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| Number | Title | Issue Date |
| 8187896 | Online gaming system for simulating a baseball game An online gaming system for simulating a baseball game comprising: a server with a processor, a network in communication with the server, at least one client device in communication with the network, wherein the at least one client device has an input device, a disp... | 05/29/2012 |
| 8101432 | Method of repairing an image display unit A method of repairing a defective one of devices mounted on substrate is provided. Devices are arrayed on a substrate and electrically connected to wiring lines connected to a drive circuit, to be thus mounted on the substrate. The devices mounted on the substrate a... | 01/24/2012 |
| 8048687 | Processing method for recovering a damaged low-k film of a substrate and storage medium There is provided a processing method for performing a recovery process on a damaged layer formed on a surface of a low-k film of a target substrate by introducing a processing gas containing a methyl group into a processing chamber. The method includes: increasing ... | 11/01/2011 |
| 8034638 | Treatment of low K films with a silylating agent for damage repair The present invention provides methods of repairing damage to low-k dielectric film that is incurred by commonly used processes in IC fabrication. The methods may be integrated into an IC fabrication process flow at various stages. According to various embodiments, ... | 10/11/2011 |
| 8034639 | Method for manufacturing solar cell module Disclosed is a method for manufacturing a solar cell module in which a wiring substrate having a base material and a wiring formed on the base material, and a plurality of solar cells electrically connected by being placed on the wiring of the wiring substrates are ... | 10/11/2011 |
| 7981699 | Method for tunably repairing low-k dielectric damage A method for providing a tuned repair for damage to a silicon based low-k dielectric layer with organic compounds, where damage replaces a methyl attached to silicon with a hydroxyl attached to silicon is provided. A precursor gas is provided, comprising a first rep... | 07/19/2011 |
| 7981698 | Removal of integrated circuits from packages Packaging is substantially entirely removed from an integrated circuit die. The method allows the batch processing of several integrated circuit dies, such that packaging is removed from each die approximately simultaneously. ... | 07/19/2011 |
| 7977121 | Method and composition for restoring dielectric properties of porous dielectric materials The present invention provides a method for restoring the dielectric properties of a porous dielectric material. The method comprises providing a substrate comprising at least one layer of a porous dielectric material comprising a contaminant comprising at least one... | 07/12/2011 |
| 7964416 | Manufacturing method of organic EL display Provided is a method of manufacturing an organic EL display which includes a substrate having a TFT therein and a plurality of organic EL elements disposed on the substrate, each of the organic EL elements having a first electrode disposed on the substrate, an organ... | 06/21/2011 |
| 7955873 | Method of fabricating a semiconductor device A method of fabricating a semiconductor device is disclosed. In one embodiment, the method includes providing at least one semiconductor chip including an electrically conductive layer. A voltage is applied to an electrode. The electrode is moved over the electrical... | 06/07/2011 |
| 7943400 | Integrated circuit device with electronically accessible device identifier An semiconductor device having a plurality of fabrication layers. A first region of a first fabrication layer of the semiconductor device is revised. To signal the revision, a connectivity structure in a second region of the first fabrication layer is omitted to int... | 05/17/2011 |
| 7935544 | Method of manufacturing organic light-emitting device The present invention provides a method of manufacturing an organic light-emitting device which is applicable to a large-screen display device. The method includes the steps of: forming, over a drive substrate, an element region including a drive transistor, and an ... | 05/03/2011 |
| 7901951 | Thin film transistor array substrate and method for fabricating same An exemplary TFT array substrate includes: an insulating substrate (201), a gate line (23) and a repair structure (272) arranged on the insulating substrate, a gate insulating layer (204) covering the gate line and the repair structure; a... | 03/08/2011 |
