tester providing fast repair A process for manufacturing semiconductor memories which includes a method of quickly and effectively identifying which faulty memory cells are to be replaced by redundant memory structures. Redundant rows and columns are assigned to replace rows and colu... | 08/18/1998 |
| 5788779 | Chemical cleaning method for a clutch friction liner support disc, a workstation for carrying out the method, and an installation including such a workstation for adhesively fastening friction liners on a support disc A motor vehicle clutch has a friction wheel which includes a support disc, on which friction liners are attached by adhesive bonding to selected zones of the opposed faces of the support disc. These zones are prepared for application of the adhesive by su... | 08/04/1998 |
| 5776826 | Crack stop formation for high-productivity processes A simplified crack stop formation compatible with shallow fuse etch processes which are utilized for modern low-cost redundancy designs using upper level metal fuses. A modified last level metallization (LLM) etch according to the invention allows a high-... | 07/07/1998 |
| 5757073 | Heatsink and package structure for wirebond chip rework and replacement A direct chip attach to heatsink structure is shown and described which implements rework when the chip must be removed and replaced. A laminated heatsink includes a metal heatsink with a foil layer adhered to the chip attachment surface with the assembly... | 05/26/1998 |
| 5741727 | Circuit modification and repair using a low resistance conducting metal bridge and a focused ion beam A fast economical method for modification or repair of micro-circuit wiring patterns covered by a dielectric using a conducting bridge and focused ion beam technology. A conducting bridge is formed on the dielectric between selected points of the wiring p... | 04/21/1998 |
| 5737041 | TFT, method of making and matrix displays incorporating the TFT Improved thin film transistors to reduce defects in the devices incorporating the transistors, including active matrix displays. A first improvement is accomplished by forming a dual insulator layer over the bottom metal layer, which can be the gate line ... | 04/07/1998 |
| 5736758 | Post-fabrication repair thin film imager structure A thin film electronic imager device has a repaired area between an upper conductive layer and an underlying component in the array in which portions of the upper conductive layer and a dielectric layer have been removed such that the upper conductive lay... | 04/07/1998 |
| 5700697 | Method for packaging an integrated circuit using a reconstructed package A reconstructed package for an integrated circuit (IC) chip and a method of re-configuring any prefabricated IC package (with or without a silicon chip and wires inside) so that an IC chip can be installed and interconnected for normal use. A pre-molded p... | 12/23/1997 |
| 5698464 | Method of manufacturing a semiconductor device with oxynitride layer A P-type silicon substrate is heated at about 800° C. in an O2 atmosphere containing HCl, thereby forming a silicon oxide film on the substrate. Then, X rays are applied from an X-ray source to the silicon oxide film, damaging the silicon oxid... | 12/16/1997 |
| 5696031 | Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board, having a surface on which flip-chip pads and wire-bondable ... | 12/09/1997 |
| 5672542 | Method of making solder balls by contained paste deposition A solder bump is stenciled onto a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than ... | 09/30/1997 |
| 5665638 | Method for repairing a defect generated cell using a laser The invention provides a method for repairing a defect-generated cell using a laser for disconnecting a defect-generated portion of a fuse conductive line in the fabricating process of semiconductor integrated circuits, characterized in that an insulation... | 09/09/1997 |
| 5656554 | Semiconductor chip reclamation technique involving multiple planarization processes A method for removing conductive metals on a semiconductor chip while leaving a foundation on which the conductive metal is in contact with substantially intact. The foundation includes a dielectric layer and a connecting stud. The dielectric layer is for... | 08/12/1997 |
| 5656521 | Method of erasing UPROM transistors The failure rate of semiconductor devices containing UPROM transistors is improved by erasing the UPROM transistors using X-rays. The semiconductor devices are subsequently exposed to UV radiation to erase other transistors charged during X-ray exposure.... | 08/12/1997 |
| 5648296 | Post-fabrication repair method for thin film imager devices A thin film electronic imager device has a repaired area between an upper conductive layer and an underlying component in the array in which portions of the upper conductive layer and a dielectric layer have been removed such that the upper conductive lay... | 07/15/1997 |
| 5626715 | Methods of polishing semiconductor substrates Methods of polishing, particularly chem-mech polishing a semiconductor substrate to planarize a layer, to remove excess material from atop a layer, and to strip back a defective layer are disclosed. Aluminum oxide particles having a small, well controlled... | 05/06/1997 |
