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Neuroimaging as a Marketing Tool
Neuroimaging as a means for validating whether a stimulus such as advertisement, communication, or product evokes a certain mental response such as emotion, preference, or memory, or to predict the consequences of the stimulus on later behavior such as consumption or purchasing.
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| Number | Title | Issue Date |
| 8178372 | Method for production of a plurality of semiconductor chips, and a semiconductor component A method for production of a plurality of semiconductor chips (6) in a wafer composite. A semiconductor layer sequence (2) is grown on a growth substrate (1), metallization (3) is applied to the semiconductor layer sequence (2), a ... | 05/15/2012 |
| 8143080 | Method for manufacturing LED package and substrate thereof A method for manufacturing a number of LED packages includes following steps: providing an electrode plate and at least one insulating plate; thermally pressing the electrode plate and the at least insulating plate together, wherein the electrode has a plurality of ... | 03/27/2012 |
| 8133748 | EL display device and method of manufacturing the same To provide a high throughput film deposition means for film depositing an organic EL material made of polymer accurately and without any positional shift. A pixel portion is divided into a plurality of pixel rows by a bank, and a head portion of a thin film depositi... | 03/13/2012 |
| 8053260 | Large-area lighting systems and methods of making the same Large-Area lighting systems and methods of making the same. More specifically, groups of organic light emitting modules, such as organic light emitting diode modules, coupled in series with respect to on another are provided. The modules cathode of each organic ligh... | 11/08/2011 |
| 8048696 | Light emitting diode devices and manufacturing method thereof A light emitting diode (LED) device includes a stacked epitaxial structure, a heat-conductive plate and a seed layer. The stacked epitaxial structure sequentially includes a first semiconductor layer (N—GaN), a light emitting layer, and a second semiconductor laye... | 11/01/2011 |
| 8043876 | Light emitting diode package and manufacturing method thereof Disclosed are a light emitting diode package and a manufacturing method thereof. According to an embodiment of the present invention, the method includes: manufacturing a package main body having a plurality of cavities, the cavities being formed in a line on one su... | 10/25/2011 |
| 8039279 | Method for making a light emitting diode by electroless plating One embodiment of the invention relates to a method of manufacturing a light emitting diode. The method includes forming an insulating layer on an area, not covered by a seed layer, of at least one of a p-type semiconductor layer and an n-type semiconductor layer, w... | 10/18/2011 |
| 7951626 | Light emitting device and method of manufacturing the same The present invention relates to a light emitting device and a method of manufacturing the light emitting device. According to the present invention, the light emitting device comprises a substrate, an N-type semiconductor layer formed on the substrate, and a P-type... | 05/31/2011 |
| 7947517 | Method of manufacturing semiconductor light-emitting device Semiconductor laser elements are formed on a common substrate. Au plating is formed on principal surfaces of the semiconductor laser elements. The semiconductor laser elements are mounted on a package with solder applied to the Au plating. Areas opposed to each othe... | 05/24/2011 |
| 7939350 | Method for encapsulating a substrate and method for fabricating a light emitting diode device The present invention relates to a method for encapsulating a substrate, which comprises: (a1) providing a substrate with a plurality of chips mounted on a top of the substrate; (b1) compressing a dry film photores... | 05/10/2011 |
| 7923272 | Method of forming a resin cover lens of LED assembly A method of forming the resin cover lens of LED assembly uses transparent materials, such as plastics, PP (Polypropylene), PET (Polyethylene teraphthalate), PC (Polycarbonate), PE (Polyethylene) or glass to produce the mold for making lens; and uses liquid transpare... | 04/12/2011 |
| 7919339 | Packaging method for light emitting diode module that includes fabricating frame around substrate A packaging method for light emitting diode module that includes fabricating frame around substrate, wherein the method comprises the steps of: fabricating a printed circuit layer with a plurality of staggered nodes on a substrate; fabricating a frame around the sub... | 04/05/2011 |
| 7871836 | Method of manufacturing bendable solid state lighting The invention provides a method of manufacturing a bendable solid state lighting (SSL). A first metal layer and a second metal layer with a predetermined circuit layout pattern and structure region pattern are first deposited on both sides of a flexible substrate re... | 01/18/2011 |
| 7867795 | Manufacturing method of light emitting diode apparatus A manufacturing method of a light emitting diode (LED) apparatus includes the steps of: forming at least one temporary substrate, which is made by a curable material, on a LED device; and forming at least a thermal-conductive substrate on the LED device. The manufac... | 01/11/2011 |
| 7811843 | Method of manufacturing light-emitting diode A method of manufacturing an LED includes the following steps: preparing an LED wafer including a substrate and an epitaxial layer formed on the substrate; cutting the epitaxial layer of the LED wafer into a plurality of LED dies with a gap defined between every two... | 10/12/2010 |
| 7799586 | Semiconductor light emitting devices including a luminescent conversion element and methods for packaging the same Methods of packaging a semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device. The first quantity of encapsulant material in the cavity is treated to form a hardened upper sur... | 09/21/2010 |
| 7745241 | Method of making light emitting diodes A method of making a plurality of light emitting diodes simultaneously includes steps of: a) providing a wafer and a first bonding layer, and adhering the first bonding layer to a bottom side of the wafer; b) cutting the wafer to form a plurality of LED dies on the ... | 06/29/2010 |
| 7732233 | Method for making light emitting diode chip package The LED chip package of the present invention uses a semiconductor substrate as package substrate, which improves heat dissipation. Also, the LED chip package is incorporated with a planarization structure, which renders the LED chip and the substrate a substantiall... | 06/08/2010 |