| 7867789 | Contact clean by remote plasma and repair of silicide surface Method for recovering treated metal silicide surfaces or layers are provided. In at least one embodiment, a substrate having an at least partially oxidized metal silicide surface disposed thereon is cleaned to remove the oxidized regions to provide an altered metal ... | 01/11/2011 |
| 7851232 | UV treatment for carbon-containing low-k dielectric repair in semiconductor processing A method for the ultraviolet (UV) treatment of carbon-containing low-k dielectric enables process-induced damage repair. The method is particularly applicable in the context of damascene processing. A method provides for forming a semiconductor device by depositing ... | 12/14/2010 |
| 7842518 | Method for fabricating semiconductor device A method for fabricating a semiconductor device, includes forming a porous dielectric film above a substrate using a porous insulating material, forming an opening in the porous dielectric film, repairing film quality of the porous dielectric film on a surface of th... | 11/30/2010 |
| 7824929 | Method for producing group III nitride-based compound semiconductor An object of the present invention is to remove micro-scratches on a surface of a GaN substrate cut from a GaN ingot. The invention is directed to establish a method for surface treatment of a GaN substrate, including heating the surface in an atmosphere containing ... | 11/02/2010 |
| 7790477 | Apparatus and method for cleaning glass substrates using a cool hydrogen flame Contaminants from surfaces of temperature sensitive substrates, such as glass substrates are removed by exposing the surfaces to a hydrogen Surface-mixed diffusion flame for a predetermined duration of time. The predetermined duration of time being insufficient to h... | 09/07/2010 |
| 7781232 | Method to recover underfilled modules by selective removal of discrete components Methods and reworked intermediate and resultant electronic modules made thereby, whereby a component in need of rework is located and removed from the module to reveal encapsulated solder connections residing within an underfill matrix. Heights of both the solder co... | 08/24/2010 |
| 7776624 | Method for improving semiconductor surfaces A semiconductor fabrication method. The method includes providing a semiconductor substrate, wherein the semiconductor substrate includes a semiconductor material. Next, a top portion of the semiconductor substrate is removed. Next, a first semiconductor layer is ep... | 08/17/2010 |
| 7745234 | Method for reclaiming semiconductor package A method of forming a semiconductor card. A semiconductor package having a damaged controller die is reclaimed. The reclaim process includes severing the electrical connections between the controller die and the semiconductor package substrate without exposing the p... | 06/29/2010 |
| 7732224 | Metal line pattern of semiconductor device and method of forming the same A method of forming a metal line pattern for a semiconductor device is provided. The method includes forming a preliminary structure on a semiconductor substrate, having a lower barrier metal layer, a metal layer, and an upper barrier and/or passivation layer having... | 06/08/2010 |
| 7727779 | Method of fabricating and/or repairing a light emitting device A method of repairing a light emitting device which makes high quality image display possible even if a pin hole is formed during formation of an EL layer is provided. The method of repairing a light emitting device is characterized in that a reverse bias voltage is... | 06/01/2010 |
| 7695982 | Refurbishing a wafer having a low-k dielectric layer A wafer comprising a low-k dielectric layer is refurbished for reuse. Initially, a removable layer is provided on the wafer. The low-k dielectric layer is formed over the removable layer. The overlying low-k dielectric layer is removed from the wafer by etching away... | 04/13/2010 |
| 7670856 | Nitride semiconductor substrate and method of making same A method of making a nitride semiconductor substrate having the steps of providing a free-standing substrate that is of a nitride semiconductor and has one of a penetrating pit and a penetrating crack that penetrate from a top surface to a back surface of the free-s... | 03/02/2010 |
| 7666690 | System, apparatus and method of selective laser repair for metal bumps of semiconductor device stack Exemplary embodiments of the selective laser repair apparatus and method may allow the repair of metal bumps in a semiconductor device stack by applying a laser beam to a damaged and/or defective bump. Metal bumps may be repaired and individual chips and/or packages... | 02/23/2010 |
| 7666689 | Method to remove circuit patterns from a wafer A method holds wafers that contain patterned structures using a particle blasting tool. Next, the method directs particles at the patterned structures, such that the particles contact the patterned structures with a predetermined velocity and remove the patterned st... | 02/23/2010 |