| 5620915 | Method for bypassing null-code sections for read-only memory by access line control The ROM device comprises a number of memory cells each is constructed based on a MOS transistor, the memory cells in the ROM are arranged into a number of rows and a columns. A number of word lines each connects to the gates of each of the MOS transistors... | 04/15/1997 |
| 5616524 | Repair method for low noise metal lines in thin film imager devices A method of repairing an open circuit defect in a damaged address line in a thin film electronic imager device includes the steps of forming a repair area on the device so as to expose the open-circuit defect in the damaged address line and then depositin... | 04/01/1997 |
| 5602044 | Memory with on-chip detection of bit line leaks A circuit for the detection of current leaks on a bit line of a memory (such as an EPROM or flash EPROM), which includes a current generator and a means to apply zero volts to the gates of all the cells of the bit line. The detection information is delive... | 02/11/1997 |
| 5601675 | Reworkable electronic apparatus having a fusible layer for adhesively attached components, and method therefor An electronics device has unpackaged chips or other small components mounted on a carrier and wire-bonded to carrier wiring traces. The rear chip faces have a layer of adhesive which overlies a layer of solder or other fusible material, and which adheres ... | 02/11/1997 |
| 5595935 | Method for forming interconnect in integrated circuits A structure and method for fabricating intergrated circuit which provides for the detection of residual conductive material. A first conductive layer is deposited over the intergrated circuit and patterned to define a first interconnect layer. An insulati... | 01/21/1997 |
| 5567654 | Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging A fabrication method and resultant monolithic electronic module having a separately formed thin-film layer attached to a side surface. The fabrication method includes providing an electronic module composed of stacked integrated circuit chips. A thin-film... | 10/22/1996 |
| 5550083 | Process of wirebond pad repair and reuse A wire bonding method comprising the steps of (a) disconnecting a first wire which is bonded on a first pad which is provided on a substrate, (b) forming a second pad on the first pad, and (c) bonding a second wire on the second pad, so that the second wi... | 08/27/1996 |
| 5532853 | Reparable display device matrix for repairing the electrical connection of a bonding pad to its associated signal line A display device matrix comprising a plurality of aluminum scanning line electrodes and a plurality of associated chromium bonding pads, wherein each scanning line electrode has an associated repairing conductive layer which can connected the scanning lin... | 07/02/1996 |
| 5525528 | Ferroelectric capacitor renewal method Ferroelectric capacitors in an integrated memory are renewed to improve retention performance. The renewal method is performed on a wafer containing ferroelectric memory die. In one method, a rejuvenation anneal is performed after all electrical tests, in... | 06/11/1996 |
| 5518956 | Method of isolating vertical shorts in an electronic array using laser ablation A process for repairing an electronic army wafer assembly having a short circuit between two non-insulative layers separated by a dielectric layer includes the step of selectively ablating one of the non-insulative layers so as to electrically isolate the... | 05/21/1996 |
| 5514628 | Two-step sinter method utilized in conjunction with memory cell replacement by redundancies A process is disclosed herein for increasing yield in a semiconductor circuity having redundant circuitry for replacing defective normal circuitry in the semiconductor integrated circuit. In the first step, an insufficient sinter operation (50) is carried... | 05/07/1996 |
| 5502001 | Method of forming light beam and method of fabricating semiconductor integrated circuits Technology for forming a fine light beam having a size smaller than the theoretical limit determined by the wavelength of light and characteristics of an objective lens. A beam distribution shifter having two light transmission regions is disposed between... | 03/26/1996 |
| 5480812 | Address line repair structure and method for thin film imager devices A method for repairing address lines in a thin film imager device includes the steps of removing non-conductive material from a selected repair area so as to expose an open circuit defect in a first conductive component and portions of the first conductiv... | 01/02/1996 |
| 5476818 | Semiconductor structure and method of manufacture A semiconductor structure (8) comprising a semiconductor chip support structure (9), a circuit board substrate (40) with circuit board substrate probes (36) extending therefrom and a method for fabricating the semiconductor structure (8). The semiconducto... | 12/19/1995 |