| 7704762 | Lamp and method of producing a lamp A method of producing a lamp, including: mounting light emitting junctions in respective receptacles; mounting the receptacles on a curved support structure so as to form a three-dimensional array; and placing the light emitting junctions in electrical connection wi... | 04/27/2010 |
| 7682853 | Transparent member, optical device using transparent member and method of manufacturing optical device In a method of manufacturing an optical device, a whole substrate is first prepared which has a plurality of regions corresponding to substrates constituting a plurality of optical devices, respectively. A plurality of chips are then mounted to the plurality of regi... | 03/23/2010 |
| 7629188 | Flip chip type LED lighting device manufacturing method A flip chip type LED lighting device manufacturing method includes the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cut... | 12/08/2009 |
| 7618834 | Method of manufacturing image sensor Embodiments relate to a method of manufacturing an image sensor which includes forming a plurality of lower layers over a semiconductor substrate. A first passivation layer may be formed over the lower layers to protect the lower layers. The first passivation layer ... | 11/17/2009 |
| 7588952 | Method of fabricating vertical structure LEDs A method of fabricating semiconductor devices, such as GaN LEDs, on insulating substrates, such as sapphire. Semiconductor layers are produced on the insulating substrate using normal semiconductor processing techniques. Trenches that define the boundaries of the in... | 09/15/2009 |
| 7544525 | AllnGaP LED having reduced temperature dependence To increase the lattice constant of AlInGaP LED layers to greater than the lattice constant of GaAs for reduced temperature sensitivity, an engineered growth layer is formed over a substrate, where the growth layer has a lattice constant equal to or approximately eq... | 06/09/2009 |
| 7514279 | Optoelectronic component and method for producing it An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the effici... | 04/07/2009 |
| 7514280 | Method for packaging organic light emitting display with frit seal and reinforcing structure Disclosed is a method for packaging an organic light emitting display having a reinforcing member between a first substrate and a second substrate by rolling a roll retaining a curable material on non-pixel regions of unit display panels. Organic light emitting pixe... | 04/07/2009 |
| 7498186 | Method for packaging organic light emitting display with frit seal and reinforcing structure Disclosed is a method for packaging an organic light emitting display having a reinforcing member formed between a first substrate and a second substrate by dipping non-pixel regions of unit display panels in a liquid curable material. Organic light emitting pixel a... | 03/03/2009 |
| 7443895 | Modular diode laser assembly An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individua... | 10/28/2008 |
| 7436868 | Modular diode laser assembly An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individua... | 10/14/2008 |
| 7429750 | Solid-state element and solid-state element device A solid-state element has: a semiconductor layer formed on a substrate, the semiconductor layer having a first layer that corresponds to an emission area of the solid-state element to and a second layer through which current is supplied to the first layer; a light d... | 09/30/2008 |
| 7420996 | Modular diode laser assembly An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individua... | 09/02/2008 |
| 7413916 | Light-emitting device and manufacturing method thereof A light emitting element having a superior light emitting characteristic is provided by forming a region partly including a phosphor (light emitting region) in manufacturing of a light emitting element having an organic compound layer using a high molecular weight m... | 08/19/2008 |
| 7414269 | Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component The invention proposes a housing for at least two radiation-emitting components, particularly LEDs, comprising a system carrier (1) and a reflector arrangement (2) disposed on said system carrier (1), the reflector arrangement comprising a numbe... | 08/19/2008 |
| 7405094 | Light emitting devices for light conversion and methods and semiconductor chips for fabricating the same Broad spectrum light emitting devices and methods and semiconductor chips for fabricating such devices include a light emitting element, such as a diode or laser, which emits light in a predefined range of frequencies. The light emitting element includes a shaped su... | 07/29/2008 |
| 7402446 | Method of manufacturing an electroluminescence device A semiconductor device is provided. The semiconductor device includes an element; a mounting board; and a single film made of a conductive material directly coupling the element with the mounting board. ... | 07/22/2008 |
| 7399657 | Ball grid array packages with thermally conductive containers Ball grid array packages for semiconductor die include a thermally conductive container and a substrate that substantially enclose a semiconductor die. The die is positioned with respect to the container by thermally conductive supports formed in the container or at... | 07/15/2008 |
| 7393704 | Electroluminescent devices An electroluminescent device comprising: a first charge carrier injecting layer for injecting positive charge carriers; a second charge carrier injecting layer for injecting negative charge carriers; and a light-emissive layer located between the charge carrier inje... | 07/01/2008 |
| 7374959 | Two-wavelength semiconductor laser device and method of manufacturing the same A two-wavelength semiconductor laser device includes a first conductive material substrate having thereon first and second regions separated from each other. A first semiconductor laser diode is formed on the first region. A non-active layer is formed on the second ... | 05/20/2008 |
| 7371594 | Nitride semiconductor device and method for fabricating the same that minimizes cracking The present invention relates to a nitride semiconductor device and a method for fabricating the same. According to the present invention, there is an advantage in that trenches isolating respective nitride semiconductor unit devices from one another are filled with... | 05/13/2008 |
| 7368754 | Semiconductor integrated circuit, signal transmitting device, electro-optical device, and electronic apparatus The invention provides a semiconductor integrated circuit which allows a plurality of devices to be integrated compactly, that is, with high density; a signal transmitting device; an electro-optical device; and an electronic apparatus. A semiconductor integrated cir... | 05/06/2008 |
