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| Number | Title | Issue Date |
| 4725558 | Semiconductor defects curing method and apparatus An improved semiconductor defects curing method and apparatus are disclosed which is free from current leakage due to pin-holes or other defects. Also an improved method for processing a semiconductor device is shown. According to the invention, the gaps ... | 02/16/1988 |
| 4680616 | Removal of defects from semiconductors Removal of defects from semiconductors by applying a reverse bias potential to the semiconductors and irradiating the semiconductors with photon energy greater than their bangap energies.... | 07/14/1987 |
| 4567643 | Method of replacing an electronic component connected to conducting tracks on a support substrate The subject matter of the invention is a method of substituting an electronic component (A1) for an analogous component (1) connected to the conductive tracks (3) of a support substrate (2) by connection wires (4). The conductive tracks are cut beyond, re... | 02/04/1986 |
| 4543171 | Method for eliminating defects in a photodetector The performance of a photodetector is reduced by the presence of an electrical defect such as a short or a shunt. The invention is a method of improving the performance of this photodetector by preferentially removing a portion of an exposed surface of a ... | 09/24/1985 |
| 4510674 | System for eliminating short circuit current paths in photovoltaic devices Systems and methods for detecting and eliminating short circuit current paths through photovoltaic devices of the type including at least one semiconductor region overlying a substrate and a layer of conductive light transmissive material overlying the at... | 04/16/1985 |
| 4510675 | System for eliminating short and latent short circuit current paths in photovoltaic devices Systems and methods for detecting and eliminating latent and existing short circuit current paths through photovoltaic devices of the type including at least one semiconductor region overlying a substrate and a layer of conductive light transmissive mater... | 04/16/1985 |
| 4489479 | Method for repair of buried contacts in MOSFET devices Contacts between polysilicon conductors on the surface of a silicon wafer and doped regions underlying them in the wafer, rendered defective by the growth of a thin intervening oxide layer between conductors and diffusions, are repaired by depositing dots... | 12/25/1984 |
| 4488349 | Method of repairing shorts in parallel connected vertical semiconductor devices by selective anodization A method of repairing shorts in parallel connected vertical semiconductor devices including a plurality of parallel-connected transistors comprises an anodizing step, before the electrodes are formed, in addition to the conventional manufacturing steps. S... | 12/18/1984 |
| 4466992 | Healing pinhole defects in amorphous silicon films A method for healing physical defects in semiconductive films is described. A transparent substrate and semiconductive film are passed to a vacuum chamber in which the film layer is contacted with an activating vapor such as mercury and a depositing vapor... | 08/21/1984 |
| 4420497 | Method of detecting and repairing latent defects in a semiconductor dielectric layer Defects in dielectric layers exhibiting low dielectric strength on silicon substrates (11) are deliberately damaged during manufacture to allow their repair by the formation of dielectric plugs (13B). The defects are damaged by the application of an elect... | 12/13/1983 |
| 4415606 | Method of reworking upper metal in multilayer metal integrated circuits A process for reworking the upper level metal layer of an integrated circuit wafer having multiple levels of metal connected by vias through intermediate dielectric layers. In one form, a photoresist masking layer is first formed over the defective upper ... | 11/15/1983 |
| 4395293 | Accelerated annealing of gallium arsenide solar cells A method is provided for accelerating and improving the recovery of GaAs solar cells from the damage which they experience in space under high energy particle irradiation scuh as electrons, protons and neutrons. The method comprises combining thermal anne... | 07/26/1983 |
| 4341011 | Method of manufacturing semiconductor device A method of manufacturing a semiconductor device comprising preparing a semiconductor substrate which includes at least three semiconductor layers of alternately different conductivity types and in which one of the semiconductor layers is divided into a p... | 07/27/1982 |
| 4259367 | Fine line repair technique Repair of opens and shorts in semiconductor packages and chip metallurgy by initial conversion of shorts into opens by severing of lines about the shorts, followed by interconnection of conductor patch lines to the good circuit portions through an insulat... | 03/31/1981 |
| 4255229 | Method of reworking PROMS PROM wafers having fuses on raised oxide are reworked by stripping the fuses and connectors, non-selectively etching the oxide layer to form a substantially planar, oxide surface resulting from the differential etching rate of the heavily phosphorus doped... | 03/10/1981 |
| 4189825 | Integrated test and assembly device A semiconductor integrated circuit device of the beam lead type having a semiconductor interconnection substrate with apertures for integrated circuit chips therein and with metallization patterns having sharply pointed ends for penetrating oxide layers o... | 02/26/1980 |
| 4157486 | Electroluminescent display and circuit protective device and method of making An electroluminescent display device includes at least two conductive leads spaced from each other with a light-emitting element electrically coupled between such leads. A transparent, insulating base is formed about and between the leads. The base encaps... | 06/05/1979 |
| 4131472 | Method for increasing the yield of batch processed microcircuit semiconductor devices An improvement in the process of manufacturing integrated circuits to enhance the yield, including the steps of tracking which of the individual dies on a photomask or related series of photomasks has produced a predominance of defective chips on the semi... | 12/26/1978 |
| 4062102 | Process for manufacturing a solar cell from a reject semiconductor wafer A process for manufacturing a solar cell from a reject semiconductor wafer comprising stripping all external layers from the wafer, etching the surfaces of the wafer so as to effectively remove all P/N junctions without pitting the wafer surface, introduc... | 12/13/1977 |
| 4061506 | Correcting doping defects A semiconductive device and a method for producing the semiconductive device, wherein random defects or inaccuracies in precise registrations of certain patterns are compensated by the introduction of selected impurities. The selected impurities bring abo... | 12/06/1977 |
| 4012832 | Method for non-destructive removal of semiconductor devices Semiconductor devices having a conductive lead pattern on the bottom of the device are bonded to conductive pads on a substrate to form an electrical connection therewith. The connection comprises two layers of conductive adhesive plastic separated by a s... | 03/22/1977 |
| 4013485 | Process for eliminating undesirable charge centers in MIS devices The electrical properties of MIS semiconductor devices, which have been damaged by radiation, are restored by treating the devices in a properly oriented RF field at low pressure.... | 03/22/1977 |
| 4009299 | Tin strip formulation for metal to glass seal diodes Immersion of semiconductor devices, particularly diodes, having a defective tin plating thereon in a solution of 5 - 20 percent by weight trichloroacetic acid, 0.1 to 5 percent by weight of a compound selected from the group consisting of cationic, anioni... | 02/22/1977 |
| 3993934 | Integrated circuit structure having a plurality of separable circuits A method for determining whether an integrated circuit chip containing a plurality of separable circuits is operable when one or more of the separable circuits is not functional. A chip including a plurality of discrete or separable circuits, each of whic... | 11/23/1976 |
| 3984860 | Multi-function LSI wafers A system that is to be placed on a wafer is partitioned into reasonably large functions, each provided with a set of I/O and power pads. The wafer design is called "design A"0 A second wafer design (design B) that is the mirror image of design A is also c... | 10/05/1976 |
| 3969813 | Method and apparatus for removal of semiconductor chips from hybrid circuits A method and apparatus are disclosed for removal of defective semiconductor chips from hybrid integrated circuits. The apparatus includes a jet nozzle which directs at least four high pressure water jet streams to the area surrounding the defective chip. ... | 07/20/1976 |
| 3955168 | Rejuvenation method for varistors A method of rejuvenating polycrystalline metal oxide varistors whose performance characteristics may have been degraded by prolonged voltage stress is disclosed. The method includes removing voltage stress from the varistors and heating the varistors.... | 05/04/1976 |