| 7662645 | Reworked integrated circuit device and reworking method thereof Reworking method for removing defects on integrated circuit device is disclosed. An integrated circuit is provided, which has a substrate, a conductive material layer formed in the substrate, a dielectric layer formed on the substrate, at least a contact plug embedd... | 02/16/2010 |
| 7648846 | Active matrix substrate and repairing method thereof An active matrix substrate including a substrate, a plurality of pixel units, a plurality of driving lines, an electron static discharge (ESD) protection circuit and a floating line is provided. The substrate has an active region and a peripheral region connected wi... | 01/19/2010 |
| 7556970 | Method of repairing damaged film having low dielectric constant, semiconductor device fabricating system and storage medium A damaged layer repairing method repairs a damaged layer formed in a surface of a SiOCH film having a low dielectric constant film, containing silicon, carbon, oxygen and hydrogen and formed on a substrate through the elimination of carbon atoms by the decarbonizing... | 07/07/2009 |
| 7547560 | Defect identification system and method for repairing killer defects in semiconductor devices A method for improving semiconductor yield by in-line repair of defects during manufacturing comprises inspecting dies on a wafer after a selected layer is formed on the dies, identifying defects in each of the dies, classifying the identified defects as killer or n... | 06/16/2009 |
| 7544520 | Method for the application of a protective coating to a thermally stressed component A method for applying a heat insulation layer (11, 12, 13) or a metallic protective layer to a thermally stressed component (200) having a basic material (10) in order to eliminate local damage (14) or an untreated place in the coating, i... | 06/09/2009 |
| 7541200 | Treatment of low k films with a silylating agent for damage repair The present invention provides methods of repairing damage to low-k dielectric film that is incurred by commonly used processes in IC fabrication. The methods may be integrated into an IC fabrication process flow at various stages. According to various embodiments, ... | 06/02/2009 |
| 7507590 | Method of manufacturing array substrate and method of manufacturing organic EL display device The size of a foreign substance which is present between a cathode and an anode and which contributes to a short circuit therebetween is measured. On the basis of the measured size, the wavelength of a laser beam with which the foreign substance is irradiated is set... | 03/24/2009 |
| 7504267 | Apparatus and method for cleaning glass substrates using a cool hydrogen flame Contaminants from surfaces of temperature sensitive substrates, such as glass substrates are removed by exposing the surfaces to a hydrogen Surface-mixed diffusion flame for a predetermined duration of time. The predetermined duration of time being insufficient to h... | 03/17/2009 |
| 7476552 | Method of reworking a semiconductor structure The present invention allows correcting malfunctions occurring in the formation of a cap layer on an electrical element in a semiconductor substrate. It is detected whether a malfunction occurred in the formation of the cap layer. If a malfunction in the formation o... | 01/13/2009 |
| 7470553 | Built-in design edit structures In an IC structure and method for debugging or adjusting the parameters of an IC circuitry, edit structures are formed in the IC device and are connected to desired portions of the IC circuitry buy forming vias through the passivation layer overlying the top metal l... | 12/30/2008 |
| 7449347 | Repairing method of a thin film transistor array A repairing method of thin film transistor array is provided. The repairing method of thin film transistor array can remove a residue between pixel electrodes so as to prevent the residue from electrically connecting pixel electrodes adjacent to each other. The repa... | 11/11/2008 |
| 7445944 | Packaging substrate and manufacturing method thereof A packaging substrate and a manufacturing method thereof are provided. The manufacturing method includes following steps. First, a first packaging substrate including several first substrate units and at least one defected substrate unit is provided. Next, the defec... | 11/04/2008 |
| 7431624 | Method of manufacturing organic EL element A method of manufacturing an organic EL element includes applying a reverse bias to an organic EL element with an inverse layered structure until a current density of the organic EL element at an impressed voltage of 10 V reaches 0.075 mA/cm2 or more.... | 10/07/2008 |
